JPH01167055U - - Google Patents

Info

Publication number
JPH01167055U
JPH01167055U JP6457088U JP6457088U JPH01167055U JP H01167055 U JPH01167055 U JP H01167055U JP 6457088 U JP6457088 U JP 6457088U JP 6457088 U JP6457088 U JP 6457088U JP H01167055 U JPH01167055 U JP H01167055U
Authority
JP
Japan
Prior art keywords
board
adhesive
adhered
water
chip component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6457088U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6457088U priority Critical patent/JPH01167055U/ja
Publication of JPH01167055U publication Critical patent/JPH01167055U/ja
Priority to US07/895,260 priority patent/US5253010A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
図面は本考案に係るチツプ部品の実装構造の実
施例を示し、第１図はチツプ部品をフレキシブル
基板に取り付けている状態での縦断側面図、第２
図はチツプ部品をフレキシブル基板に取り付けて
いる状態での平面図、第３図は別実施例における
縦断側面図、第４図は第１従来例における縦断側
面図、第５図は第２従来例における縦断側面図で
ある。 １……基板、２……チツプ部品、３……枠体、
４……撥水性接着剤、５……封止樹脂、９……接
着剤。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板上のチツプ部品の外側を囲む枠体を、それ
    の全周において基板に撥水性接着剤で接着し、且
    つ、前記撥水性接着剤より外側の枠体部分を基板
    に接着剤で接着すると共に、枠体の内側にチツプ
    部品に対する封止樹脂を充填してあるチツプ部品
    の実装構造。
JP6457088U 1988-05-13 1988-05-16 Pending JPH01167055U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP6457088U JPH01167055U (ja) 1988-05-16 1988-05-16
US07/895,260 US5253010A (en) 1988-05-13 1992-06-08 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6457088U JPH01167055U (ja) 1988-05-16 1988-05-16

Publications (1)

Publication Number Publication Date
JPH01167055U true JPH01167055U (ja) 1989-11-22

Family

ID=31290036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6457088U Pending JPH01167055U (ja) 1988-05-13 1988-05-16

Country Status (1)

Country Link
JP (1) JPH01167055U (ja)

Similar Documents

Publication Publication Date Title
JPH01167055U (ja)
JPS6412835U (ja)
JPS58133635U (ja) ゴム足の取付装置
JPS5927040U (ja) 金属製魔法瓶
JPH0432555U (ja)
JPS62125779U (ja)
JPS5951629U (ja) フレ−ムレスシ−トのボデイへの取付構造
JPH0282738U (ja)
JPS59106870U (ja) 組立部品包装体
JPS61120758U (ja)
JPS59195056U (ja) ステアリングコラムカバ−
JPS6245876U (ja)
JPS6365243U (ja)
JPS6234481U (ja)
JPS6441141U (ja)
JPS6223718U (ja)
JPS59132450U (ja) 樹脂製モ−ルデイングに対するエンドキヤツプの取付け構造
JPH0215737U (ja)
JPS60124225U (ja) プラスチツク製套管
JPS60147052U (ja) 密封型リレ−
JPS6186945U (ja)
JPS5997691U (ja) 鏡付洗面器
JPS61192602U (ja)
JPH02105189U (ja)
JPH01116606U (ja)