JPS6437073A - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS6437073A JPS6437073A JP19273487A JP19273487A JPS6437073A JP S6437073 A JPS6437073 A JP S6437073A JP 19273487 A JP19273487 A JP 19273487A JP 19273487 A JP19273487 A JP 19273487A JP S6437073 A JPS6437073 A JP S6437073A
- Authority
- JP
- Japan
- Prior art keywords
- land
- substrate
- insertion hole
- printed board
- constitution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19273487A JPS6437073A (en) | 1987-08-03 | 1987-08-03 | Printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19273487A JPS6437073A (en) | 1987-08-03 | 1987-08-03 | Printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6437073A true JPS6437073A (en) | 1989-02-07 |
Family
ID=16296178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19273487A Pending JPS6437073A (en) | 1987-08-03 | 1987-08-03 | Printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6437073A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997048256A1 (en) * | 1996-06-14 | 1997-12-18 | Minnesota Mining And Manufacturing Company | Multi-layer circuit having a via matrix interlayer connection and method for fabricating the same |
EP0817548A1 (en) * | 1996-01-11 | 1998-01-07 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
EP1111974A2 (de) * | 1999-12-24 | 2001-06-27 | Grundig AG | Verfahren zur Herstellung einer Lötverbindung |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60116190A (ja) * | 1983-11-28 | 1985-06-22 | 株式会社村田製作所 | 厚膜回路基板 |
JPS6329993B2 (ja) * | 1985-05-01 | 1988-06-16 | Kurita Tekunikaru Saabisu Kk |
-
1987
- 1987-08-03 JP JP19273487A patent/JPS6437073A/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60116190A (ja) * | 1983-11-28 | 1985-06-22 | 株式会社村田製作所 | 厚膜回路基板 |
JPS6329993B2 (ja) * | 1985-05-01 | 1988-06-16 | Kurita Tekunikaru Saabisu Kk |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0817548A1 (en) * | 1996-01-11 | 1998-01-07 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
EP0817548A4 (en) * | 1996-01-11 | 1999-12-01 | Ibiden Co Ltd | PRINTED CIRCUIT BOARD AND METHOD FOR THE PRODUCTION THEREOF |
US6316738B1 (en) | 1996-01-11 | 2001-11-13 | Ibiden Co., Ltd. | Printed wiring board and manufacturing method thereof |
US6342682B1 (en) | 1996-01-11 | 2002-01-29 | Ibiden Co., Ltd. | Printed wiring board and manufacturing method thereof |
WO1997048256A1 (en) * | 1996-06-14 | 1997-12-18 | Minnesota Mining And Manufacturing Company | Multi-layer circuit having a via matrix interlayer connection and method for fabricating the same |
US5753976A (en) * | 1996-06-14 | 1998-05-19 | Minnesota Mining And Manufacturing Company | Multi-layer circuit having a via matrix interlayer connection |
EP1111974A2 (de) * | 1999-12-24 | 2001-06-27 | Grundig AG | Verfahren zur Herstellung einer Lötverbindung |
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