JPS6436670A - Flame-retardant adhesive composition for flexible printed circuit board - Google Patents

Flame-retardant adhesive composition for flexible printed circuit board

Info

Publication number
JPS6436670A
JPS6436670A JP62192581A JP19258187A JPS6436670A JP S6436670 A JPS6436670 A JP S6436670A JP 62192581 A JP62192581 A JP 62192581A JP 19258187 A JP19258187 A JP 19258187A JP S6436670 A JPS6436670 A JP S6436670A
Authority
JP
Japan
Prior art keywords
flame
red phosphorus
composition
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62192581A
Other languages
Japanese (ja)
Other versions
JP2644233B2 (en
Inventor
Kunihiko Yamamoto
Kunio Nishihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Priority to JP62192581A priority Critical patent/JP2644233B2/en
Publication of JPS6436670A publication Critical patent/JPS6436670A/en
Application granted granted Critical
Publication of JP2644233B2 publication Critical patent/JP2644233B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Organic Insulating Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE:To obtain the titled composition having excellent flame-retardance, adhesive strength, heat-resistance and flexibility and useful for metal-clad laminated board, etc., by compounding a specific polymer with specific amounts of red phosphorus and a phosphoric acid ester. CONSTITUTION:The objective composition is produced by compounding (A) 100pts.wt. (solid basis) of an aqueous polymer composed of (i) an aqueous acrylic copolymer and (ii) a water-soluble epoxy compound and/or (iii) an emulsified epoxy compound and containing 3-30wt.% of bromine (in terms of solid) with (B) red phosphorus or (C) red phosphorus and a phosphoric acid ester in an amount of 1-30pts.wt. in terms of phosphorus. The composition is preferably compounded further with (D) 1-40pts.wt. (solid basis) of antimony pentoxide.
JP62192581A 1987-08-03 1987-08-03 Flame retardant adhesive composition for flexible printed circuit boards Expired - Lifetime JP2644233B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62192581A JP2644233B2 (en) 1987-08-03 1987-08-03 Flame retardant adhesive composition for flexible printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62192581A JP2644233B2 (en) 1987-08-03 1987-08-03 Flame retardant adhesive composition for flexible printed circuit boards

Publications (2)

Publication Number Publication Date
JPS6436670A true JPS6436670A (en) 1989-02-07
JP2644233B2 JP2644233B2 (en) 1997-08-25

Family

ID=16293663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62192581A Expired - Lifetime JP2644233B2 (en) 1987-08-03 1987-08-03 Flame retardant adhesive composition for flexible printed circuit boards

Country Status (1)

Country Link
JP (1) JP2644233B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0651452A1 (en) * 1993-11-01 1995-05-03 Osaka Gas Co., Ltd. Porous carbonaceous material and a method for producing the same
JP2000212539A (en) * 1999-01-21 2000-08-02 Sumitomo Bakelite Co Ltd Interlaminar insulated adhesive for multi-layer printed circuit board
JP2002332468A (en) * 2001-04-25 2002-11-22 Three M Innovative Properties Co Plasticizer-resistant pressure-sensitive adhesive composition and adhesive article

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52131695A (en) * 1976-04-27 1977-11-04 Nippon Chemical Ind Flame resisting thermosetting resin composition
JPS535235A (en) * 1976-07-05 1978-01-18 Matsushita Electric Ind Co Ltd Flame-retardant adhesives
JPS548643A (en) * 1977-06-21 1979-01-23 Matsushita Electric Ind Co Ltd Flame-retardant adhesive
JPS5483939A (en) * 1977-12-19 1979-07-04 Matsushita Electric Ind Co Ltd Flame-retardant adhesive
JPS61152746A (en) * 1984-12-27 1986-07-11 Nippon Chem Ind Co Ltd:The Flame-retardant resin composition
JPS61219706A (en) * 1985-03-19 1986-09-30 サフア、ソチエタ、ペル、アツイオーニ Stabilized red phosphorus as flame retardant for compositionof polymer particularly
JPS624734A (en) * 1985-07-01 1987-01-10 Sumitomo Electric Ind Ltd Flame-retarding composition
JPS62153373A (en) * 1985-12-27 1987-07-08 Mitsui Toatsu Chem Inc Flame-retardant adhesive composition for flexible printed circuit board

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52131695A (en) * 1976-04-27 1977-11-04 Nippon Chemical Ind Flame resisting thermosetting resin composition
JPS535235A (en) * 1976-07-05 1978-01-18 Matsushita Electric Ind Co Ltd Flame-retardant adhesives
JPS548643A (en) * 1977-06-21 1979-01-23 Matsushita Electric Ind Co Ltd Flame-retardant adhesive
JPS5483939A (en) * 1977-12-19 1979-07-04 Matsushita Electric Ind Co Ltd Flame-retardant adhesive
JPS61152746A (en) * 1984-12-27 1986-07-11 Nippon Chem Ind Co Ltd:The Flame-retardant resin composition
JPS61219706A (en) * 1985-03-19 1986-09-30 サフア、ソチエタ、ペル、アツイオーニ Stabilized red phosphorus as flame retardant for compositionof polymer particularly
JPS624734A (en) * 1985-07-01 1987-01-10 Sumitomo Electric Ind Ltd Flame-retarding composition
JPS62153373A (en) * 1985-12-27 1987-07-08 Mitsui Toatsu Chem Inc Flame-retardant adhesive composition for flexible printed circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0651452A1 (en) * 1993-11-01 1995-05-03 Osaka Gas Co., Ltd. Porous carbonaceous material and a method for producing the same
JP2000212539A (en) * 1999-01-21 2000-08-02 Sumitomo Bakelite Co Ltd Interlaminar insulated adhesive for multi-layer printed circuit board
JP2002332468A (en) * 2001-04-25 2002-11-22 Three M Innovative Properties Co Plasticizer-resistant pressure-sensitive adhesive composition and adhesive article

Also Published As

Publication number Publication date
JP2644233B2 (en) 1997-08-25

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