JPS58173876A - Electronic refrigerating unit - Google Patents
Electronic refrigerating unitInfo
- Publication number
- JPS58173876A JPS58173876A JP57056589A JP5658982A JPS58173876A JP S58173876 A JPS58173876 A JP S58173876A JP 57056589 A JP57056589 A JP 57056589A JP 5658982 A JP5658982 A JP 5658982A JP S58173876 A JPS58173876 A JP S58173876A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- type semiconductor
- generating
- absorbing
- absorbing element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
Abstract
Description
【発明の詳細な説明】
本発明は電子冷凍装置に係り、特に複数の局部を任意に
選択して冷却し、冷却効率を上げるのに好適な電子冷凍
装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic refrigeration system, and more particularly to an electronic refrigeration system suitable for selectively cooling a plurality of local areas to increase cooling efficiency.
従来の電子冷凍装置は吸熱部と発熱部が1体品とな−て
いたので、1つの冷凍装置で複数の部分を冷却すること
ができない。また、半導体を通って熱が移動するので冷
却効率が悪かつ丸。Since the conventional electronic refrigeration equipment has a heat absorbing part and a heat generating part in one piece, it is not possible to cool multiple parts with one refrigeration equipment. Also, because heat moves through the semiconductor, cooling efficiency is poor and round.
本発明の目的は複数の部分を任意に冷却できる冷却効率
の良い電子冷凍装置を提供することにあ本発明は吸熱部
と発熱部を分離し絶縁電線Itこて接続して、複数の部
分を任意に冷却でき、冷却効率を良くするようにしたこ
とを特徴とするものである。The purpose of the present invention is to provide an electronic refrigeration system with good cooling efficiency that can arbitrarily cool a plurality of parts. It is characterized by being able to cool as desired and improving cooling efficiency.
以下、本発明を図1こより説明する。The present invention will be explained below with reference to FIG.
1は発熱部材で一1LN形半導体3と連結されており、
該N形半導体3は絶縁電線5によって移動可能に配設し
た吸熱部材7に接続されている。2は他の発熱部で、P
形半導体4と連結されており、該P形半導体4は絶縁電
線6によって上記吸熱部材7に接続されている。8は電
池である。1 is a heat generating member connected to 1 LN type semiconductor 3;
The N-type semiconductor 3 is connected by an insulated wire 5 to a movably disposed heat absorbing member 7. 2 is another heat generating part, P
The P-type semiconductor 4 is connected to the heat absorbing member 7 by an insulated wire 6. 8 is a battery.
電池8により電位差が発生し電流は矢印のように流れる
。そして発熱部材1N形半導体3絶縁電線5.吸熱部材
7、絶縁電線6、P形半導体4、発熱部材2の順に流れ
る。上記過程において発熱rs 14 種金属を互に接
触させると接触面に電位差が生じ電流を電位の高い金属
力・ら低い金属方向に流すことにより起り、吸熱は上記
の場合と逆の方向にvL流を流すことにより起るペルチ
イエ効果を利発熱部材1.2において放熱し、吸熱部材
7で吸熱作用を行なう。A potential difference is generated by the battery 8, and current flows as shown by the arrow. and heat generating member 1N type semiconductor 3 insulated wire 5. It flows in the order of the heat absorbing member 7, the insulated wire 6, the P-type semiconductor 4, and the heat generating member 2. In the above process, heat generation occurs when rs 14 metals are brought into contact with each other, a potential difference is generated on the contact surfaces, and current flows from the metal force with high potential to the metal force with low potential, and heat absorption occurs in the opposite direction to the above case with vL flow. The Peltier effect caused by the flow of water is radiated in the heat-producing member 1.2, and the heat-absorbing member 7 performs a heat-absorbing action.
本発明は上記の如き構成にしたので、吸熱部材7と発熱
部材1.2は絶縁電線5.6によって分離されているの
で、任意の場所に吸熱部材7を移動できる。そして、発
熱部材1.2から吸熱部材7への熱の後動がないので冷
却効果が良くなる。Since the present invention is constructed as described above, the heat absorbing member 7 and the heat generating member 1.2 are separated by the insulated wire 5.6, so that the heat absorbing member 7 can be moved to any desired location. Further, since there is no backflow of heat from the heat generating member 1.2 to the heat absorbing member 7, the cooling effect is improved.
図は本発明の電子冷凍装置の電気回路を示す。
1.2・・・発熱部材 3・・・N形半導体 4・・・
P形半導体 5.6・・・絶縁電線 7・・・吸熱部材
8・・・電池The figure shows the electrical circuit of the electronic refrigeration device of the present invention. 1.2... Heat generating member 3... N-type semiconductor 4...
P-type semiconductor 5.6... Insulated wire 7... Heat absorbing member 8... Battery
Claims (1)
凍装置において、1つの発熱部材にN形半導体を他の発
熱部にP形半導体を連結し、両生導体の他端を絶縁電線
により吸熱部材を介して移動可能に接続したことを特徴
とする電子冷凍装置In an electronic refrigeration system consisting of a heat generating part, a heat absorbing part, and N-type and P-type semiconductors, one heat-generating member is connected to an N-type semiconductor, and the other heat-generating part is connected to a P-type semiconductor, and the other end of the double-sided conductor is connected to absorb heat by an insulated wire. An electronic refrigeration device characterized by being movably connected via members.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57056589A JPS58173876A (en) | 1982-04-07 | 1982-04-07 | Electronic refrigerating unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57056589A JPS58173876A (en) | 1982-04-07 | 1982-04-07 | Electronic refrigerating unit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58173876A true JPS58173876A (en) | 1983-10-12 |
Family
ID=13031368
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57056589A Pending JPS58173876A (en) | 1982-04-07 | 1982-04-07 | Electronic refrigerating unit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58173876A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS625665U (en) * | 1985-06-25 | 1987-01-14 | ||
JPS649671A (en) * | 1987-07-01 | 1989-01-12 | Mitsubishi Electric Corp | Peltier cooler |
WO2002101912A1 (en) * | 2001-06-07 | 2002-12-19 | Kabushiki Kaisha Meidensha | Thermoelectric effect device, direct energy conversion system, and energy conversion system |
-
1982
- 1982-04-07 JP JP57056589A patent/JPS58173876A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS625665U (en) * | 1985-06-25 | 1987-01-14 | ||
JPS649671A (en) * | 1987-07-01 | 1989-01-12 | Mitsubishi Electric Corp | Peltier cooler |
WO2002101912A1 (en) * | 2001-06-07 | 2002-12-19 | Kabushiki Kaisha Meidensha | Thermoelectric effect device, direct energy conversion system, and energy conversion system |
US7812246B2 (en) | 2001-06-07 | 2010-10-12 | Kabushiki Kaisha Meidensha | Thermoelectric effect device, energy direct conversion system, and energy conversion system |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US2994203A (en) | Thermoelectric cooling device | |
US9398723B2 (en) | Apparatus and methods using heat pipes for linking electronic assemblies that unequally produce heat | |
US8143510B2 (en) | Thermoelectric composite semiconductor | |
FR2452178A1 (en) | SEMICONDUCTOR DEVICE WITH LOW THERMAL IMPEDANCE | |
GB890841A (en) | Semi-conductor device | |
GB793805A (en) | Cooling apparatus for semi-conductor devices | |
US3411955A (en) | Thermoelectric device | |
GB1353529A (en) | Semiconductor rectifier assemblies | |
JPS58173876A (en) | Electronic refrigerating unit | |
FR2363194A1 (en) | SEMICONDUCTOR DEVICE WITH BILATERAL HEAT EVACUATION | |
US3316474A (en) | Thermoelectric transformer | |
CN210429787U (en) | Heat dissipation assembly, frequency converter and air conditioning unit | |
JP2000009361A (en) | Thermoelectric conversion system | |
JPH04139773A (en) | Thermoelectric conversion equipment | |
KR101673456B1 (en) | Heat absorption structure having heat spread bands in a thermoelectric generator module | |
CN109245561A (en) | A kind of cooling radiator structure for solar inverter | |
RU207206U1 (en) | THERMOELECTRIC MODULE | |
JP2545281Y2 (en) | Automotive engine heat recovery system | |
CN205545131U (en) | Photovoltaic is lightning protection power strip for equipment | |
RU2026612C1 (en) | Microassembly | |
JPH06188342A (en) | Cooling device for semiconductor element | |
JP2002199763A (en) | Heat-absorbing power generator using mercury and semiconductor | |
Roberts Jr | Cooling arrays of circuit cards using heat pipes and forced air diffusers | |
JPS5740964A (en) | Cooling device for semiconductor power element | |
JPH02303076A (en) | Thermoelectric device and method of controlling same |