JPS6424448A - Liquid cooling module - Google Patents

Liquid cooling module

Info

Publication number
JPS6424448A
JPS6424448A JP62181925A JP18192587A JPS6424448A JP S6424448 A JPS6424448 A JP S6424448A JP 62181925 A JP62181925 A JP 62181925A JP 18192587 A JP18192587 A JP 18192587A JP S6424448 A JPS6424448 A JP S6424448A
Authority
JP
Japan
Prior art keywords
cooling
bellows
liquid channel
filled
structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62181925A
Other languages
Japanese (ja)
Inventor
Masakazu Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP62181925A priority Critical patent/JPS6424448A/en
Publication of JPS6424448A publication Critical patent/JPS6424448A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent thin bellows from corroding while maintaining the cooling performance for enhancing the reliability of bellows by a method wherein the inside of holding members is filled with corrosion resisting means while radiating structures are protruded inside a liquid channel to seal the liquid channel. CONSTITUTION:The inside of cooling structures 13 is filled with a corrosion resisting means 14, i.e., grease 14 while radiating parts 13-4a protrude inside a liquid channel 12b of the main body 12. The holding members of the cooling structures 13, i.e., flanges 13-2 are fixed to respective openings 12a of the main body 12. Thus, a cooling solution fed from a pipe 2-3 does not infiltrate into bellows 13-1 filled with the grease 14 but runs through the liquid channel 12b. At this time, the cooling solution cools down the protruding radiating parts 13-4a resultantly cooling down the heat conductive metal fittings 13-3 heated using an LSI 1-1. Through these procedures, respective LSIs 1-1 closely adhering to the contact surfaces 13-3a of the heat conductive metal fittings 13-3 can be cooled down so that the corrosion resistance of the bellows 13-1 as well as the maintenance of high cooling performance may be assured.
JP62181925A 1987-07-20 1987-07-20 Liquid cooling module Pending JPS6424448A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62181925A JPS6424448A (en) 1987-07-20 1987-07-20 Liquid cooling module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62181925A JPS6424448A (en) 1987-07-20 1987-07-20 Liquid cooling module

Publications (1)

Publication Number Publication Date
JPS6424448A true JPS6424448A (en) 1989-01-26

Family

ID=16109302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62181925A Pending JPS6424448A (en) 1987-07-20 1987-07-20 Liquid cooling module

Country Status (1)

Country Link
JP (1) JPS6424448A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0317696U (en) * 1989-06-30 1991-02-21
US7456516B2 (en) 2003-03-28 2008-11-25 Tdk Corporation Power line terminating circuit and method, and power line relay device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0317696U (en) * 1989-06-30 1991-02-21
US7456516B2 (en) 2003-03-28 2008-11-25 Tdk Corporation Power line terminating circuit and method, and power line relay device

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