CN102343407A - Pin-forming mold for integrated circuits - Google Patents

Pin-forming mold for integrated circuits Download PDF

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Publication number
CN102343407A
CN102343407A CN2011102444747A CN201110244474A CN102343407A CN 102343407 A CN102343407 A CN 102343407A CN 2011102444747 A CN2011102444747 A CN 2011102444747A CN 201110244474 A CN201110244474 A CN 201110244474A CN 102343407 A CN102343407 A CN 102343407A
Authority
CN
China
Prior art keywords
auxiliary wheel
wedge
pin
main roller
wheel
Prior art date
Application number
CN2011102444747A
Other languages
Chinese (zh)
Inventor
李庆生
Original Assignee
铜陵三佳山田科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 铜陵三佳山田科技有限公司 filed Critical 铜陵三佳山田科技有限公司
Priority to CN2011102444747A priority Critical patent/CN102343407A/en
Publication of CN102343407A publication Critical patent/CN102343407A/en

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Abstract

The invention belongs to the field of press-forming integrated circuits and particularly relates to a pin-forming mold for DIP (Dual Inline Package)/IDF (Intermediate Distributing Frame) package integrated circuits. The mold comprises a fixing device which is used for holding down a product to be formed and pins of the product; conjugate roller wheel devices which are used for enabling pins to be formed are respectively arranged at two sides of the fixing device; and a taper wedge device which is used for guiding the conjugate roller wheel device to work is arranged at one side of each of the conjugate roller wheel devices far away from the fixing device. The mold is made from a pair of conjugate roller wheels, i.e. main roller wheels and auxiliary roller wheels, which can swing; when the pins are formed, the main roller wheels and the auxiliary roller wheels generate conjugate movement, i.e. the main roller wheels and the auxiliary roller wheels mutually rotate in opposite directions so as to ensure that the pins of the product are formed by means of pure rolling, thus the quality of the product can be greatly improved; and meanwhile, the phenomenon of clamping stagnation generated between a mandrel and roller wheels in a single-roller wheel forming manner can be avoided.

Description

A kind of pin mould that is used for integrated circuit

Technical field

The invention belongs to integrated circuit compression moulding field, be specifically related to a kind of pin mould of the DIP/IDF of being used for class packaged integrated circuits.

Background technology

The dual-inline package technology is also claimed in DIP encapsulation, and English is Dual In-line Package, is a kind of simple package mode, and most middle small scale integrated circuits (IC) all adopt this packing forms.The pin molding mode of traditional comparatively general DIP class encapsulation is rigidity molding mode or single roller molding mode.What initial row adopted in the industry all is the rigidity molding mode; The rigidity molding mode is simple in structure; Forming convax mould and die all are fixed; Because being the mode that adopts punch to slide on the pin surface, the rigidity molding mode makes the pin moulding; Will inevitably cause the tin coating on pin surface to be scratched, after particularly long-time the use, because the accumulation of convex mould surface tin layer; Might make the pin surface of product occur revealing the copper phenomenon, finally cause product rejection.

In order to address the above problem; Present universal mode is to adopt single roller molding mode that the pin of product is carried out moulding in the industry; With respect to the sliding friction of rigidity molding mode, the rolling friction mode of single roller moulding can reduce the destruction to pin coating, thereby has improved the quality of product.But single roller molding mode still is not pure rolling friction mode, particularly mandrel and roller can produce catching phenomenon after long-time the use, the roller during clamping stagnation can't roll, and therefore can become the sliding friction moulding again again.And single roller moulding is the same with the rigidity moulding, and forming convax mould and die all are fixed, bothers very much if want to be adjusted to molded dimension.

Summary of the invention

The purpose of this invention is to provide a kind of pin mould that is used for integrated circuit, this pin mould can come the pin of product is carried out moulding with the mode of pure rolling, can greatly improve the quality of product.

For realizing the foregoing invention purpose; The technical scheme that the present invention adopted is: a kind of pin mould that is used for integrated circuit; This mould comprises and is used for fixture that product to be formed and pin thereof are compressed; The both sides of said fixture are provided with the conjugation roller devices that is used to make the pin moulding, and said conjugation roller devices is provided with the wedge device that is used to guide the work of conjugation roller devices away from a side of fixture.

Simultaneously, the present invention can also be able to further realization through following technical measures:

Said fixture comprises the recessed film of moulding that is used to set up product to be formed, also comprises the binder block that is pressed against product upside to be formed and leans the ejection block at product downside to be formed; Said binder block is arranged in the holding pad, and binder block and holding pad constitute and be slidingly matched; The downside of holding pad is provided with the supporting leg that is pressed against on the pin; The upside of said holding pad extends upward with cope match-plate pattern and links to each other, and said cope match-plate pattern is provided with the elasticity material pressing device that holding pad is compressed.

Said conjugation roller devices comprises main roller and the auxiliary wheel that is connected with cope match-plate pattern, and the rotating shaft of main roller and auxiliary wheel is parallel to each other; The outer wheel face of said main roller is pressed against on the pin during pin moulding; The outer wheel face of said auxiliary wheel abut in the wedge device on the medial surface of product to be formed, the outer wheel face of main roller and auxiliary wheel against each other together and the direction of rotation of the two opposite.

Said elasticity material pressing device comprises the binder pad that is arranged in the cope match-plate pattern; Said binder pad is pressed against the top of holding pad; Said elasticity material pressing device also comprises the compression spring of the upside that is arranged on the binder pad; The compression spring housing is located in the inner chamber of tubular spring fixed seat; The upper end of said spring fixed seat extends upward and stretches out the top outer at cope match-plate pattern, and the top of cope match-plate pattern is provided with and is set in the tubular spring fixed seat outside and the locking nut that spring fixed seat is fixing.

The rotating shaft of said main roller and auxiliary wheel is on the same horizontal plane; The spacing between the predetermined bending part of the medial surface of product to be formed and product pin to be formed of said wedge device equates with the diameter sum of main roller and auxiliary wheel.

Said main roller is fixed on the main roller holder through first rotating shaft; Auxiliary wheel is fixed on the auxiliary wheel holder through second rotating shaft; The swing roller bearing passes said main roller holder and auxiliary wheel holder successively and the two is fixed on the side plate that is connected with cope match-plate pattern; Said main roller holder and auxiliary wheel holder all are rotatably assorted with swing roller bearing formation, and the rotating shaft of the axis of said swing roller bearing and main roller and auxiliary wheel is parallel to each other; The shape of said main roller holder and auxiliary wheel holder makes the outer wheel face of main roller and auxiliary wheel be in the same place against each other, and make the outer wheel face of auxiliary wheel abut in the wedge device on the medial surface of product to be formed.

The diameter of said main roller and auxiliary wheel is equal to each other.

The side of said main roller or auxiliary wheel also is provided with the elastic displacement device on the medial surface of product to be formed that outer wheel face that the outer wheel face that makes the two abutted in together and made auxiliary wheel abuts in the wedge device.

The guiding mechanism that said wedge device comprises wedge and is arranged on the wedge side; Wedge is arranged on the lower bolster, and said wedge abuts in towards the medial surface of the vertical shape of product to be formed outer wheel face with auxiliary wheel, and the rotating shaft of the medial surface of this vertical shape of wedge and main roller and auxiliary wheel is parallel to each other.

Said guiding mechanism comprises the first adjustment pad and the second adjustment pad of the position that is used to adjust between wedge and the product to be formed; The said first adjustment pad is arranged on a side that deviates from product to be formed of wedge; The second adjustment pad is arranged on a side of the close product to be formed of wedge.

Beneficial effect of the present invention is:

1), the present invention also is that main roller and auxiliary wheel are formed by a pair of conjugation roller that can swing; When the pin moulding; Main roller and auxiliary wheel generation conjugate movement; Also be that main roller and auxiliary wheel rotate toward each other; Thereby guarantee to come the pin of product is carried out moulding, therefore can improve the quality of product greatly with the mode of pure rolling; Can avoid simultaneously the catching phenomenon that produces between the mandrel and roller in single roller molding mode.

2), because the conjugation roller can be swung, and simultaneously the wedge side is provided with the adjustment pad that can adjust the wedge position, therefore can just can adjust the compact dimensions of product easily through regulating corresponding adjustment pad.

Description of drawings

Fig. 1 is a die opening state structural representation of the present invention;

Fig. 2 is a matched moulds status architecture sketch map of the present invention;

Fig. 3 is the A portion enlarged diagram of Fig. 1;

Fig. 4 is the B portion enlarged diagram of Fig. 2.

The implication of mark is following among the figure:

1-spring fixed seat 2-compression spring 3-locking nut 4-cope match-plate pattern

5-binder pad, 6-holding pad, 7-main roller holder

8-swing roller bearing, 9-auxiliary wheel holder, 10-main roller

11-auxiliary wheel, 12-wedge, 13-molding concave die

14-the first adjustment pad, 15-the second adjustment pad, 16-lower bolster

17-binder block 18-product 19-ejection block to be formed.

The specific embodiment

Shown in Fig. 1~4; A kind of pin mould that is used for integrated circuit; This mould comprises and is used for fixture that product 18 to be formed and pin thereof are compressed; The both sides of said fixture are provided with the conjugation roller devices that is used to make the pin moulding, and said conjugation roller devices is provided with the wedge device that is used to guide the work of conjugation roller devices away from a side of fixture.

Preferably, said fixture comprises the recessed film 13 of moulding that is used to set up product 18 to be formed, also comprises the binder block 17 that is pressed against product 18 upsides to be formed and leans the ejection block 19 at product 18 downsides to be formed; Said binder block 17 is arranged in the holding pad 6, and binder block 17 is slidingly matched with holding pad 6 formations; The downside of holding pad 6 is provided with the supporting leg that is pressed against on the pin; The upside of said holding pad 6 extends upward with cope match-plate pattern 4 and links to each other, and said cope match-plate pattern 4 is provided with the elasticity material pressing device that holding pad 6 is compressed.

Like Fig. 1, shown in 2; Said elasticity material pressing device comprises the binder pad 5 that is arranged in the cope match-plate pattern 4; Said binder pad 5 is pressed against the top of holding pad 6; Said elasticity material pressing device also comprises the compression spring 2 of the upside that is arranged on binder pad 5; Compression spring 2 is sheathed in the inner chamber of tubular spring fixed seat 1; The upper end of said spring fixed seat 1 extends upward and stretches out the top outer at cope match-plate pattern 4, and the top of cope match-plate pattern 4 is provided with the locking nut 3 that is set in tubular spring fixed seat 1 outside and spring fixed seat 1 is fixed.

As preferred version of the present invention, shown in Fig. 1~4, said conjugation roller devices comprises the main roller 10 and auxiliary wheel 11 that is connected with cope match-plate pattern 4, and the rotating shaft of main roller 10 and auxiliary wheel 11 is parallel to each other; The outer wheel face of said main roller 10 is pressed against on the pin during pin moulding; The outer wheel face of said auxiliary wheel 11 abut in the wedge device on the medial surface of product 18 to be formed, the outer wheel face of main roller 10 and auxiliary wheel 11 against each other together and the direction of rotation of the two opposite.

More preferred, the rotating shaft of said main roller 10 and auxiliary wheel 11 is on the same horizontal plane; The spacing between the predetermined bending part of the medial surface of product 18 to be formed and product to be formed 18 pins of said wedge device equates with the diameter sum of main roller 10 and auxiliary wheel 11.

The diameter of said main roller 10 and auxiliary wheel 11 is equal to each other, and not only helps the two synchronous backward and rotates, and help later maintenance.

Shown in Fig. 1~4, said main roller 10 is fixed on the main roller holder 7 through first rotating shaft; Auxiliary wheel 11 is fixed on the auxiliary wheel holder 9 through second rotating shaft; Swing roller bearing 8 passes said main roller holder 7 successively and is fixed on the side plate that is connected with cope match-plate pattern 4 with auxiliary wheel holder 9 and with the two; Said main roller holder 7 all is rotatably assorted with swing roller bearing 8 formations with auxiliary wheel holder 9, and the rotating shaft of the axis of said swing roller bearing 8 and main roller 10 and auxiliary wheel 11 is parallel to each other; The shape of said main roller holder 7 and auxiliary wheel holder 9 makes the outer wheel face of main roller 10 and auxiliary wheel 11 be in the same place against each other, and make the outer wheel face of auxiliary wheel 11 abut in the wedge device on the medial surface of product 18 to be formed.

The shape of said main roller holder 7 and auxiliary wheel holder 9 makes the outer wheel face of main roller 10 and auxiliary wheel 11 be in the same place against each other; It also is the shape that main roller holder 7 and auxiliary wheel holder 9 can be designed to center of gravity deflection wedge device one side; Then when work; Main roller holder 7 will be close to each other under the effect of gravity with auxiliary wheel holder 9; And rely on medial surface away from the wedge device of product 18 to be formed; Thereby make the outer wheel face of main roller 10 and auxiliary wheel 11 be in the same place against each other, and make the outer wheel face of auxiliary wheel 11 abut in the wedge device on the medial surface of product 18 to be formed.

Further, the side of said main roller 10 or auxiliary wheel 11 also is provided with the elastic displacement device on the medial surface of product 18 to be formed that outer wheel face that the outer wheel face that makes the two abutted in together and made auxiliary wheel 11 abuts in the wedge device.

Said elastic displacement device can be chosen as compression spring or torsionspring; Its effect is that the outer wheel face that guarantees main roller 10 and auxiliary wheel 11 is in the same place against each other, and make the outer wheel face of auxiliary wheel 11 abut in the wedge device on the medial surface of product 18 to be formed.

Said wedge device comprises wedge 12 and the guiding mechanism that is arranged on wedge 12 sides; Wedge 12 is arranged on the lower bolster 16; Said wedge 12 abuts in towards the medial surface of the vertical shape of product 18 to be formed outer wheel face with auxiliary wheel 11, and the rotating shaft of the medial surface of this vertical shape of wedge 12 and main roller 10 and auxiliary wheel 11 is parallel to each other.

Preferably, said guiding mechanism comprises the first adjustment pad 14 and the second adjustment pad 15 of the position that is used to adjust between wedge 12 and the product to be formed 18; The said first adjustment pad 14 is arranged on a side of deviating from of wedge 12 product 18 to be formed; The second adjustment pad 15 is arranged on a side of the product 18 close to be formed of wedge 12.

Elaborate below in conjunction with Fig. 1~4 pair course of work of the present invention:

Products 18 to be formed from the forming die 13, the upper plate 4 started down, the pressure plate 4 the first feed block 17 driven to be pressed lightly on the upper surface of the molded product 18, and the pressing block 17 at the same time into the material forming die 13 18 has to be the guiding role of the molded product, and to be molded product 18 pin molding die 13 attached to the top surface; then continue down the template 4, making the pressure plate 6 in the binder that is spring compression spring 2 under the effect of the molded product 18 to be pressed firmly pin; subsequent main roller 10 and the auxiliary roller 11 into the inside of the wedge 12, the inner face of the wedge 12 for limiting the auxiliary roller 11; point 4 on the template continue down until the primary molded product to be encountered rollers 10 pins 18 and 12 so that the orientation of the wedge 18 to be the inner surface of the molded product and the molded product 18 to be bent at a predetermined pin spacing between the main roller 10 and the auxiliary wheel 11 of diameter equal to the sum; the auxiliary roller 11 abuts against the outer surface of the inner surface of the wedge 12, when the auxiliary roller 11 in the inner surface of the wedge 12 down, the auxiliary roller 11 around the second two shaft to rotate, and since the main roller 10 and the outer surface of the auxiliary roller 11 abutting together, the main roller 10 to rotate about the first axis, i.e. the role of friction, the main roller 10 and the occurrence of the auxiliary wheel 11 yoke movement, that is the main roller 10 and the auxiliary roller 11 do synchronized reverse rotation, while the main roller 10 and the auxiliary roller 11 (ie, conjugated wheel) to treat 18 pin molded products molding.

During die sinking, ejection block 19 can be lifted certain distance to the product after the moulding, makes things convenient for the product after the moulding to be transported to the material pipe from molding concave die 13.

From the above, in the forming process of product 18 to be formed, main roller 10 is the rolling moulding on the pin surface, does not destroy so can not produce the tin coating on pin surface, has therefore improved the quality of product greatly.

Simultaneously because main roller holder 7 can be around 8 swings of swing roller bearing with auxiliary wheel holder 9; So can adjust the position of wedge 12 through the mode of adjustment pad, also promptly adjust the position of wedge 12 through the mode of adjusting the first adjustment pad 14 and second pad 15; Main roller 10 then can come to adapt to automatically the adjustment of wedge 12 through oscillating quantity with auxiliary wheel 11, thereby can adjust the compact dimensions of product very easily, and need not revise molding concave die.

Claims (10)

1. pin mould that is used for integrated circuit; It is characterized in that: this mould comprises and is used for fixture that product to be formed (18) and pin thereof are compressed; The both sides of said fixture are provided with the conjugation roller devices that is used to make the pin moulding, and said conjugation roller devices is provided with the wedge device that is used to guide the work of conjugation roller devices away from a side of fixture.
2. the pin mould that is used for integrated circuit according to claim 1; It is characterized in that: said fixture comprises the recessed film of moulding (13) that is used to set up product to be formed (18), also comprises the binder block (17) that is pressed against product to be formed (18) upside and leans the ejection block (19) at product to be formed (18) downside; Said binder block (17) is arranged in the holding pad (6), and binder block (17) is slidingly matched with holding pad (6) formation; The downside of holding pad (6) is provided with the supporting leg that is pressed against on the pin; The upside of said holding pad (6) extends upward with cope match-plate pattern (4) and links to each other, and said cope match-plate pattern (4) is provided with the elasticity material pressing device that holding pad (6) is compressed.
3. the pin mould that is used for integrated circuit according to claim 1 and 2; It is characterized in that: said conjugation roller devices comprises main roller (10) and the auxiliary wheel (11) that is connected with cope match-plate pattern (4), and the rotating shaft of main roller (10) and auxiliary wheel (11) is parallel to each other; The outer wheel face of said main roller (10) is pressed against on the pin during pin moulding; The outer wheel face of said auxiliary wheel (11) abut in the wedge device on the medial surface of product to be formed (18), the outer wheel face of main roller (10) and auxiliary wheel (11) against each other together and the direction of rotation of the two opposite.
4. the pin mould that is used for integrated circuit according to claim 2; It is characterized in that: said elasticity material pressing device comprises the binder pad (5) that is arranged in the cope match-plate pattern (4); Said binder pad (5) is pressed against the top of holding pad (6); Said elasticity material pressing device also comprises the compression spring (2) of the upside that is arranged on binder pad (5); Compression spring (2) is sheathed in the inner chamber of tubular spring fixed seat (1); The upper end of said spring fixed seat (1) extends upward and stretches out the top outer in cope match-plate pattern (4), and the top of cope match-plate pattern (4) is provided with and is set in tubular spring fixed seat (1) outside and the locking nut (3) that spring fixed seat (1) is fixing.
5. the pin mould that is used for integrated circuit according to claim 3 is characterized in that: the rotating shaft of said main roller (10) and auxiliary wheel (11) is on the same horizontal plane; The spacing between the predetermined bending part of the medial surface of product to be formed (18) and product to be formed (18) pin of said wedge device equates with the diameter sum of main roller (10) and auxiliary wheel (11).
6. according to claim 3 or the 5 described pin moulds that are used for integrated circuit, it is characterized in that: said main roller (10) is fixed on the main roller holder (7) through first rotating shaft; Auxiliary wheel (11) is fixed on the auxiliary wheel holder (9) through second rotating shaft; Swing roller bearing (8) pass said main roller holder (7) and auxiliary wheel holder (9) successively and the two is fixed in and side plate that cope match-plate pattern (4) is connected on; Said main roller holder (7) and auxiliary wheel holder (9) all are rotatably assorted with swing roller bearing (8) formation, and the rotating shaft of the axis of said swing roller bearing (8) and main roller (10) and auxiliary wheel (11) is parallel to each other; The shape of said main roller holder (7) and auxiliary wheel holder (9) make main roller (10) and auxiliary wheel (11) outer wheel face against each other together, and make the outer wheel face of auxiliary wheel (11) abut in the wedge device on the medial surface of product to be formed (18).
7. the pin mould that is used for integrated circuit according to claim 5 is characterized in that: the diameter of said main roller (10) and auxiliary wheel (11) is equal to each other.
8. according to claim 3 or 5 or the 6 or 7 described pin moulds that are used for integrated circuit, it is characterized in that: the side of said main roller (10) or auxiliary wheel (11) also is provided with the elastic displacement device on the medial surface of product to be formed (18) that outer wheel face that the outer wheel face that makes the two abutted in together and made auxiliary wheel (11) abuts in the wedge device.
9. according to claim 3 or 5 or the 6 or 7 described pin moulds that are used for integrated circuit, it is characterized in that: said wedge device comprises wedge (12) and the guiding mechanism that is arranged on wedge (12) side; Wedge (12) is arranged on the lower bolster (16); Said wedge (12) abuts in towards the medial surface of the vertical shape of product to be formed (18) the outer wheel face with auxiliary wheel (11), and the rotating shaft of the medial surface of this vertical shape of wedge (12) and main roller (10) and auxiliary wheel (11) is parallel to each other.
10. the pin mould that is used for integrated circuit according to claim 9 is characterized in that: said guiding mechanism comprises the first adjustment pad (14) and the second adjustment pad (15) of the position that is used to adjust between wedge (12) and the product to be formed (18); The said first adjustment pad (14) is arranged on a side that deviates from product to be formed (18) of wedge (12); The second adjustment pad (15) is arranged on a side of the product close to be formed (18) of wedge (12).
CN2011102444747A 2011-08-25 2011-08-25 Pin-forming mold for integrated circuits CN102343407A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011102444747A CN102343407A (en) 2011-08-25 2011-08-25 Pin-forming mold for integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011102444747A CN102343407A (en) 2011-08-25 2011-08-25 Pin-forming mold for integrated circuits

Publications (1)

Publication Number Publication Date
CN102343407A true CN102343407A (en) 2012-02-08

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102983014A (en) * 2012-12-25 2013-03-20 福建欧中电子有限公司 Semi-automatic core mounting table for lead wire capacitor
CN103658320A (en) * 2012-09-06 2014-03-26 上海航天控制工程研究所 Semi-automatic forming technology and device of multi-pin surface mount device
CN104138945A (en) * 2014-07-14 2014-11-12 中国电子科技集团公司第三十六研究所 Axial lead component forming machine
CN105945175A (en) * 2016-05-13 2016-09-21 珠海市赛科自动化有限公司 Capacitance bent foot forming machine
CN106623679A (en) * 2016-09-14 2017-05-10 合肥邦立电子股份有限公司 Automatic bending control system for reed pipe lead
CN107088627A (en) * 2017-04-27 2017-08-25 公牛集团有限公司 A kind of socket pins bending device
CN109719231A (en) * 2018-12-29 2019-05-07 杭州易正科技有限公司 A kind of pin forming jig of ceramic capacitor

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62166551A (en) * 1986-01-20 1987-07-23 Fujitsu Ltd Ic lead bending press
JPH0220348U (en) * 1988-07-25 1990-02-09
US5199469A (en) * 1990-08-31 1993-04-06 Mitsubishi Denki Kabushiki Kaisha Exterior lead forming device for semiconductor devices
JP2000216321A (en) * 1999-01-26 2000-08-04 Toshiba Corp Lead molding device for semiconductor device
CN202591482U (en) * 2012-06-11 2012-12-12 铜陵三佳山田科技有限公司 Pin forming mould for integrated circuit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62166551A (en) * 1986-01-20 1987-07-23 Fujitsu Ltd Ic lead bending press
JPH0220348U (en) * 1988-07-25 1990-02-09
US5199469A (en) * 1990-08-31 1993-04-06 Mitsubishi Denki Kabushiki Kaisha Exterior lead forming device for semiconductor devices
JP2000216321A (en) * 1999-01-26 2000-08-04 Toshiba Corp Lead molding device for semiconductor device
CN202591482U (en) * 2012-06-11 2012-12-12 铜陵三佳山田科技有限公司 Pin forming mould for integrated circuit

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103658320B (en) * 2012-09-06 2017-02-08 上海航天控制工程研究所 Semi-automatic forming technology and device of multi-pin surface mount device
CN103658320A (en) * 2012-09-06 2014-03-26 上海航天控制工程研究所 Semi-automatic forming technology and device of multi-pin surface mount device
CN102983014B (en) * 2012-12-25 2016-04-06 福建欧中电子有限公司 The semi-automatic cored platform of leadless capacitor
CN102983014A (en) * 2012-12-25 2013-03-20 福建欧中电子有限公司 Semi-automatic core mounting table for lead wire capacitor
CN104138945A (en) * 2014-07-14 2014-11-12 中国电子科技集团公司第三十六研究所 Axial lead component forming machine
CN104138945B (en) * 2014-07-14 2016-04-27 中国电子科技集团公司第三十六研究所 A kind of axial lead element forming machine
CN105945175A (en) * 2016-05-13 2016-09-21 珠海市赛科自动化有限公司 Capacitance bent foot forming machine
CN105945175B (en) * 2016-05-13 2018-04-20 珠海市赛科自动化有限公司 A kind of capacitance clubfoot forming machine
CN106623679A (en) * 2016-09-14 2017-05-10 合肥邦立电子股份有限公司 Automatic bending control system for reed pipe lead
CN107088627A (en) * 2017-04-27 2017-08-25 公牛集团有限公司 A kind of socket pins bending device
CN109719231A (en) * 2018-12-29 2019-05-07 杭州易正科技有限公司 A kind of pin forming jig of ceramic capacitor
CN109719231B (en) * 2018-12-29 2020-07-03 宝应县荣泰电子有限公司 Pin forming jig of ceramic capacitor

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Application publication date: 20120208