JPS6420629A - Compound semiconductor integrated circuit device - Google Patents

Compound semiconductor integrated circuit device

Info

Publication number
JPS6420629A
JPS6420629A JP17739687A JP17739687A JPS6420629A JP S6420629 A JPS6420629 A JP S6420629A JP 17739687 A JP17739687 A JP 17739687A JP 17739687 A JP17739687 A JP 17739687A JP S6420629 A JPS6420629 A JP S6420629A
Authority
JP
Japan
Prior art keywords
fet
operation layer
products
integrated
types
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17739687A
Other languages
Japanese (ja)
Inventor
Yuuji Tanaka
Mikio Kanamori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP17739687A priority Critical patent/JPS6420629A/en
Publication of JPS6420629A publication Critical patent/JPS6420629A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To freely adjust a threshold voltage and to improve the nondefective rate of products by laminating a plurality of layers each having two types of reverse internal stresses in the formation of an insulating film on an insulating substrate on which elements including a FET are integrated, and reducing the film thickness on a FET element. CONSTITUTION:Interlayer insulating films 7-9 each having two types of compression and tension stresses are laminated under a predetermined condition on a semi-insulating GaAs substrate 1 on which elements, such as a resistor operation layer 2, a FET operation layer 3 and a diode operation layer 4 and the like are integrated. Accordingly, when with resist as a mask on the gate electrode 5 of a FET it is opened and a measurement of a threshold voltage and an etching back of an interlayer insulating film of the opening due to RIE are repeated, the value of the threshold of the FET can be finely adjusted. As a result, the nondefective rate of products is enhanced.
JP17739687A 1987-07-16 1987-07-16 Compound semiconductor integrated circuit device Pending JPS6420629A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17739687A JPS6420629A (en) 1987-07-16 1987-07-16 Compound semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17739687A JPS6420629A (en) 1987-07-16 1987-07-16 Compound semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS6420629A true JPS6420629A (en) 1989-01-24

Family

ID=16030195

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17739687A Pending JPS6420629A (en) 1987-07-16 1987-07-16 Compound semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS6420629A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0715346A2 (en) 1994-11-30 1996-06-05 Fujitsu Limited Method of forming a MESFET with a T-shaped gate electrode and device formed thereby
US6075262A (en) * 1995-09-21 2000-06-13 Fujitsu Limited Semiconductor device having T-shaped gate electrode
WO2007091301A1 (en) * 2006-02-07 2007-08-16 Fujitsu Limited Semiconductor device and process for producing the same
JP2013514661A (en) * 2009-12-16 2013-04-25 ナショナル セミコンダクター コーポレーション Stress compensation for large area gallium nitride or other nitride-based structures on semiconductor substrates

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0715346A2 (en) 1994-11-30 1996-06-05 Fujitsu Limited Method of forming a MESFET with a T-shaped gate electrode and device formed thereby
US5686325A (en) * 1994-11-30 1997-11-11 Fujitsu Limited Method for forming MESFET having T-shaped gate electrode
EP0715346A3 (en) * 1994-11-30 1999-06-16 Fujitsu Limited Method of forming a MESFET with a T-shaped gate electrode and device formed thereby
EP1249862A2 (en) * 1994-11-30 2002-10-16 Fujitsu Limited Semiconductor device and method for forming the same
US6075262A (en) * 1995-09-21 2000-06-13 Fujitsu Limited Semiconductor device having T-shaped gate electrode
WO2007091301A1 (en) * 2006-02-07 2007-08-16 Fujitsu Limited Semiconductor device and process for producing the same
US7960763B2 (en) 2006-02-07 2011-06-14 Fujitsu Limited Semiconductor device and method of manufacturing the same
US8163653B2 (en) 2006-02-07 2012-04-24 Fujitsu Limited Semiconductor device and method of manufacturing the same
US8227838B2 (en) 2006-02-07 2012-07-24 Fujitsu Limited Semiconductor device and method of manufacturing the same
US8399361B2 (en) 2006-02-07 2013-03-19 Fujitsu Limited Semiconductor device and method of manufacturing the same
JP2013514661A (en) * 2009-12-16 2013-04-25 ナショナル セミコンダクター コーポレーション Stress compensation for large area gallium nitride or other nitride-based structures on semiconductor substrates

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