JPS6431450A - Ic package - Google Patents

Ic package

Info

Publication number
JPS6431450A
JPS6431450A JP62189110A JP18911087A JPS6431450A JP S6431450 A JPS6431450 A JP S6431450A JP 62189110 A JP62189110 A JP 62189110A JP 18911087 A JP18911087 A JP 18911087A JP S6431450 A JPS6431450 A JP S6431450A
Authority
JP
Japan
Prior art keywords
package
bumps
pellets
pellet
wirings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62189110A
Other languages
Japanese (ja)
Other versions
JPH07120744B2 (en
Inventor
Jun Koike
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62189110A priority Critical patent/JPH07120744B2/en
Publication of JPS6431450A publication Critical patent/JPS6431450A/en
Publication of JPH07120744B2 publication Critical patent/JPH07120744B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To avoid an increase in the size of a chip by mounting a plurality of IC pellets in a laminated structure, and electrically connecting the pads of the pellets to inner pads. CONSTITUTION:Printed wirings 2 are formed in a package 4, bumps 6 are attached onto a pad 7 on a pellet 3, the front and rear of the pellet 3 are so disposed reversely as to electrically connect the wirings 2 on the step of the package 4 to the bumps 6, and the pellet 3 is disposed on the step of the package 4. In order to mount a plurality of pellets 3, the pellets 3 are mounted on the package 4, the bumps 6 attached to the pad 7 of the pellet 3 are electrically connected by a paper phase soldering method to the wirings 2 on the step of the package 4. Then, the wirings 2 connected to the bumps 6 become the inner pads of the package 4. Accordingly, an increase in the size of the chip can be avoided to enhance the function of a microprocessor and the like.
JP62189110A 1987-07-28 1987-07-28 IC package Expired - Lifetime JPH07120744B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62189110A JPH07120744B2 (en) 1987-07-28 1987-07-28 IC package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62189110A JPH07120744B2 (en) 1987-07-28 1987-07-28 IC package

Publications (2)

Publication Number Publication Date
JPS6431450A true JPS6431450A (en) 1989-02-01
JPH07120744B2 JPH07120744B2 (en) 1995-12-20

Family

ID=16235540

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62189110A Expired - Lifetime JPH07120744B2 (en) 1987-07-28 1987-07-28 IC package

Country Status (1)

Country Link
JP (1) JPH07120744B2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5586354U (en) * 1978-12-11 1980-06-14
JPS62119952A (en) * 1985-11-19 1987-06-01 Nec Corp Integrated circuit device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5586354U (en) * 1978-12-11 1980-06-14
JPS62119952A (en) * 1985-11-19 1987-06-01 Nec Corp Integrated circuit device

Also Published As

Publication number Publication date
JPH07120744B2 (en) 1995-12-20

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