JPS6426850U - - Google Patents
Info
- Publication number
- JPS6426850U JPS6426850U JP12114587U JP12114587U JPS6426850U JP S6426850 U JPS6426850 U JP S6426850U JP 12114587 U JP12114587 U JP 12114587U JP 12114587 U JP12114587 U JP 12114587U JP S6426850 U JPS6426850 U JP S6426850U
- Authority
- JP
- Japan
- Prior art keywords
- leads
- plating layer
- conductivity
- pins
- stitch bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical group [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図ａ
及びｂは第１図のピンのＡ―Ａ′線断面図及びＢ
―Ｂ′線断面図、第３図は従来のＩＣパツケージ
の一例の斜視図である。
１……セラミツク基板、２……電源用リード、
３……ＧＮＤリード、４１……信号用リード、５
……タングステン芯線、６……ニツケルめつき層
、７……金めつき層、Ｌ１，Ｌ１１，ｌ１……内
部配線層、Ｐ１，Ｐ１１，ｐ１……ピン、Ｓ１，
Ｓ１１，ｓ１……ステツチ。
Figure 1 is a perspective view of an embodiment of the present invention, Figure 2a
and b are cross-sectional views taken along line A-A' of the pin in Figure 1, and B.
3 is a perspective view of an example of a conventional IC package. 1...Ceramic board, 2...Power lead,
3...GND lead, 4 1 ...Signal lead, 5
... Tungsten core wire, 6 ... Nickel plating layer, 7 ... Gold plating layer, L 1 , L 11 , l 1 ... Internal wiring layer, P 1 , P 11 , p 1 ... Pin, S 1 ,
S 11 , s 1 ...stitch.
Claims (1)
ンデイングパツドと、外部に接続するピンと、該
ピン及び前記ステツチボンデイングパツド間を対
応して接続する内部配線層とを有する複数のリー
ドとを含むＩＣパツケージにおいて、前記複数の
リードのうち少なくとも２つのリードの外側めつ
き層の導電度が他のリードの外側めつき層の導電
度よりも高いことを特徴とするＩＣパツケージ。 It includes a stitch bonding pad arranged to surround an IC chip, a plurality of leads having externally connected pins, and an internal wiring layer correspondingly connecting the pins and the stitch bonding pads. An IC package characterized in that the conductivity of the outer plating layer of at least two of the plurality of leads is higher than the conductivity of the outer plating layer of the other leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12114587U JPS6426850U (en) | 1987-08-06 | 1987-08-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12114587U JPS6426850U (en) | 1987-08-06 | 1987-08-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6426850U true JPS6426850U (en) | 1989-02-15 |
Family
ID=31367890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12114587U Pending JPS6426850U (en) | 1987-08-06 | 1987-08-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6426850U (en) |
-
1987
- 1987-08-06 JP JP12114587U patent/JPS6426850U/ja active Pending
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