JPS64204A - Production of low melting point metal powder - Google Patents
Production of low melting point metal powderInfo
- Publication number
- JPS64204A JPS64204A JP15493787A JP15493787A JPS64204A JP S64204 A JPS64204 A JP S64204A JP 15493787 A JP15493787 A JP 15493787A JP 15493787 A JP15493787 A JP 15493787A JP S64204 A JPS64204 A JP S64204A
- Authority
- JP
- Japan
- Prior art keywords
- oil
- melting point
- low melting
- point metal
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
PURPOSE: To easily and simply produce spheroidal low melting point metal powder which contains oxygen at a lower ratio by dissolving a low melting point metal in heated oil, grinding the molten metal obtd. in such a manner in the state of co-existence with oil and cooling the powder.
CONSTITUTION: The low melting point metal is dissolved in the oil heated at the flash point or below. Mineral oils such as spindle oil and heat medium oil and fats and oils such as rapeseed oil and fatty acid are usable as the above- mentioned oil. The molten low melting point metal mentioned above is then ground in the state of co-existence with the oil and is then cooled. The grinding can be executed by a method of stirring the above-mentioned co-existing oil and the molten metal, then cooling or spray cooling or charging the mixture to a rotary disk and grinding and cooling the mixture. The molten low melting point metal is then solidified spheroidally in the state of being enclosed by the oil film, by which the low melting point metal powder is obtd. without being oxidized.
COPYRIGHT: (C)1989,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-154937A JPH01204A (en) | 1987-06-22 | Method for producing low melting point metal powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-154937A JPH01204A (en) | 1987-06-22 | Method for producing low melting point metal powder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS64204A true JPS64204A (en) | 1989-01-05 |
| JPH01204A JPH01204A (en) | 1989-01-05 |
Family
ID=
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011062222A1 (en) * | 2009-11-19 | 2011-05-26 | Ｄｏｗａホールディングス株式会社 | Process for producing solder powder |
| WO2011114579A1 (en) * | 2010-03-17 | 2011-09-22 | Ｄｏｗａホールディングス株式会社 | Method for producing low-melting-point metal nanoparticles |
| WO2012066664A1 (en) * | 2010-11-18 | 2012-05-24 | Ｄｏｗａホールディングス株式会社 | Solder powder and process for producing solder powder |
| CN106077687A (en) * | 2016-08-24 | 2016-11-09 | 横店集团东磁股份有限公司 | A kind of device preparing spindle alloy powder electromagnetic wave absorbent and its implementation |
| CN110465672A (en) * | 2019-09-17 | 2019-11-19 | 中国科学院理化技术研究所 | A kind of metal powder with low melting point and its preparation method and application |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011062222A1 (en) * | 2009-11-19 | 2011-05-26 | Ｄｏｗａホールディングス株式会社 | Process for producing solder powder |
| JP2011104634A (en) * | 2009-11-19 | 2011-06-02 | Dowa Holdings Co Ltd | Method for producing solder powder |
| WO2011114579A1 (en) * | 2010-03-17 | 2011-09-22 | Ｄｏｗａホールディングス株式会社 | Method for producing low-melting-point metal nanoparticles |
| JP2011195851A (en) * | 2010-03-17 | 2011-10-06 | Dowa Holdings Co Ltd | Method for producing low-melting point metal nanoparticles |
| WO2012066664A1 (en) * | 2010-11-18 | 2012-05-24 | Ｄｏｗａホールディングス株式会社 | Solder powder and process for producing solder powder |
| US20130244034A1 (en) * | 2010-11-18 | 2013-09-19 | Dowa Holdings Co., Ltd. | Solder powder and method of producing solder powder |
| US9132514B2 (en) * | 2010-11-18 | 2015-09-15 | Dowa Holdings Co., Ltd. | Solder powder and method of producing solder powder |
| CN106077687A (en) * | 2016-08-24 | 2016-11-09 | 横店集团东磁股份有限公司 | A kind of device preparing spindle alloy powder electromagnetic wave absorbent and its implementation |
| CN106077687B (en) * | 2016-08-24 | 2018-06-29 | 横店集团东磁股份有限公司 | A kind of device and its implementation for preparing spindle alloy powder electromagnetic wave absorbent |
| CN110465672A (en) * | 2019-09-17 | 2019-11-19 | 中国科学院理化技术研究所 | A kind of metal powder with low melting point and its preparation method and application |
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