JPS58170848U - Electronic component package - Google Patents
Electronic component packageInfo
- Publication number
- JPS58170848U JPS58170848U JP6835182U JP6835182U JPS58170848U JP S58170848 U JPS58170848 U JP S58170848U JP 6835182 U JP6835182 U JP 6835182U JP 6835182 U JP6835182 U JP 6835182U JP S58170848 U JPS58170848 U JP S58170848U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- electronic component
- component package
- package
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の電子部品パッケージを示す平面、図ミ第
２図はその中央横断面図、第３図は本考案によ゛る電子
部品パッケージを示す平面図、第４図はその中央横断面
図である。
２・・・・・・チップ、３・・・・・・外部リード線、
３６・・・・・・ ′グランド線、３５・・・
・・・信号線、４，７・・・・・・連結線、６・・・・
・・グランド層、８・・曲モールド、９・・曲挿入
□端子、１１・・・・・・電子部品パッケージ
。FIG. 1 is a plan view showing a conventional electronic component package, FIG. 2 is a cross-sectional view of the center of the package, FIG. It is a front view. 2... Chip, 3... External lead wire,
36...' Ground wire, 35...
...Signal line, 4,7...Connection line, 6...
...Ground layer, 8..Song mold, 9..Song insertion
□Terminal, 11...Electronic component package.
Claims (1)
周辺のポンディングパッドと外部リード線とを連結線で
接続して上記チップを封入してなる電子部品パッケージ
において、該チップの下方又は上方の近傍に上記外部リ
ード線の端末部までのびるグランド層を埋め込み、上記
チップのグランドパッドをグランド線に接続すると共に
上記グランド層にも接続したことを特徴とする電子部品In an electronic component package in which the chip is encapsulated by connecting bonding pads around the chip with circuit elements built on a substrate and interconnections between the chips and external lead wires using connection wires, the chip is enclosed in a package that is located below or above the chip. An electronic component characterized in that a ground layer extending to the end of the external lead wire is embedded near the terminal, and the ground pad of the chip is connected to the ground line and also connected to the ground layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6835182U JPS58170848U (en) | 1982-05-11 | 1982-05-11 | Electronic component package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6835182U JPS58170848U (en) | 1982-05-11 | 1982-05-11 | Electronic component package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58170848U true JPS58170848U (en) | 1983-11-15 |
Family
ID=30078135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6835182U Pending JPS58170848U (en) | 1982-05-11 | 1982-05-11 | Electronic component package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58170848U (en) |
-
1982
- 1982-05-11 JP JP6835182U patent/JPS58170848U/en active Pending
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