JPS6419754A - Cooling module - Google Patents
Cooling moduleInfo
- Publication number
- JPS6419754A JPS6419754A JP17664187A JP17664187A JPS6419754A JP S6419754 A JPS6419754 A JP S6419754A JP 17664187 A JP17664187 A JP 17664187A JP 17664187 A JP17664187 A JP 17664187A JP S6419754 A JPS6419754 A JP S6419754A
- Authority
- JP
- Japan
- Prior art keywords
- plates
- heat
- cooling
- lsis
- turned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE:To improve the adhesion of a cooling module with a printed substrate and to contrive the improvement of a cooling efficiency and so on by a method wherein a heat pipe, wherein a coolant is sealed, is provided with a cooling structure of a structure, wherein cooling plates having a high heat conductivity are fixed on supporting members having an elasticity. CONSTITUTION:When cooling plates 3-2 are each brought into pressingly contact to the upper surface of each LSI 1-1 mounted on a printed plate 1, the upper surfaces of the LSIs 1-1 mounted in a height different from that of the plates 3-2 and the outer surfaces of the plates 3-2 are adhered to each other by the elasticity of bellows 3-1 and as heat is generated and the heat of the LSIs 1-1 conducts to the inner surfaces of the plates 3-2, a low-boiling point refrigerant 17 coming into contact with the inner surfaces of the plates 3-2 is turned into vapor and ascends inside of a main body 12. When a heat dissipation fin 12 is cooled by a fan 5, the refrigerant 17 turned into vapor dissipates heat and is again turned into a liquid. By repeating this process, the heated plates 3-2 are cooled to cool the LSIs 1-1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17664187A JPS6419754A (en) | 1987-07-14 | 1987-07-14 | Cooling module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17664187A JPS6419754A (en) | 1987-07-14 | 1987-07-14 | Cooling module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6419754A true JPS6419754A (en) | 1989-01-23 |
Family
ID=16017132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17664187A Pending JPS6419754A (en) | 1987-07-14 | 1987-07-14 | Cooling module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6419754A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5198889A (en) * | 1990-06-30 | 1993-03-30 | Kabushiki Kaisha Toshiba | Cooling apparatus |
| US5458189A (en) * | 1993-09-10 | 1995-10-17 | Aavid Laboratories | Two-phase component cooler |
| US5587880A (en) * | 1995-06-28 | 1996-12-24 | Aavid Laboratories, Inc. | Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation |
| US6504720B2 (en) | 2000-09-25 | 2003-01-07 | Kabushiki Kaisha Toshiba | Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module |
| JP2016119451A (en) * | 2014-10-14 | 2016-06-30 | インテル・コーポレーション | Automatic height compensating and co-planar leveling of heat removal assembly for multi-chip packages |
-
1987
- 1987-07-14 JP JP17664187A patent/JPS6419754A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5198889A (en) * | 1990-06-30 | 1993-03-30 | Kabushiki Kaisha Toshiba | Cooling apparatus |
| US5458189A (en) * | 1993-09-10 | 1995-10-17 | Aavid Laboratories | Two-phase component cooler |
| US5587880A (en) * | 1995-06-28 | 1996-12-24 | Aavid Laboratories, Inc. | Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation |
| US6504720B2 (en) | 2000-09-25 | 2003-01-07 | Kabushiki Kaisha Toshiba | Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module |
| JP2016119451A (en) * | 2014-10-14 | 2016-06-30 | インテル・コーポレーション | Automatic height compensating and co-planar leveling of heat removal assembly for multi-chip packages |
| US9743558B2 (en) | 2014-10-14 | 2017-08-22 | Intel Corporation | Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages |
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