JPS6423174A - Testing device for semiconductor device - Google Patents

Testing device for semiconductor device

Info

Publication number
JPS6423174A
JPS6423174A JP18029587A JP18029587A JPS6423174A JP S6423174 A JPS6423174 A JP S6423174A JP 18029587 A JP18029587 A JP 18029587A JP 18029587 A JP18029587 A JP 18029587A JP S6423174 A JPS6423174 A JP S6423174A
Authority
JP
Japan
Prior art keywords
contactor
suspender
presser
same time
lowered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18029587A
Other languages
Japanese (ja)
Other versions
JPH0827326B2 (en
Inventor
Kunio Kobayashi
Seiji Imanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP18029587A priority Critical patent/JPH0827326B2/en
Publication of JPS6423174A publication Critical patent/JPS6423174A/en
Publication of JPH0827326B2 publication Critical patent/JPH0827326B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To correct the position of a device with the reaction of a contactor unless the device is accurately positioned, and to obtain uniform contacting pressure by suspending and supporting a mount part by a suspender so that it can be elevated from above the contactor. CONSTITUTION:A semiconductor device 2 is mounted on the mount part 10a of the suspender 10 and a presser 8 is lowered opposite it to clamp the semiconductor device with a specific gap to the mount part 10a. Then the presser 8 of the suspender 10 is lowered at the same time and then its external lead 2a contacts a corresponding contactor 3 in the holder 1. In this state, electric characteristics, etc., are tested and then the presser 8 and suspender 10 are elevated at the same time to release the device 2 from a group of contactors 3 at the same time. Then the lead 2a of the device 2 receives the reaction of the contactor 3 while the device is lowered to correct its position to the center of the contactor group unless the device is accurately positioned, thereby obtaining the uniform contacting pressure.
JP18029587A 1987-07-20 1987-07-20 Semiconductor device testing equipment Expired - Lifetime JPH0827326B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18029587A JPH0827326B2 (en) 1987-07-20 1987-07-20 Semiconductor device testing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18029587A JPH0827326B2 (en) 1987-07-20 1987-07-20 Semiconductor device testing equipment

Publications (2)

Publication Number Publication Date
JPS6423174A true JPS6423174A (en) 1989-01-25
JPH0827326B2 JPH0827326B2 (en) 1996-03-21

Family

ID=16080714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18029587A Expired - Lifetime JPH0827326B2 (en) 1987-07-20 1987-07-20 Semiconductor device testing equipment

Country Status (1)

Country Link
JP (1) JPH0827326B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5504436A (en) * 1993-04-28 1996-04-02 Sony Corporation Socket apparatus for member testing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5504436A (en) * 1993-04-28 1996-04-02 Sony Corporation Socket apparatus for member testing

Also Published As

Publication number Publication date
JPH0827326B2 (en) 1996-03-21

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