JPS6424884U - - Google Patents
Info
- Publication number
- JPS6424884U JPS6424884U JP11843287U JP11843287U JPS6424884U JP S6424884 U JPS6424884 U JP S6424884U JP 11843287 U JP11843287 U JP 11843287U JP 11843287 U JP11843287 U JP 11843287U JP S6424884 U JPS6424884 U JP S6424884U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- casing
- conductive layer
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Tests Of Electronic Circuits (AREA)
Description
図面はこの考案の一実施例を示すもので、第１
図は縦断側面図、第２図は一つの突出部の平面図
、第３図はその部分斜視図、第４図は他の突出部
の部分斜視図である。
１……筐体、６……プリント配線基板、８……
信号ライン、１５……突出部、１８……管通孔、
１９……突起、２２……導電層。
The drawing shows one embodiment of this invention.
2 is a plan view of one protrusion, FIG. 3 is a partial perspective view thereof, and FIG. 4 is a partial perspective view of another protrusion. 1... Housing, 6... Printed wiring board, 8...
Signal line, 15... protrusion, 18... pipe through hole,
19... Protrusion, 22... Conductive layer.
Claims (1)
出して前記プリント配線基板に接触する突出部を
形成し、前記筐体に貫通孔を形成し、前記突出部
の内面から前記貫通孔を経て前記突出部の外面に
まで達する導電層を形成し、この導電層を前記プ
リント配線基板の特定の信号パターンに接触させ
たことを特徴とする電子機器の筐体構造。 ２ 貫通孔の周縁に導電層が形成されたＬ字形の
突起を外方へ突出させて形成したことを特徴とす
る実用新案登録請求の範囲第１項記載の電子機器
の筐体構造。[Claims for Utility Model Registration] 1. A casing that holds a printed wiring board is provided with a protrusion that protrudes inward and comes into contact with the printed wiring board, a through hole is formed in the casing, and a through hole is formed in the casing; A casing structure for an electronic device, characterized in that a conductive layer is formed extending from the inner surface through the through hole to the outer surface of the protrusion, and the conductive layer is brought into contact with a specific signal pattern of the printed wiring board. 2. The housing structure of an electronic device according to claim 1 of the utility model registration, characterized in that an L-shaped protrusion having a conductive layer formed on the periphery of the through hole is formed to protrude outward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11843287U JPH0648929Y2 (en) | 1987-07-31 | 1987-07-31 | Electronic device housing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11843287U JPH0648929Y2 (en) | 1987-07-31 | 1987-07-31 | Electronic device housing structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6424884U true JPS6424884U (en) | 1989-02-10 |
| JPH0648929Y2 JPH0648929Y2 (en) | 1994-12-12 |
Family
ID=31362786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11843287U Expired - Lifetime JPH0648929Y2 (en) | 1987-07-31 | 1987-07-31 | Electronic device housing structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648929Y2 (en) |
-
1987
- 1987-07-31 JP JP11843287U patent/JPH0648929Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648929Y2 (en) | 1994-12-12 |
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