JPH01167055U - - Google Patents

Info

Publication number
JPH01167055U
JPH01167055U JP1988064570U JP6457088U JPH01167055U JP H01167055 U JPH01167055 U JP H01167055U JP 1988064570 U JP1988064570 U JP 1988064570U JP 6457088 U JP6457088 U JP 6457088U JP H01167055 U JPH01167055 U JP H01167055U
Authority
JP
Japan
Prior art keywords
board
adhesive
adhered
water
chip component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988064570U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988064570U priority Critical patent/JPH01167055U/ja
Publication of JPH01167055U publication Critical patent/JPH01167055U/ja
Priority to US07/895,260 priority patent/US5253010A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP1988064570U 1988-05-13 1988-05-16 Pending JPH01167055U (enExample)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1988064570U JPH01167055U (enExample) 1988-05-16 1988-05-16
US07/895,260 US5253010A (en) 1988-05-13 1992-06-08 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988064570U JPH01167055U (enExample) 1988-05-16 1988-05-16

Publications (1)

Publication Number Publication Date
JPH01167055U true JPH01167055U (enExample) 1989-11-22

Family

ID=31290036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988064570U Pending JPH01167055U (enExample) 1988-05-13 1988-05-16

Country Status (1)

Country Link
JP (1) JPH01167055U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024132736A (ja) * 2023-03-17 2024-10-01 株式会社東芝 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024132736A (ja) * 2023-03-17 2024-10-01 株式会社東芝 半導体装置

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