JPS642396A - Method of mounting electronic part - Google Patents

Method of mounting electronic part

Info

Publication number
JPS642396A
JPS642396A JP15805187A JP15805187A JPS642396A JP S642396 A JPS642396 A JP S642396A JP 15805187 A JP15805187 A JP 15805187A JP 15805187 A JP15805187 A JP 15805187A JP S642396 A JPS642396 A JP S642396A
Authority
JP
Japan
Prior art keywords
solder
electronic part
sections
section
printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15805187A
Other languages
Japanese (ja)
Other versions
JPH012396A (en
Inventor
Saneyasu Hirota
Yasuyuki Nakaoka
Kazumichi Machida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP15805187A priority Critical patent/JPS642396A/en
Publication of JPH012396A publication Critical patent/JPH012396A/en
Publication of JPS642396A publication Critical patent/JPS642396A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To avoid the generation of a bridge based on the flow of solder by making a printing section in solder to correspond only to the nose section of a fitting surface in a lead when the fitting surface in the lead protruding from an electronic part is placed onto cream solder printed onto a pad surface and solder is melted and the electronic part is mounted.
CONSTITUTION: Fitting surfaces 6 in leads 5 protruding from an electronic part 4 at regular intervals are melted and fixed to printing cream solder 11 set up onto the surface of a substrate 1 through a pad 2. That is, since cream solder 11 may be printed only to the rear end section 11A of the solder 11 because melting and fixation are conducted by the nose sections 6A of the fitting surfaces 6 and the rear end section 11A, the thickness of solder 11 may be thickened only by the section 11A and reliability on adhesion is to that extent improved. Accordingly, the printing of solder is omitted in unnecessarry sections, the bonding sections of the sections 6A and 11A can be thickened limitedly, and the generation of bridges in molten solder based on the extent of the area of adhesion is removed.
COPYRIGHT: (C)1989,JPO&Japio
JP15805187A 1987-06-25 1987-06-25 Method of mounting electronic part Pending JPS642396A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15805187A JPS642396A (en) 1987-06-25 1987-06-25 Method of mounting electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15805187A JPS642396A (en) 1987-06-25 1987-06-25 Method of mounting electronic part

Publications (2)

Publication Number Publication Date
JPH012396A JPH012396A (en) 1989-01-06
JPS642396A true JPS642396A (en) 1989-01-06

Family

ID=15663218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15805187A Pending JPS642396A (en) 1987-06-25 1987-06-25 Method of mounting electronic part

Country Status (1)

Country Link
JP (1) JPS642396A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5240170A (en) * 1992-06-05 1993-08-31 Matsushita Electric Industrial Co., Ltd. Method for bonding lead of IC component with electrode

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56169394A (en) * 1980-05-31 1981-12-26 Matsushita Electric Works Ltd Method of mounting electronic part on printed board
JPS58132940A (en) * 1982-02-02 1983-08-08 Sharp Corp Lead-connecting method for part-mounting substrate
JPS6212982B2 (en) * 1978-12-11 1987-03-23 Nisshin Flour Milling Co

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6212982B2 (en) * 1978-12-11 1987-03-23 Nisshin Flour Milling Co
JPS56169394A (en) * 1980-05-31 1981-12-26 Matsushita Electric Works Ltd Method of mounting electronic part on printed board
JPS58132940A (en) * 1982-02-02 1983-08-08 Sharp Corp Lead-connecting method for part-mounting substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5240170A (en) * 1992-06-05 1993-08-31 Matsushita Electric Industrial Co., Ltd. Method for bonding lead of IC component with electrode

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