JPS6430535U - - Google Patents
Info
- Publication number
- JPS6430535U JPS6430535U JP1987124922U JP12492287U JPS6430535U JP S6430535 U JPS6430535 U JP S6430535U JP 1987124922 U JP1987124922 U JP 1987124922U JP 12492287 U JP12492287 U JP 12492287U JP S6430535 U JPS6430535 U JP S6430535U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- flux
- display substrate
- black
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 230000004907 flux Effects 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Wire Bonding (AREA)
- Liquid Crystal (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987124922U JPS6430535U (OSRAM) | 1987-08-17 | 1987-08-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987124922U JPS6430535U (OSRAM) | 1987-08-17 | 1987-08-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6430535U true JPS6430535U (OSRAM) | 1989-02-23 |
Family
ID=31375069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987124922U Pending JPS6430535U (OSRAM) | 1987-08-17 | 1987-08-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6430535U (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999032304A1 (fr) * | 1997-12-22 | 1999-07-01 | Hitachi, Ltd. | Dispositif a semi-conducteur |
-
1987
- 1987-08-17 JP JP1987124922U patent/JPS6430535U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999032304A1 (fr) * | 1997-12-22 | 1999-07-01 | Hitachi, Ltd. | Dispositif a semi-conducteur |
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