JPS6429810A - Method for coupling substrate of optical integrated circuit and optical fiber - Google Patents
Method for coupling substrate of optical integrated circuit and optical fiberInfo
- Publication number
- JPS6429810A JPS6429810A JP62186041A JP18604187A JPS6429810A JP S6429810 A JPS6429810 A JP S6429810A JP 62186041 A JP62186041 A JP 62186041A JP 18604187 A JP18604187 A JP 18604187A JP S6429810 A JPS6429810 A JP S6429810A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- groove
- substrate
- optical integrated
- light guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/255—Splicing of light guides, e.g. by fusion or bonding
- G02B6/2552—Splicing of light guides, e.g. by fusion or bonding reshaping or reforming of light guides for coupling using thermal heating, e.g. tapering, forming of a lens on light guide ends
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/04—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with articles made from glass
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/30—Optical coupling means for use between fibre and thin-film device
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3608—Fibre wiring boards, i.e. where fibres are embedded or attached in a pattern on or to a substrate, e.g. flexible sheets
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
- G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
PURPOSE:To enable the incidence and emission of light from the mid-point of a light guide on an optical integrated circuit substrate at a low cost by forming a groove which has a V-shaped section and is formed with a base of a relatively gentle radius of curvature to the optical integrated circuit and positioning an optical fiber flexibly in this groove along the grade of the base. CONSTITUTION:The groove 12 which has the V-shaped section and is formed with the base having the grade of the relatively gentle radius of curvature is formed on the surface of the optical integrated circuit substrate 10. The working end 12a of this groove 12 has the slope corresponding to the end angle of a pyramidal tool 22 and the angle of inclination of the tool 22 and the end face 18a of the light guide 18 is positioned near the front face of the substrate 10 at the working end 12a. The optical fiber 14 is flexibly positioned in the groove along the base gradient of the groove 12 and the axial center part of the core at the front end of the fiber 14 worked to a circular conical shape or hemispherical shape is directed and fixed to the substrate 10 in parallel with the surface thereof. The incidence of the light to the light guide and the emission of the light from the light guide are thereby executed at the point except the substrate end of the optical integrated circuit at a low cost.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62186041A JP2564837B2 (en) | 1987-07-24 | 1987-07-24 | Method of coupling substrate of optical integrated circuit and optical fiber |
US07/447,421 US5018817A (en) | 1987-07-24 | 1989-12-07 | Method of optically coupling optical fiber to waveguide on substrate, and optical device produced by the method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62186041A JP2564837B2 (en) | 1987-07-24 | 1987-07-24 | Method of coupling substrate of optical integrated circuit and optical fiber |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6429810A true JPS6429810A (en) | 1989-01-31 |
JP2564837B2 JP2564837B2 (en) | 1996-12-18 |
Family
ID=16181361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62186041A Expired - Fee Related JP2564837B2 (en) | 1987-07-24 | 1987-07-24 | Method of coupling substrate of optical integrated circuit and optical fiber |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2564837B2 (en) |
-
1987
- 1987-07-24 JP JP62186041A patent/JP2564837B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2564837B2 (en) | 1996-12-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |