JPS6428943A - Package for semiconductor integrated circuit - Google Patents

Package for semiconductor integrated circuit

Info

Publication number
JPS6428943A
JPS6428943A JP18594687A JP18594687A JPS6428943A JP S6428943 A JPS6428943 A JP S6428943A JP 18594687 A JP18594687 A JP 18594687A JP 18594687 A JP18594687 A JP 18594687A JP S6428943 A JPS6428943 A JP S6428943A
Authority
JP
Japan
Prior art keywords
package
external connection
connection terminals
integrated circuit
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18594687A
Other languages
Japanese (ja)
Inventor
Seiji Takemura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP18594687A priority Critical patent/JPS6428943A/en
Publication of JPS6428943A publication Critical patent/JPS6428943A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent a part between leads from being shortcircuited during a manufacturing process of a package and to suppress an occurrence rate of a defective package by a method wherein a stepped part is formed at a peripheral part of a lead of an insulating case used to seal a semiconductor device. CONSTITUTION:A stepped part A is formed in a PGA package 11 in such a way that a lattice groove 12 whose cross section is rectangular is formed at a peripheral part of an external connection terminal 7. In a package for a semiconductor integrated circuit constituted in this manner, a creeping distance between two mutually adjacent external connection terminals 7 becomes a size which is obtained by adding an interval L between two leads to a doubled value of a depth of the lattice groove 12; accordingly, it is possible to set the creeping distance between the external connection terminals 7 on the PGA package 11 to a large value. Accordingly, even when the number of the external connection terminals 7 is increased due to the high integration of a semiconductor device 4, or even when an outer shape of the PGA package 11 is reduced, it is possible to prevent a part between the external connection terminals 7 from being short-circuited during a manufacturing process of the package by using a bonding material 8.
JP18594687A 1987-07-24 1987-07-24 Package for semiconductor integrated circuit Pending JPS6428943A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18594687A JPS6428943A (en) 1987-07-24 1987-07-24 Package for semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18594687A JPS6428943A (en) 1987-07-24 1987-07-24 Package for semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS6428943A true JPS6428943A (en) 1989-01-31

Family

ID=16179646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18594687A Pending JPS6428943A (en) 1987-07-24 1987-07-24 Package for semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS6428943A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5124503A (en) * 1990-12-13 1992-06-23 Allied-Signal Inc. Dichlorotrifluoroethane stabilized to minimize hydrolysis thereof
US5380449A (en) * 1991-04-05 1995-01-10 Alliedsignal Inc. Stabilized dichlorotrifluoroethane refrigeration compositions
WO2008146531A1 (en) * 2007-05-29 2008-12-04 Kyocera Corporation Electronic component storing package and electronic device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5124503A (en) * 1990-12-13 1992-06-23 Allied-Signal Inc. Dichlorotrifluoroethane stabilized to minimize hydrolysis thereof
US5380449A (en) * 1991-04-05 1995-01-10 Alliedsignal Inc. Stabilized dichlorotrifluoroethane refrigeration compositions
WO2008146531A1 (en) * 2007-05-29 2008-12-04 Kyocera Corporation Electronic component storing package and electronic device
JP5106528B2 (en) * 2007-05-29 2012-12-26 京セラ株式会社 Electronic component storage package and electronic device
US8405200B2 (en) 2007-05-29 2013-03-26 Kyocera Corporation Electronic-component-housing package and electronic device

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