JPS6462333A - Production of flame-retardant phenolic resin laminate - Google Patents

Production of flame-retardant phenolic resin laminate

Info

Publication number
JPS6462333A
JPS6462333A JP22109387A JP22109387A JPS6462333A JP S6462333 A JPS6462333 A JP S6462333A JP 22109387 A JP22109387 A JP 22109387A JP 22109387 A JP22109387 A JP 22109387A JP S6462333 A JPS6462333 A JP S6462333A
Authority
JP
Japan
Prior art keywords
phenolic resin
varnish
phosphazene compound
flame
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22109387A
Other languages
Japanese (ja)
Inventor
Norihiko Sakamoto
Kazuo Okamoto
Naruyuki Kajiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Kasei Co Ltd
Original Assignee
Nitto Kasei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Kasei Co Ltd filed Critical Nitto Kasei Co Ltd
Priority to JP22109387A priority Critical patent/JPS6462333A/en
Publication of JPS6462333A publication Critical patent/JPS6462333A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement

Abstract

PURPOSE:To obtain a laminate with high flame-retardancy, improved in punching processability at normal temperature, by forming prepregs prepared by impregnating sheet substrates with a specific phosphazene compound-incorporated resin varnish. CONSTITUTION:The objective laminate can be obtained by hot pressing of a plural of prepregs, which can be prepared by impregnating sheet substrates such as of paper or cloth with a solution made by dissolving a phosphazene compound of formula (R<1> is amino, hydroxymethylamino, or aryloxy; R<2> is halogen, alkoxy or aryloxy) in a phenolic resin varnish. The amount of said phosphazene compound to be added to the varnish is such as to be 1-15 PHR based on the varnish.
JP22109387A 1987-09-02 1987-09-02 Production of flame-retardant phenolic resin laminate Pending JPS6462333A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22109387A JPS6462333A (en) 1987-09-02 1987-09-02 Production of flame-retardant phenolic resin laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22109387A JPS6462333A (en) 1987-09-02 1987-09-02 Production of flame-retardant phenolic resin laminate

Publications (1)

Publication Number Publication Date
JPS6462333A true JPS6462333A (en) 1989-03-08

Family

ID=16761380

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22109387A Pending JPS6462333A (en) 1987-09-02 1987-09-02 Production of flame-retardant phenolic resin laminate

Country Status (1)

Country Link
JP (1) JPS6462333A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5883159A (en) * 1992-07-03 1999-03-16 Toyoda Gosei Co., Ltd. Reinforced polypropylene resin composition
JP2002322478A (en) * 2001-04-24 2002-11-08 Chemiprokasei Kaisha Ltd Flame retardant and flame-retardant resin composition and molding containing the same
JP2003096267A (en) * 2001-09-19 2003-04-03 Taiyo Ink Mfg Ltd Roughened surface forming resin composition, and multilayer printed wiring board and prepreg for printed wiring board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5883159A (en) * 1992-07-03 1999-03-16 Toyoda Gosei Co., Ltd. Reinforced polypropylene resin composition
JP2002322478A (en) * 2001-04-24 2002-11-08 Chemiprokasei Kaisha Ltd Flame retardant and flame-retardant resin composition and molding containing the same
JP2003096267A (en) * 2001-09-19 2003-04-03 Taiyo Ink Mfg Ltd Roughened surface forming resin composition, and multilayer printed wiring board and prepreg for printed wiring board

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