JPH0220348U - - Google Patents
Info
- Publication number
- JPH0220348U JPH0220348U JP9904288U JP9904288U JPH0220348U JP H0220348 U JPH0220348 U JP H0220348U JP 9904288 U JP9904288 U JP 9904288U JP 9904288 U JP9904288 U JP 9904288U JP H0220348 U JPH0220348 U JP H0220348U
- Authority
- JP
- Japan
- Prior art keywords
- die set
- roller
- lead
- semiconductor device
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
Description
第１図はこの考案の一実施例を示す断面図、第
２図は従来のリード成形装置の断面図、第３図は
成形前の半導体装置の側面図、第４図は成形後の
側面図を示す。
図中、１は上型ダイセツト、７はローラーホル
ダー、９はカムガイド用ローラー、１３は下型ダ
イセツト、１５はダイ、１６はカム、２０はリー
ド曲げ用ローラーである。なお、図中同一符号は
同一又は相当部分を示す。
Fig. 1 is a sectional view showing an embodiment of this invention, Fig. 2 is a sectional view of a conventional lead forming device, Fig. 3 is a side view of a semiconductor device before forming, and Fig. 4 is a side view after forming. shows. In the figure, 1 is an upper die set, 7 is a roller holder, 9 is a cam guide roller, 13 is a lower die set, 15 is a die, 16 is a cam, and 20 is a lead bending roller. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
られた成形用のローラーと下型ダイセツトに取付
られたダイとで曲げ加工するようにしたリード成
形装置において、上型ダイセツトに連結されて上
下動するローラホルダーに、下型ダイセツトに固
定されたカムと接触するカムガイド用のローラー
と、リード曲げ加工用のローラーとを併設したこ
とを特徴とする半導体装置用リード成形装置。 In a lead forming device that bends semiconductor device leads using a forming roller attached to an upper die set and a die attached to a lower die set, a roller holder is connected to the upper die set and moves up and down. A lead forming apparatus for a semiconductor device, comprising: a cam guide roller that contacts a cam fixed to a lower die set; and a lead bending roller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9904288U JPH0220348U (en) | 1988-07-25 | 1988-07-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9904288U JPH0220348U (en) | 1988-07-25 | 1988-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0220348U true JPH0220348U (en) | 1990-02-09 |
Family
ID=31325838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9904288U Pending JPH0220348U (en) | 1988-07-25 | 1988-07-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0220348U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102343407A (en) * | 2011-08-25 | 2012-02-08 | 铜陵三佳山田科技有限公司 | Pin-forming mold for integrated circuits |
| JP2016112613A (en) * | 2014-12-18 | 2016-06-23 | 株式会社デンソー | Bending device |
-
1988
- 1988-07-25 JP JP9904288U patent/JPH0220348U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102343407A (en) * | 2011-08-25 | 2012-02-08 | 铜陵三佳山田科技有限公司 | Pin-forming mold for integrated circuits |
| JP2016112613A (en) * | 2014-12-18 | 2016-06-23 | 株式会社デンソー | Bending device |