JPS6426838U - - Google Patents

Info

Publication number
JPS6426838U
JPS6426838U JP1987122751U JP12275187U JPS6426838U JP S6426838 U JPS6426838 U JP S6426838U JP 1987122751 U JP1987122751 U JP 1987122751U JP 12275187 U JP12275187 U JP 12275187U JP S6426838 U JPS6426838 U JP S6426838U
Authority
JP
Japan
Prior art keywords
lead
semiconductor element
semiconductor device
tape carrier
punch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987122751U
Other languages
Japanese (ja)
Other versions
JPH056658Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987122751U priority Critical patent/JPH056658Y2/ja
Publication of JPS6426838U publication Critical patent/JPS6426838U/ja
Application granted granted Critical
Publication of JPH056658Y2 publication Critical patent/JPH056658Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の第一の実施例を説明するため
のリード修正装置の縦断面図、第２図は本考案の
第二の実施例を説明するためのリード修正装置の
縦断面図、第３図は従来の一例を説明するための
リード修正装置の縦断面図である。 １……修正ポンチ、２……凹部、３……下型、
４……角穴、５……位置決めピン、６……半導体
素子、７……突起電極、８……リードフレーム、
８ａ……リード、９……プラスチツクテープ、１
０……位置決め穴、１１……素子組込み穴、１２
……下型テーパー部、１３……ポンチテーパー部
、１４……コーナー部。 FIG. 1 is a longitudinal cross-sectional view of a lead correction device for explaining a first embodiment of the present invention, FIG. 2 is a longitudinal cross-sectional view of a lead correction device for explaining a second embodiment of the present invention, FIG. 3 is a longitudinal sectional view of a lead correction device for explaining a conventional example. 1... Correction punch, 2... Concavity, 3... Lower mold,
4... Square hole, 5... Positioning pin, 6... Semiconductor element, 7... Projection electrode, 8... Lead frame,
8a...Lead, 9...Plastic tape, 1
0...Positioning hole, 11...Element assembly hole, 12
...Lower die taper part, 13...Punch taper part, 14...Corner part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 上型として柔軟性材料を用い且つ半導体素子に
対応させるための下面に凹部を形成した半導体素
子のリード修正用ポンチと、前記リード修正用ポ
ンチに対向し、前記半導体素子を収容するために
中央に形成した角穴と前記半導体素子のリードを
固着されたテープキヤリアを載置するための案内
用位置決めピンとを有する下型とを含み、前記凹
部の形成により前記修正用ポンチが前記半導体素
子本体に触れることなく前記半導体素子のリード
を一定量だけ下方に塑性変形させることを特徴と
するテープキヤリア半導体装置のリード修正装置
。 A punch for repairing leads of a semiconductor device, which uses a flexible material as an upper mold and has a recess formed on the lower surface to accommodate the semiconductor device; a lower mold having a square hole formed therein and a guide positioning pin for placing a tape carrier to which the lead of the semiconductor element is fixed, and the correction punch comes into contact with the semiconductor element main body by forming the recess. A lead correction device for a tape carrier semiconductor device, characterized in that the lead of the semiconductor element is plastically deformed downward by a certain amount without causing any damage.
JP1987122751U 1987-08-10 1987-08-10 Expired - Lifetime JPH056658Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987122751U JPH056658Y2 (en) 1987-08-10 1987-08-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987122751U JPH056658Y2 (en) 1987-08-10 1987-08-10

Publications (2)

Publication Number Publication Date
JPS6426838U true JPS6426838U (en) 1989-02-15
JPH056658Y2 JPH056658Y2 (en) 1993-02-19

Family

ID=31370973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987122751U Expired - Lifetime JPH056658Y2 (en) 1987-08-10 1987-08-10

Country Status (1)

Country Link
JP (1) JPH056658Y2 (en)

Also Published As

Publication number Publication date
JPH056658Y2 (en) 1993-02-19

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