JPH01121953U - - Google Patents
Info
- Publication number
- JPH01121953U JPH01121953U JP1988017214U JP1721488U JPH01121953U JP H01121953 U JPH01121953 U JP H01121953U JP 1988017214 U JP1988017214 U JP 1988017214U JP 1721488 U JP1721488 U JP 1721488U JP H01121953 U JPH01121953 U JP H01121953U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- transparent
- semiconductor device
- sealing material
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/754—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988017214U JPH01121953U (enExample) | 1988-02-10 | 1988-02-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988017214U JPH01121953U (enExample) | 1988-02-10 | 1988-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01121953U true JPH01121953U (enExample) | 1989-08-18 |
Family
ID=31230796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988017214U Pending JPH01121953U (enExample) | 1988-02-10 | 1988-02-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01121953U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001185657A (ja) * | 1999-12-10 | 2001-07-06 | Amkor Technology Korea Inc | 半導体パッケージ及びその製造方法 |
-
1988
- 1988-02-10 JP JP1988017214U patent/JPH01121953U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001185657A (ja) * | 1999-12-10 | 2001-07-06 | Amkor Technology Korea Inc | 半導体パッケージ及びその製造方法 |