JPS649377A - Testing method and sheet for integrated circuit package - Google Patents

Abstract

PURPOSE:To make it possible to perform operation tests without improvement to an integrated circuit package and a socket, by a constitution, wherein the connecting terminals of the integrated circuit package, which are inserted into the through holes of a testing sheet, can be inserted into the socket. CONSTITUTION:In tests under the package state, a testing sheet 1 is inserted between an integrated circuit package 5 and a socket 7. Namely, connecting terminals 6 are inserted into through holes 2, which are provided in the sheet 1. The connecting terminals are further inserted into holes 8 in the socket 7. Under this state, packaging is performed. Since the sheet 1 is very thin, electric conduction to a printed board through the socket 7 is secured. Under this state, only connecting terminals 4 of the sheet 1 are located and exposed at the outside of the periphery of the package 5. In this constitution, since the connecting terminals 4 of the sheet 1 are electrically conducted to the connecting terminals 6 of the package 5, the tests can be performed by bringing a probe into contact with each terminal 4. Thus the tests under the package state can be carried out from the side of the packaging surface without any improvement to the package 5 and the socket 7.