JPH0313763U - - Google Patents
Info
- Publication number
- JPH0313763U JPH0313763U JP1989075070U JP7507089U JPH0313763U JP H0313763 U JPH0313763 U JP H0313763U JP 1989075070 U JP1989075070 U JP 1989075070U JP 7507089 U JP7507089 U JP 7507089U JP H0313763 U JPH0313763 U JP H0313763U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- lead frame
- positioning
- molding
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案の具体的な一実施例に係るＬＥ
Ｄ成形用治具を示した構成図。第２図は第１図の
−線に沿つた断面図。第３図は従来のＬＥＤ
成形用治具を示した第２図に対応した断面図であ
る。
１１……半導体チツプ、１２……リードフレー
ム、１３……台板、１５……成形型、１６……型
押え部材、１７……支え板、１９……樹脂。
FIG. 1 shows an LE according to a specific embodiment of the present invention.
The configuration diagram showing the D-forming jig. FIG. 2 is a sectional view taken along the - line in FIG. 1. Figure 3 shows conventional LED
FIG. 2 is a cross-sectional view corresponding to FIG. 2 showing the molding jig. DESCRIPTION OF SYMBOLS 11... Semiconductor chip, 12... Lead frame, 13... Base plate, 15... Molding die, 16... Embossing member, 17... Support plate, 19... Resin.
Claims (1)
形型とを位置決めして樹脂成形するＬＥＤ成形用
治具において、 前記成形型を前後・左右方向に位置決めする台
板と、 前記台板に対して前記成形型を上下方向に固定
する型押え部材と、 長穴を有し該長穴にてネジ止めすることにより
前記成形型に対してスリツト部が垂直方向となり
該スリツト部に前記リードフレームの厚み方向を
差し込むことにより前記リードフレームと前記成
形型との上下・前後方向の位置決めをするように
した支え板と、 前記リードフレームと前記成形型との左右方向
の位置決めをするために前記リードフレームの縦
の隙間に挿入されるその隙間間隔と略等しい直径
のピンと を備えたことを特徴とするＬＥＤ成形用治具。[Scope of Claim for Utility Model Registration] An LED molding jig for positioning a lead frame to which a semiconductor chip is bonded and a mold for resin molding, comprising: a base plate for positioning the mold in the front-back and left-right directions; a mold holding member that vertically fixes the mold to the base plate; and a mold holding member having an elongated hole, and by screwing into the elongated hole, the slit portion becomes perpendicular to the mold. a support plate configured to position the lead frame and the mold in the vertical and front-back directions by inserting the lead frame in the thickness direction; and a support plate for positioning the lead frame and the mold in the left-right direction. A jig for molding an LED, comprising: a pin inserted into the vertical gap of the lead frame and having a diameter substantially equal to the gap interval.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989075070U JPH0755007Y2 (en) | 1989-06-27 | 1989-06-27 | LED molding jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989075070U JPH0755007Y2 (en) | 1989-06-27 | 1989-06-27 | LED molding jig |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0313763U true JPH0313763U (en) | 1991-02-12 |
| JPH0755007Y2 JPH0755007Y2 (en) | 1995-12-18 |
Family
ID=31615324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989075070U Expired - Lifetime JPH0755007Y2 (en) | 1989-06-27 | 1989-06-27 | LED molding jig |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0755007Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000225911A (en) * | 1999-01-11 | 2000-08-15 | Takata Corp | Knee supporting device |
| JP2007030733A (en) * | 2005-07-28 | 2007-02-08 | Nippon Plast Co Ltd | Airbag device |
| JP2017045771A (en) * | 2015-08-24 | 2017-03-02 | 京セラ株式会社 | Power semiconductor module manufacturing method and power semiconductor module |
-
1989
- 1989-06-27 JP JP1989075070U patent/JPH0755007Y2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000225911A (en) * | 1999-01-11 | 2000-08-15 | Takata Corp | Knee supporting device |
| JP2007030733A (en) * | 2005-07-28 | 2007-02-08 | Nippon Plast Co Ltd | Airbag device |
| JP2017045771A (en) * | 2015-08-24 | 2017-03-02 | 京セラ株式会社 | Power semiconductor module manufacturing method and power semiconductor module |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0755007Y2 (en) | 1995-12-18 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |