JPS6431604A - Method and device for dicing - Google Patents

Method and device for dicing

Info

Publication number
JPS6431604A
JPS6431604A JP19112787A JP19112787A JPS6431604A JP S6431604 A JPS6431604 A JP S6431604A JP 19112787 A JP19112787 A JP 19112787A JP 19112787 A JP19112787 A JP 19112787A JP S6431604 A JPS6431604 A JP S6431604A
Authority
JP
Japan
Prior art keywords
blade
carbon dioxide
feed
wafer
dicing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19112787A
Other languages
Japanese (ja)
Inventor
Kouichi Uekuri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP19112787A priority Critical patent/JPS6431604A/en
Publication of JPS6431604A publication Critical patent/JPS6431604A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/10—Arrangements for cooling or lubricating tools or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/02—Devices for lubricating or cooling circular saw blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To contrive extension of life of a blade, by a method wherein only pure water is fed to the blade by interrupting feed of carbon dioxide between a first wafer cutting process and second wafer cutting process. CONSTITUTION:A device 1 is constituted of a pure water feed device 2, a, cutting-off device having a blade 5, a detecting device 12 detecting a wafer 10 on a mount 9 and a device 13 controlling feed of carbon dioxide by providing them. The control device 13 mixes the carbon dioxide into the pure water only when the blade 5 is dicing the wafer 10. As the control device 13 does not feed the carbon dioxide when the blade 5 is not dicing, a period of time when the blade is exposed into acid water and etched is shortened and shortening of life of the blade 5 can be prevented.
JP19112787A 1987-07-29 1987-07-29 Method and device for dicing Pending JPS6431604A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19112787A JPS6431604A (en) 1987-07-29 1987-07-29 Method and device for dicing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19112787A JPS6431604A (en) 1987-07-29 1987-07-29 Method and device for dicing

Publications (1)

Publication Number Publication Date
JPS6431604A true JPS6431604A (en) 1989-02-01

Family

ID=16269318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19112787A Pending JPS6431604A (en) 1987-07-29 1987-07-29 Method and device for dicing

Country Status (1)

Country Link
JP (1) JPS6431604A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000198044A (en) * 1999-01-07 2000-07-18 Disco Abrasive Syst Ltd Control system for machining water specific resistance
JP2005340431A (en) * 2004-05-26 2005-12-08 Renesas Technology Corp Method for manufacturing semiconductor device
JP2009027030A (en) * 2007-07-20 2009-02-05 Disco Abrasive Syst Ltd Method of cutting wafer
JP2009274172A (en) * 2008-05-14 2009-11-26 Disco Abrasive Syst Ltd Cutting apparatus
WO2013054577A1 (en) * 2011-10-12 2013-04-18 株式会社村田製作所 Waste machining fluid circulation device and waste machining fluid circulation method
JP2018073875A (en) * 2016-10-25 2018-05-10 株式会社ディスコ Processing method of wafer
JP2018073874A (en) * 2016-10-25 2018-05-10 株式会社ディスコ Processing method and cutting device of wafer
JP2019136843A (en) * 2018-02-14 2019-08-22 株式会社ディスコ Cutting device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000198044A (en) * 1999-01-07 2000-07-18 Disco Abrasive Syst Ltd Control system for machining water specific resistance
JP2005340431A (en) * 2004-05-26 2005-12-08 Renesas Technology Corp Method for manufacturing semiconductor device
JP2009027030A (en) * 2007-07-20 2009-02-05 Disco Abrasive Syst Ltd Method of cutting wafer
JP2009274172A (en) * 2008-05-14 2009-11-26 Disco Abrasive Syst Ltd Cutting apparatus
WO2013054577A1 (en) * 2011-10-12 2013-04-18 株式会社村田製作所 Waste machining fluid circulation device and waste machining fluid circulation method
JP2018073875A (en) * 2016-10-25 2018-05-10 株式会社ディスコ Processing method of wafer
JP2018073874A (en) * 2016-10-25 2018-05-10 株式会社ディスコ Processing method and cutting device of wafer
JP2019136843A (en) * 2018-02-14 2019-08-22 株式会社ディスコ Cutting device

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