JPS6068641U - Resin casting jig - Google Patents

Resin casting jig

Info

Publication number
JPS6068641U
JPS6068641U JP15899083U JP15899083U JPS6068641U JP S6068641 U JPS6068641 U JP S6068641U JP 15899083 U JP15899083 U JP 15899083U JP 15899083 U JP15899083 U JP 15899083U JP S6068641 U JPS6068641 U JP S6068641U
Authority
JP
Japan
Prior art keywords
resin casting
casting jig
lead frame
resin
tie bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15899083U
Other languages
Japanese (ja)
Inventor
利彦 佐藤
Original Assignee
鹿児島日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 鹿児島日本電気株式会社 filed Critical 鹿児島日本電気株式会社
Priority to JP15899083U priority Critical patent/JPS6068641U/en
Publication of JPS6068641U publication Critical patent/JPS6068641U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は光電素子ペレットを搭載した従来のリードフレ
ーム、第２図Ａは従来の注型治具の断面図、第２図Ｂは
従来の注型治具の上面図、第２図Ｃはリードフレーム固
定板の正面図、第３図は本考案による光電素子ペレット
を搭載したリードフレーム、第４図Ａは本考案による注
型治具の上面図、第４図Ｂは第４図Ａのｘ−ｘ’断面図
。　　１１．５２・・・・・・光電素子ペレット、１２
．５１　　　。 ・・・・・・リードフレーム、１３，５４・・・・・・
タイバー、１４．５５・・・・・・パーフォレーション
、５３・・・・・・位置決め用リード、２３．３５・・
・・・・位置決めピン、２１．３３，６２，７２・・・
・・・注型ケース、２２゜３２．６３，７３・・・・・
・キャビティ、２４，８０・・・・・・注型治具、６１
，７１・・・・・・金属板、６４，７４・・・・・・リ
ードフレーム支持部、６５，７５・・・・・・リードフ
レーム支持部溝、６６．７６・・・・・・リードフレー
ム保持部、６７．７７・・・・・・リードフレーム保持
部のタイバーストップ部面、４１・・・・・・位置決め
ピン穴、４２・・・・・・リードフレーム固定ピン、４
３・・・・・・リードフレーム固定板、αｍｍａａａｍ
リードフレーム保持部のタイバーストップ部面高さ。Figure 1 is a conventional lead frame with a photoelectric element pellet mounted on it, Figure 2A is a cross-sectional view of a conventional casting jig, Figure 2B is a top view of a conventional casting jig, and Figure 2C is a top view of a conventional casting jig. 3 is a front view of a lead frame fixing plate, FIG. 3 is a lead frame on which a photoelectric element pellet according to the present invention is mounted, FIG. 4A is a top view of a casting jig according to the present invention, and FIG. 4B is a view of FIG. xx' cross-sectional view. 11.52...Photoelectric element pellet, 12
．． 51. ...Lead frame, 13,54...
Tie bar, 14.55... Perforation, 53... Positioning lead, 23.35...
...Positioning pin, 21.33,62,72...
...Casting case, 22゜32.63,73...
・Cavity, 24, 80... Casting jig, 61
, 71... Metal plate, 64, 74... Lead frame support section, 65, 75... Lead frame support groove, 66.76... Lead Frame holding part, 67.77... Tie bar stop part surface of lead frame holding part, 41... Positioning pin hole, 42... Lead frame fixing pin, 4
3...Lead frame fixing plate, αmmaaam
The height of the tie bar stop part of the lead frame holding part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 薄い金属板の個々の穴部に、樹脂注型ケース部と位置決
めリードを支持する溝付き支持部とリードフレームのタ
イバ一部両端を保持する保持部が合成樹脂にて成形され
、かつ固定されていることを特徴とする樹脂注型治具。A grooved support part that supports the resin casting case part and the positioning lead, and a holding part that holds both ends of the tie bar part of the lead frame are molded and fixed with synthetic resin into each hole of the thin metal plate. A resin casting jig characterized by:
JP15899083U 1983-10-14 1983-10-14 Resin casting jig Pending JPS6068641U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15899083U JPS6068641U (en) 1983-10-14 1983-10-14 Resin casting jig

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15899083U JPS6068641U (en) 1983-10-14 1983-10-14 Resin casting jig

Publications (1)

Publication Number Publication Date
JPS6068641U true JPS6068641U (en) 1985-05-15

Family

ID=30350113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15899083U Pending JPS6068641U (en) 1983-10-14 1983-10-14 Resin casting jig

Country Status (1)

Country Link
JP (1) JPS6068641U (en)

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