JPS6428247A - Composition for forming electrically conductive film - Google Patents
Composition for forming electrically conductive filmInfo
- Publication number
- JPS6428247A JPS6428247A JP18309787A JP18309787A JPS6428247A JP S6428247 A JPS6428247 A JP S6428247A JP 18309787 A JP18309787 A JP 18309787A JP 18309787 A JP18309787 A JP 18309787A JP S6428247 A JPS6428247 A JP S6428247A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- powder
- solder
- particle diameter
- conductive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title abstract 6
- 239000000843 powder Substances 0.000 abstract 7
- 229910052802 copper Inorganic materials 0.000 abstract 3
- 239000010949 copper Substances 0.000 abstract 3
- 229910052751 metal Inorganic materials 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 239000002245 particle Substances 0.000 abstract 3
- 229910052709 silver Inorganic materials 0.000 abstract 3
- 229910000679 solder Inorganic materials 0.000 abstract 3
- 229910052718 tin Inorganic materials 0.000 abstract 3
- 239000011135 tin Substances 0.000 abstract 3
- 239000000956 alloy Substances 0.000 abstract 2
- 229910045601 alloy Inorganic materials 0.000 abstract 2
- 229910052782 aluminium Inorganic materials 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- 229910052725 zinc Inorganic materials 0.000 abstract 2
- 239000011701 zinc Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052797 bismuth Inorganic materials 0.000 abstract 1
- 229910052745 lead Inorganic materials 0.000 abstract 1
- 238000002156 mixing Methods 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 238000004321 preservation Methods 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
Landscapes
- Glass Compositions (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18309787A JPS6428247A (en) | 1987-07-21 | 1987-07-21 | Composition for forming electrically conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18309787A JPS6428247A (en) | 1987-07-21 | 1987-07-21 | Composition for forming electrically conductive film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6428247A true JPS6428247A (en) | 1989-01-30 |
| JPH0475856B2 JPH0475856B2 (enrdf_load_stackoverflow) | 1992-12-02 |
Family
ID=16129712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18309787A Granted JPS6428247A (en) | 1987-07-21 | 1987-07-21 | Composition for forming electrically conductive film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6428247A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7157023B2 (en) | 2001-04-09 | 2007-01-02 | E. I. Du Pont De Nemours And Company | Conductor compositions and the use thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59213639A (ja) * | 1983-05-02 | 1984-12-03 | バロ−ス・コ−ポレ−シヨン | ガラス組成物および該ガラス組成物を含むインキ組成物 |
-
1987
- 1987-07-21 JP JP18309787A patent/JPS6428247A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59213639A (ja) * | 1983-05-02 | 1984-12-03 | バロ−ス・コ−ポレ−シヨン | ガラス組成物および該ガラス組成物を含むインキ組成物 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7157023B2 (en) | 2001-04-09 | 2007-01-02 | E. I. Du Pont De Nemours And Company | Conductor compositions and the use thereof |
| US7914709B2 (en) | 2001-04-09 | 2011-03-29 | E.I. Du Pont De Nemours And Company | Conductor compositions and the use thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0475856B2 (enrdf_load_stackoverflow) | 1992-12-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4400214A (en) | Conductive paste | |
| US5851482A (en) | Tin-bismuth based lead-free solder for copper and copper alloys | |
| CA1113741A (en) | Electrical contact materials containing internally oxidized silver alloys | |
| GB1496994A (en) | Pastes for forming electrically conductive films on non-conductive substrates | |
| US3838071A (en) | High adhesion silver-based metallizations | |
| KR100328157B1 (ko) | 카드뮴부재땜납용은합금 | |
| CA1103013A (en) | Silver compositions | |
| US20020127136A1 (en) | Lead-free solder and soldered article | |
| JPH08243782A (ja) | はんだ合金およびそれを用いたはんだ付け方法 | |
| ATE284294T1 (de) | Bleifreie lötlegierung und deren verwendung in elektronischen bauelementen | |
| JPH08132277A (ja) | 無鉛はんだ | |
| US5341981A (en) | Use of a cadmium-free silver alloy as brazing solder (III) | |
| JPS6428247A (en) | Composition for forming electrically conductive film | |
| JP2001131663A (ja) | リードメッキ用Ｓｎ合金 | |
| JPS6158542B2 (enrdf_load_stackoverflow) | ||
| RU97114675A (ru) | Металлоплакирующий концентрат | |
| US5531962A (en) | Cadmium-free silver alloy brazing solder, method of using said solder, and metal articles brazed with said solder | |
| JPS5471719A (en) | Electrical contact point material | |
| Lee et al. | Surface oxidation of molten sn (ag, ni, in, cu) alloys | |
| JPS56144893A (en) | Solder alloy for fitting lead on silver electrode | |
| JPH01137516A (ja) | 導電性被膜形成用組成物 | |
| DE2638836B2 (de) | Dentallot-Legierung auf Silber-Basis | |
| JP2006026745A (ja) | はんだ組成物およびはんだ付け物品 | |
| JPS60923B2 (ja) | セラミック半導体用電極材料 | |
| Dinsdale | Tin in Connector Finishes |