JPS6449317U - - Google Patents
Info
- Publication number
- JPS6449317U JPS6449317U JP14713187U JP14713187U JPS6449317U JP S6449317 U JPS6449317 U JP S6449317U JP 14713187 U JP14713187 U JP 14713187U JP 14713187 U JP14713187 U JP 14713187U JP S6449317 U JPS6449317 U JP S6449317U
- Authority
- JP
- Japan
- Prior art keywords
- punch
- die
- lead
- semiconductor device
- forming apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Bending Of Plates, Rods, And Pipes (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例を示す断面図、第
２図は従来装置の断面図、第３図は第２図の―
線における正面図、第４図は成形前の半導体装
置を示す側面図である。図において４はパンチ、
１はダイ１６はスプリングである。なお図中、同
一符号は同一、又は相当部分を示す。
Fig. 1 is a sectional view showing an embodiment of this invention, Fig. 2 is a sectional view of a conventional device, and Fig. 3 is a sectional view of the device shown in Fig. 2.
FIG. 4 is a front view taken along the line, and FIG. 4 is a side view showing the semiconductor device before molding. In the figure, 4 is a punch,
1 is a die 16 is a spring. In the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
で曲げ加工するリード成形装置において、上記パ
ンチの加圧時に、上記パンチを上記ダイとは反対
側へ変位し得るように構成すると共に、上記パン
チを上記ダイに向つて弾性体で不勢し得るように
したことを特徴とする半導体装置用リード成形装
置。 A lead forming apparatus for bending a lead of a semiconductor device using a forming punch and a die, wherein the punch is configured to be able to be displaced to a side opposite to the die when the punch is pressurized, and the punch is A lead forming apparatus for a semiconductor device, characterized in that it can be biased toward the die by an elastic body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14713187U JPS6449317U (en) | 1987-09-24 | 1987-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14713187U JPS6449317U (en) | 1987-09-24 | 1987-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6449317U true JPS6449317U (en) | 1989-03-27 |
Family
ID=31417258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14713187U Pending JPS6449317U (en) | 1987-09-24 | 1987-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6449317U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7671637B2 (en) | 2005-06-28 | 2010-03-02 | E2V Semiconductors | Differential transistor pair current switch supplied by a low voltage VCC |
-
1987
- 1987-09-24 JP JP14713187U patent/JPS6449317U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7671637B2 (en) | 2005-06-28 | 2010-03-02 | E2V Semiconductors | Differential transistor pair current switch supplied by a low voltage VCC |