JP2564837B2 - Method of coupling substrate of optical integrated circuit and optical fiber - Google Patents

Method of coupling substrate of optical integrated circuit and optical fiber

Info

Publication number
JP2564837B2
JP2564837B2 JP62186041A JP18604187A JP2564837B2 JP 2564837 B2 JP2564837 B2 JP 2564837B2 JP 62186041 A JP62186041 A JP 62186041A JP 18604187 A JP18604187 A JP 18604187A JP 2564837 B2 JP2564837 B2 JP 2564837B2
Authority
JP
Japan
Prior art keywords
optical
optical fiber
integrated circuit
substrate
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62186041A
Other languages
Japanese (ja)
Other versions
JPS6429810A (en
Inventor
鈴木  誠
人美 大利
行宏 佐古
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Brother Industries Ltd
Original Assignee
Brother Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brother Industries Ltd filed Critical Brother Industries Ltd
Priority to JP62186041A priority Critical patent/JP2564837B2/en
Publication of JPS6429810A publication Critical patent/JPS6429810A/en
Priority to US07/447,421 priority patent/US5018817A/en
Application granted granted Critical
Publication of JP2564837B2 publication Critical patent/JP2564837B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/255Splicing of light guides, e.g. by fusion or bonding
    • G02B6/2552Splicing of light guides, e.g. by fusion or bonding reshaping or reforming of light guides for coupling using thermal heating, e.g. tapering, forming of a lens on light guide ends
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/04Joining burned ceramic articles with other burned ceramic articles or other articles by heating with articles made from glass
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/30Optical coupling means for use between fibre and thin-film device
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52Ceramics
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/3608Fibre wiring boards, i.e. where fibres are embedded or attached in a pattern on or to a substrate, e.g. flexible sheets
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/3628Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Optical Couplings Of Light Guides (AREA)

Description

【発明の詳細な説明】 産業上の利用分野 この発明は、光集積回路の基板における端部以外の表
面に光ファイバを結合し、光導波路の中途での光の入射
および出射を低廉なコストで実現して、回路設計の自由
度を向上させた光集積回路の基板と光ファイバとの結合
方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention connects an optical fiber to a surface other than an end portion of a substrate of an optical integrated circuit and allows light to enter and exit in the middle of an optical waveguide at low cost. The present invention relates to a method of coupling a substrate of an optical integrated circuit and an optical fiber, which is realized and improves the degree of freedom in circuit design.

従来技術 最近のオプトエレクトロニクスの進展に伴い、従来の
電気通信方式に代替するものとして光伝送方式が広く普
及する傾向にある。この光伝送方式は、光による情報の
伝送媒体として、例えば石英系や多成分系ガラスを材質
とする光ファイバを使用し、このため電磁誘導障害を受
けず、しかも大容量の情報伝送密度が得られる等の多く
の利点を有している。前述の光伝送技術では、発光素
子、導波路、受光素子等を集積化した光集積回路の基板
に前記光ファイバを結合し、この基板の光導波路と光フ
ァイバとの間で光情報の交換(光の入射・出射)が行な
われる。
2. Description of the Related Art With the recent development of optoelectronics, optical transmission systems tend to be widely used as alternatives to conventional telecommunication systems. This optical transmission system uses an optical fiber made of, for example, quartz or multi-component glass as a medium for transmitting information by light, and therefore, does not suffer from electromagnetic induction interference and yet has a large capacity of information transmission density. It has many advantages, including: In the above-mentioned optical transmission technology, the optical fiber is coupled to a substrate of an optical integrated circuit in which a light emitting element, a waveguide, a light receiving element, etc. are integrated, and optical information is exchanged between the optical waveguide and the optical fiber of the substrate ( Light is incident and emitted.

発明が解決しようとする問題点 光集積回路基板に光を入射させる方法には、大別して
以下の2つの形態が知られている。その第1の形態は、
第10図に示す如く、光集積回路基板10の表面に、該基板
の端部10aにおいて開放する所要深さの溝12を形成し、
この溝12中に光ファイバ14の先端を臨ませて、両者を紫
外線硬化樹脂等により接着する結合方法である。この結
合方法によれば、光ファイバ14の先端におけるコア14a
を、前記溝12の最奥部に位置する光導波路18の端部18a
に高精度で位置決めし得る利点がある。しかし基板10は
ガラス材やニオブ酸リチウム等のぜい性の高い難削材を
材質とするために、前記溝部12の加工が一般に困難で、
加工時の割れや欠けを生じて不良率が高いという欠点を
有している。
Problems to be Solved by the Invention The methods of making light incident on an optical integrated circuit substrate are roughly classified into the following two forms. The first form is
As shown in FIG. 10, on the surface of the optical integrated circuit substrate 10, a groove 12 having a required depth to be opened at the end 10a of the substrate is formed,
This is a joining method in which the tip of the optical fiber 14 is exposed in the groove 12 and both are adhered by an ultraviolet curable resin or the like. According to this coupling method, the core 14a at the tip of the optical fiber 14 is
Is the end 18a of the optical waveguide 18 located at the deepest part of the groove 12.
There is an advantage that the positioning can be performed with high accuracy. However, since the substrate 10 is made of a highly brittle material such as a glass material or lithium niobate, it is generally difficult to process the groove portion 12,
It has a defect that cracking and chipping occur during processing and the defect rate is high.

また第2の形態は、第11図に示すように、光ファイバ
14からの光を集光レンズ16により集束し、その集束光を
基板10上の光導波路18における研磨端面18aに入射させ
る方法である。この方法は、集光レンズ16を用いるため
構成的に大型化し製造コストが嵩むという欠点がある。
The second form is as shown in FIG.
This is a method in which the light from 14 is focused by a condenser lens 16 and the focused light is made incident on the polishing end face 18a of the optical waveguide 18 on the substrate 10. Since this method uses the condenser lens 16, there is a drawback in that the structure is large and the manufacturing cost is high.

しかも前述した両方法に共通する欠点は、基板10にお
ける光導波路18の端面18aに光ファイバ14を直交的に接
続させたり、集光レンズ16からの集束光の光軸を光導波
路18の端面18aに直交させる必要があることである。こ
のため従来の結合方法では、基板10上の光導波路18の任
意の位置において、光導波路18の中途に光を入射させた
り光を出射させたりすることはできなかった。
Moreover, the disadvantages common to both methods described above are that the optical fiber 14 is orthogonally connected to the end face 18a of the optical waveguide 18 on the substrate 10, or the optical axis of the focused light from the condenser lens 16 is changed to the end face 18a of the optical waveguide 18. It is necessary to make it orthogonal to. For this reason, in the conventional coupling method, it was not possible to allow light to enter or emit light in the middle of the optical waveguide 18 at an arbitrary position of the optical waveguide 18 on the substrate 10.

このように光導波路18の中途で光の入射および出射を
行なうには、第12図に示すように、酸化チタン(TiO2
を材質とするルチルプリズム20を基板10の光導波路18に
付設し、このルチルプリズム20を介して光導波路18の中
途に光を入射させたり、また光導波路18の中途から該プ
リズム20を介して光を出射させる方法が実施されてい
る。しかしルチルプリズム20は高価な材質を使用するた
めに一般的でなく、また光集積回路基板10上に突出して
嵩張ると共に、光学系が複雑化する等の難点があり、光
集積回路の回路設計の自由度を損なうものであった。
In this way, in order to allow the light to enter and exit in the middle of the optical waveguide 18, as shown in FIG. 12, titanium oxide (TiO 2 )
A rutile prism 20 made of a material is attached to the optical waveguide 18 of the substrate 10, light is made incident on the middle of the optical waveguide 18 through the rutile prism 20, or from the middle of the optical waveguide 18 through the prism 20. A method of emitting light has been implemented. However, the rutile prism 20 is not general because it uses an expensive material, and there is a problem that the optical system is complicated as well as protruding and bulky on the optical integrated circuit board 10. It impaired the degree of freedom.

発明の目的 この発明は、従来の光集積回路基板への光ファイバの
結合方法では、光導波路の途中で光の入射・出射をなし
得なかったり、またそれが可能な方法であっても製造コ
ストが嵩んだりする等の前記問題点に鑑み、これを好適
に解決するべく提案されたものであって、光集積回路基
板における光導波路の中途において、光の入射および光
の出射を低廉なコストで可能として、回路設計の自由度
を向上させ得る手段を提供することを目的とする。
An object of the present invention is that, in the conventional method of coupling an optical fiber to an optical integrated circuit substrate, light cannot be incident or emitted in the middle of the optical waveguide, or even if it is possible, the manufacturing cost can be reduced. In view of the above-mentioned problems such as increase in size, it has been proposed to preferably solve this problem, in the middle of the optical waveguide in the optical integrated circuit substrate, light incidence and light emission at low cost. It is an object of the present invention to provide a means capable of improving the degree of freedom in circuit design.

問題点を解決するための手段 前記問題点を克服し、所期の目的を達成するため本発
明は、光集積回路の基板に、断面V字状で比較的緩やか
な曲率半径の勾配からなる底面を付した溝を形成し、こ
のV字状溝の底面勾配に沿って光ファイバを撓曲的に位
置させると共に、当該光ファイバの円錐状または半球状
に加工した先端を前記断面V字状溝の最奥部に指向させ
て固定することを特徴とする。
Means for Solving the Problems In order to overcome the above problems and achieve the intended purpose, the present invention provides a substrate of an optical integrated circuit having a V-shaped cross section and a bottom having a relatively gentle radius of curvature. Is formed, the optical fiber is flexibly positioned along the bottom slope of the V-shaped groove, and the conical or hemispherical end of the optical fiber is formed into the V-shaped groove in cross section. It is characterized in that it is oriented and fixed to the innermost part of.

作用 本発明に係る光集積回路の基板と光ファイバとの結合
方法によれば、簡単にしかも低廉なコストで、光集積回
路基板上の光導波路の中途において、光の入射および光
の出射をさせることが可能になる。
According to the method for coupling the substrate of the optical integrated circuit and the optical fiber according to the present invention, the light is input and the light is emitted in the middle of the optical waveguide on the optical integrated circuit substrate at a simple and low cost. It will be possible.

実施例 次に、本発明に係る光集積回路の基板と光ファイバと
の結合方法につき、好適な実施例を挙げて、添付図面を
参照しながら説明する。なお第10図に関連して既に説明
した部材と同一の部材については、同じ符号で指示する
ものとする。
Embodiments Next, a method for coupling a substrate of an optical integrated circuit and an optical fiber according to the present invention will be described with reference to the accompanying drawings with reference to preferred embodiments. The same members as those already described with reference to FIG. 10 are designated by the same reference numerals.

先ず本実施例に係る結合方法では、第1図〜第5図に
示すように、ガラス材やニオブ酸リチウムを材質とする
光集積回路基板10の表面に、断面V字状で比較的緩やか
な曲率半径の勾配からなる底面を付した溝12を形成す
る。この溝12を形成するための手段として、例えば第2
図に示すように、超硬合金の微粒子を焼結して先端刃部
22aを四角錐形状に加工した角錐工具22を使用する。す
なわち、角錐状の刃部22aの先端角60°で、シャンク径5
mmの角錐工具22に、40,000r.p.m.の回転と速度1mm/min
の送りとを同時に与えて、光集積回路基板10の表面に所
要の切込みを行なう。なお、この角錐工具22による加工
開始位置は、光集積回路基板10の端部からではなく、基
板10の表面上の所要位置からであるので、該工具22に
は、前記回転と送りに加えて、垂直方向の下降および上
昇の制御も与える必要がある。このため刃部22aは、垂
直平面に対して矢印Aに示す如きスイングを伴った切込
み運動を行なうことになる。また基板10は、前述の如く
ぜい性部材であるために、角錐工具22による切込みは複
数回に分けて往復的に実施する必要があり、その切込回
数は、例えば12回とするのが好適である。
First, in the bonding method according to the present embodiment, as shown in FIGS. 1 to 5, the surface of the optical integrated circuit board 10 made of a glass material or lithium niobate is V-shaped in cross section and relatively gentle. A groove 12 having a bottom surface having a gradient of radius of curvature is formed. As means for forming the groove 12, for example, a second
As shown in the figure, the tip blade part
A pyramid tool 22 obtained by processing 22a into a quadrangular pyramid shape is used. That is, when the tip angle of the pyramidal blade portion 22a is 60 °, the shank diameter is 5
mm pyramidal tool 22, 40,000 rpm rotation and speed 1 mm / min
And the feed are simultaneously performed to make a required cut in the surface of the optical integrated circuit board 10. Since the processing start position by the pyramid tool 22 is not from the end of the optical integrated circuit substrate 10 but from a required position on the surface of the substrate 10, the tool 22 includes the rotation and the feed in addition to the above. , Vertical descent and climb control should also be provided. Therefore, the blade portion 22a makes a cutting movement with a swing as shown by an arrow A with respect to the vertical plane. Further, since the substrate 10 is the brittle member as described above, it is necessary to perform the cutting with the pyramid tool 22 in a reciprocating manner in a plurality of times, and the number of times of cutting is, for example, 12 times. It is suitable.

これにより基板10の任意表面には、第3図〜第5図に
示す如く、角錐工具22の先端角に合致した断面V字状
で、比較的緩やかな曲率半径の勾配からなる船底形の底
面を有する溝12が形成される。この溝12の加工終了端12
aは、角錐工具22の先端角および当該工具22の傾斜角度
に応じた斜面を有しており、かつ加工終了端12aの基板1
0上面近傍に光導波路18の端面18aが位置される。
As a result, as shown in FIGS. 3 to 5, the bottom surface of the bottom of the ship 10 has a V-shaped cross section that matches the tip angle of the pyramid tool 22 and has a relatively gentle radius of curvature on the arbitrary surface of the substrate 10. A groove 12 having is formed. Processing end 12 of this groove 12
a has a sloped surface corresponding to the tip angle of the pyramid tool 22 and the tilt angle of the tool 22, and the substrate 1 at the processing end 12a
0 The end surface 18a of the optical waveguide 18 is located near the upper surface.

このように加工した溝12中に、光ファイバ14を臨ませ
て結合することになるが、本発明では、前記溝12の底面
勾配に沿って光ファイバ14を撓曲的に位置させると共
に、当該光ファイバ14の円錐状または半球状に加工した
先端部のコア軸心部分を、基板10の表面と平行に指向さ
せて固定する。例えば、第8図は光ファイバ14の先端を
円錐状に加工する手段の1実施例を示すものであって、
光ファイバ14をシース状の保持体24で保持し、該光ファ
イバ14の先端14aをこの保持体24から僅かに延出させて
いる。そして垂直な回転軸26に固定されて水平に回転す
る円盤状の研削砥石28の研削面28aに対し、前記保持体2
4を所要の角度θをもって近接させ、光ファイバ14の先
端14aを前記研削砥石28によって研磨する。これにより
光ファイバ14のコアとなる部分の先端14aは、2θの角
度を有する円錐形状に加工される。
In the groove 12 thus processed, the optical fiber 14 is faced and coupled, but in the present invention, the optical fiber 14 is flexibly positioned along the bottom slope of the groove 12, and The core axial center portion of the tip portion of the optical fiber 14 processed into a conical shape or a hemispherical shape is fixed so as to be oriented parallel to the surface of the substrate 10. For example, FIG. 8 shows an embodiment of means for processing the tip of the optical fiber 14 into a conical shape,
The optical fiber 14 is held by a sheath-shaped holder 24, and the tip 14a of the optical fiber 14 is slightly extended from the holder 24. Then, with respect to the grinding surface 28a of the disk-shaped grinding wheel 28 that is fixed to the vertical rotation shaft 26 and rotates horizontally, the holder 2
4 are brought close to each other at a required angle θ, and the tip 14a of the optical fiber 14 is polished by the grinding stone 28. As a result, the tip 14a of the core portion of the optical fiber 14 is processed into a conical shape having an angle of 2θ.

第9図は光ファイバ14の先端を半球状に加工する手段
の1実施例を示すものであって、2本の対向し合う放電
電極30,32に高電圧を印加し、その電弧形成間隙SG中に
アーク放電を発生させる。そして光ファイバ14の先端を
電弧形成間隙SGに介在させてアーク放電により溶融させ
れば、コアとなる部分の先端14aが溶融時の表面張力に
より半球状に加工される。
FIG. 9 shows an embodiment of a means for processing the tip of the optical fiber 14 into a hemispherical shape. A high voltage is applied to the two discharge electrodes 30 and 32 facing each other, and the arc forming gap SG Generate an arc discharge inside. When the tip of the optical fiber 14 is placed in the electric arc forming gap SG and melted by arc discharge, the tip 14a of the core portion is processed into a hemispherical shape due to the surface tension during melting.

このように加工した光ファイバ14を、第1図に示すよ
うに、前述の加工に係るV字溝12における所要の曲率半
径を有する底面勾配に沿って撓曲的に位置させる。また
光ファイバ14の円錐形状または半球状をなすコア先端14
aは、基板10の表面と平行に指向させて光導波路18の光
入射面18aに密着させる。この状態でV字溝12と光ファ
イバ14とを、例えば紫外線硬化樹脂により接着固定す
る。これにより光ファイバ14と光導波路18との間に隙間
が形成されることはなく、光の分散による損失を有効に
抑制して、高い光伝送効率を得ることができる。
As shown in FIG. 1, the optical fiber 14 processed in this manner is flexibly positioned along the bottom slope having the required radius of curvature in the V-shaped groove 12 according to the above-described processing. The conical or hemispherical core tip 14 of the optical fiber 14
The a is oriented parallel to the surface of the substrate 10 and is brought into close contact with the light incident surface 18a of the optical waveguide 18. In this state, the V-shaped groove 12 and the optical fiber 14 are bonded and fixed by, for example, an ultraviolet curable resin. As a result, no gap is formed between the optical fiber 14 and the optical waveguide 18, the loss due to the dispersion of light is effectively suppressed, and high optical transmission efficiency can be obtained.

第7図は、本発明の応用例を示すものであって、光集
積回路基板10の光導波路18に形成した2つのX型分岐ス
イッチ34,36の各出力線34a,36aを、再び別のX型分岐ス
イッチ38に入力したい場合に好適に使用可能である。す
なわち、光導波路18における前記出力線34aの部位およ
びX型分岐スイッチ38の入力線38aの部位に、夫々前述
したV字溝12を加工し、両V字溝12,12間を光ファイバ1
4により結合することによって、光導波路18の中途から
中途への光の入射および出射を容易になし得るものであ
る。
FIG. 7 shows an application example of the present invention, in which the output lines 34a and 36a of the two X-type branch switches 34 and 36 formed in the optical waveguide 18 of the optical integrated circuit board 10 are separated from each other. It can be suitably used when it is desired to input to the X-type branch switch 38. That is, the above-mentioned V-shaped groove 12 is processed in the portion of the output line 34a of the optical waveguide 18 and the portion of the input line 38a of the X-type branch switch 38, respectively, and the optical fiber 1 is provided between both V-shaped grooves 12, 12.
By coupling with 4, it is possible to easily enter and exit light from the middle of the optical waveguide 18.

発明の効果 以上説明した如く、本発明に係る光集積回路の基板と
光ファイバとの結合方法によれば、光集積回路の基板端
部以外の個所において、光導波路への光の入射および光
導波路からの光の出射を低廉なコストで可能として、光
集積回路の設計自由度を向上させることができる。
EFFECTS OF THE INVENTION As described above, according to the method for coupling the substrate of the optical integrated circuit and the optical fiber according to the present invention, the light is incident on the optical waveguide and the optical waveguide is provided at a position other than the end portion of the substrate of the optical integrated circuit. It is possible to emit light from the device at a low cost and improve the degree of freedom in designing the optical integrated circuit.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明に係る方法により結合された光集積回路
の基板と光ファイバとの結合状態の実施例を示す縦断面
図、第2図は第1図に示す方法に使用される光集積回路
の基板に、断面V字状で比較的緩やかな曲率半径の勾配
からなる底面を付した溝を形成する手段の一例を示す説
明図、第3図は第2図に示す手段により形成された溝の
平面図、第4図は第3図のIV-IV線縦断面図、第5図は
第3図のV-V線縦断面図、第6図は第1図の平面図、第
7図は本発明の応用例を示す概略斜視図であって、光集
積回路基板の光導波路に形成したX型分岐スイッチを示
し、第8図は第1図に示す方法に使用される光ファイバ
の先端を円錐形状に加工する手段の1例を示す説明図、
第9図は本発明に係る方法に使用される光ファイバの先
端を半球状に加工する手段の1例を示す説明図、第10図
は従来実施されている光集積回路基板の溝部と光ファイ
バとの結合関係を示す斜視図、第11図は光集積回路基板
に集光レンズを使用して光の入射を行なう従来技術の斜
視図、第12図は光集積回路基板にルチルプリズムを使用
して光の入射および出射を行なう従来技術の斜視図であ
る。 10……基板、12……V字溝 12a……最奥部、14……光ファイバ 14a……先端、16……集光レンズ 18……光導波路 18a……開放端(光入射面) 20……ルチルプリズム、22……角錐工具 22a……刃部、24……保持体 26……回転軸、28……研削砥石 28a……研削面 30,32……放電電極 34,36,38……X型分岐スイッチ
FIG. 1 is a vertical cross-sectional view showing an embodiment of a state in which a substrate of an optical integrated circuit and an optical fiber coupled by the method according to the present invention are coupled, and FIG. 2 is an optical integrated circuit used in the method shown in FIG. FIG. 3 is an explanatory view showing an example of means for forming a groove having a bottom surface with a V-shaped cross section and a relatively gentle gradient of curvature radius on the circuit board; FIG. 3 is formed by the means shown in FIG. A plan view of the groove, FIG. 4 is a vertical sectional view taken along line IV-IV of FIG. 3, FIG. 5 is a vertical sectional view taken along line VV of FIG. 3, FIG. 6 is a plan view of FIG. 1, and FIG. FIG. 8 is a schematic perspective view showing an application example of the present invention, showing an X-type branch switch formed in an optical waveguide of an optical integrated circuit substrate, and FIG. 8 shows an end of an optical fiber used in the method shown in FIG. Explanatory drawing showing an example of means for processing into a conical shape,
FIG. 9 is an explanatory view showing an example of a means for processing the tip of an optical fiber used in the method according to the present invention into a hemispherical shape, and FIG. 10 is a groove portion of an optical integrated circuit substrate and an optical fiber which have been conventionally implemented. Fig. 11 is a perspective view showing a coupling relationship with Fig. 11, Fig. 11 is a perspective view of a prior art in which light is incident on an optical integrated circuit board by using a condenser lens, and Fig. 12 is a rutile prism for the optical integrated circuit board. FIG. 3 is a perspective view of a conventional technique in which light is made incident and emitted. 10: substrate, 12: V-shaped groove 12a: innermost part, 14: optical fiber 14a: tip, 16: condenser lens 18: optical waveguide 18a: open end (light incident surface) 20 ...... Rutile prism, 22 …… Pyramid tool 22a …… Blade part, 24 …… Holder 26 …… Rotary axis, 28 …… Grinding wheel 28a …… Grinding surface 30,32 …… Discharge electrode 34,36,38… … X-type branch switch

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】光集積回路の基板に、断面V字状で比較的
緩やかな曲率半径の勾配からなる底面を付した溝を形成
し、このV字状溝の底面勾配に沿って光ファイバを撓曲
的に位置させると共に、当該光ファイバの円錐状または
半球状に加工した先端を前記断面V字状溝の最奥部に指
向させて固定することを特徴とする光集積回路の基板と
光ファイバとの結合方法。
1. A substrate of an optical integrated circuit is formed with a groove having a V-shaped cross section and a bottom having a relatively gentle gradient of curvature radius, and an optical fiber is formed along the V-shaped groove bottom gradient. A substrate of an optical integrated circuit, which is flexibly positioned and fixed by directing the conical or hemispherical end of the optical fiber toward the innermost portion of the V-shaped groove in cross section. Fiber coupling method.
JP62186041A 1987-07-24 1987-07-24 Method of coupling substrate of optical integrated circuit and optical fiber Expired - Fee Related JP2564837B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP62186041A JP2564837B2 (en) 1987-07-24 1987-07-24 Method of coupling substrate of optical integrated circuit and optical fiber
US07/447,421 US5018817A (en) 1987-07-24 1989-12-07 Method of optically coupling optical fiber to waveguide on substrate, and optical device produced by the method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62186041A JP2564837B2 (en) 1987-07-24 1987-07-24 Method of coupling substrate of optical integrated circuit and optical fiber

Publications (2)

Publication Number Publication Date
JPS6429810A JPS6429810A (en) 1989-01-31
JP2564837B2 true JP2564837B2 (en) 1996-12-18

Family

ID=16181361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62186041A Expired - Fee Related JP2564837B2 (en) 1987-07-24 1987-07-24 Method of coupling substrate of optical integrated circuit and optical fiber

Country Status (1)

Country Link
JP (1) JP2564837B2 (en)

Also Published As

Publication number Publication date
JPS6429810A (en) 1989-01-31

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