JPS6432636A - Wet etching device - Google Patents

Abstract

PURPOSE:To prevent the adhesion of particles onto a wafer, and to obviate cracks by installing a parting plate separating an upper section in an etching tank into an etching section and an extracting section to the upper section in the etching tank and openly providing the lower section of the etching tank with a transfer path. CONSTITUTION:An upper section in an etching tank is partitioned by a parting plate 9 to form an etching section 8 and an extracting section 9. When the etching of a wafer 2 is completed and a cassette 1 is detached from a hanger 11, the cassette 1 slides down in a path 10, and is transferred to the extracting section 9 from the etching section 8. The cassette 1 is mounted at the nose of the hanger 1, and the wafer 2 is extracted from the inside of an etchant in the extract ing section 9 together with the cassette 1. Since there is no particle around the level of the etchant in the extracting section 9, no particle 5 adheres on the surface of the slicing of the wafer 2. Accordingly, cracks are prevented.