JPH0254244U - - Google Patents
Info
- Publication number
- JPH0254244U JPH0254244U JP13311588U JP13311588U JPH0254244U JP H0254244 U JPH0254244 U JP H0254244U JP 13311588 U JP13311588 U JP 13311588U JP 13311588 U JP13311588 U JP 13311588U JP H0254244 U JPH0254244 U JP H0254244U
- Authority
- JP
- Japan
- Prior art keywords
- bending
- leads
- semiconductor device
- lead
- lead forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の半導体装置リード成形装置を
示す全体図、第２図ａは本考案の曲げ開始図、第
２図ｂは本考案の曲げ途中図、第２図ｃは本考案
の終了図、第３図は従来のリード成形装置を示す
全体図、第４図ａは従来の曲げ途中図、第４図ｂ
は従来の曲げ終了図である。
１……曲げポンチ、２……曲げダイ、３……リ
ード押さえ、４……ポンチ取付ブロツク、５……
製品、５ａ……リード、６……軸。
FIG. 1 is an overall view showing the semiconductor device lead forming apparatus of the present invention, FIG. 2 a is a diagram of the beginning of bending of the present invention, FIG. 2 b is a mid-bending diagram of the present invention, and FIG. 2 c is an end view of the present invention. 3 is an overall view showing a conventional lead forming device, FIG.
is a conventional bending end view. 1...Bending punch, 2...Bending die, 3...Lead holder, 4...Punch mounting block, 5...
Product, 5a...Lead, 6...Axis.
Claims (1)
ついて折曲成形の加工を行うリード成形装置にお
いて、曲げポンチと曲げダイとの粗を備え、該曲
げポンチを軸のまわりに回動させて前記リードを
設定折曲角度範囲を超えて圧下して折曲加工する
機構を有することを特徴とする半導体装置用リー
ド成形装置。 A lead forming device that bends and forms the leads of a semiconductor device using a lead frame is equipped with a bending punch and a bending die, and rotates the bending punch around an axis to set and bend the leads. 1. A lead forming apparatus for a semiconductor device, characterized by having a mechanism for bending by pressing down beyond a bending angle range.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13311588U JPH0254244U (en) | 1988-10-12 | 1988-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13311588U JPH0254244U (en) | 1988-10-12 | 1988-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0254244U true JPH0254244U (en) | 1990-04-19 |
Family
ID=31390693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13311588U Pending JPH0254244U (en) | 1988-10-12 | 1988-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0254244U (en) |
-
1988
- 1988-10-12 JP JP13311588U patent/JPH0254244U/ja active Pending