JPS6422050U - - Google Patents
Info
- Publication number
- JPS6422050U JPS6422050U JP11691387U JP11691387U JPS6422050U JP S6422050 U JPS6422050 U JP S6422050U JP 11691387 U JP11691387 U JP 11691387U JP 11691387 U JP11691387 U JP 11691387U JP S6422050 U JPS6422050 U JP S6422050U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- bonded
- pellets
- package
- pasted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11691387U JPS6422050U (US06229276-20010508-P00022.png) | 1987-07-29 | 1987-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11691387U JPS6422050U (US06229276-20010508-P00022.png) | 1987-07-29 | 1987-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6422050U true JPS6422050U (US06229276-20010508-P00022.png) | 1989-02-03 |
Family
ID=31359886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11691387U Pending JPS6422050U (US06229276-20010508-P00022.png) | 1987-07-29 | 1987-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6422050U (US06229276-20010508-P00022.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991014282A1 (en) * | 1990-03-15 | 1991-09-19 | Fujitsu Limited | Semiconductor device having a plurality of chips |
-
1987
- 1987-07-29 JP JP11691387U patent/JPS6422050U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991014282A1 (en) * | 1990-03-15 | 1991-09-19 | Fujitsu Limited | Semiconductor device having a plurality of chips |
