JPS6441141U - - Google Patents
Info
- Publication number
- JPS6441141U JPS6441141U JP13734187U JP13734187U JPS6441141U JP S6441141 U JPS6441141 U JP S6441141U JP 13734187 U JP13734187 U JP 13734187U JP 13734187 U JP13734187 U JP 13734187U JP S6441141 U JPS6441141 U JP S6441141U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- wiring board
- flexible wiring
- semiconductor chip
- reinforcing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/754—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13734187U JPS6441141U (enExample) | 1987-09-07 | 1987-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13734187U JPS6441141U (enExample) | 1987-09-07 | 1987-09-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6441141U true JPS6441141U (enExample) | 1989-03-13 |
Family
ID=31398677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13734187U Pending JPS6441141U (enExample) | 1987-09-07 | 1987-09-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6441141U (enExample) |
-
1987
- 1987-09-07 JP JP13734187U patent/JPS6441141U/ja active Pending