CN218735827U - Curing device - Google Patents
Curing device Download PDFInfo
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- CN218735827U CN218735827U CN202221734001.5U CN202221734001U CN218735827U CN 218735827 U CN218735827 U CN 218735827U CN 202221734001 U CN202221734001 U CN 202221734001U CN 218735827 U CN218735827 U CN 218735827U
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Abstract
The utility model provides a curing device, it includes solidification cavity, plummer, solidification light source and semiconductor refrigeration piece array, wherein, the plummer sets up in the solidification intracavity, including the first surface that is used for bearing the weight of the base plate and the second surface relative with the first surface, the solidification light source sets up in the solidification intracavity, is located the one side that the base plate kept away from the first surface, the semiconductor refrigeration piece array includes a plurality of semiconductor refrigeration pieces, the semiconductor refrigeration piece includes cold junction and hot junction, cold junction and second surface hot junction; the embodiment of the utility model provides a through changing equipment design, utilize the semiconductor refrigeration piece array that the semiconductor refrigeration piece that includes cold junction and hot junction formed to carry out the accuse temperature of UVcuring equipment plummer, realize that plummer and base plate big board temperature homogeneity are less than or equal to the demand of 1 ℃, and the plummer size of fearless, but also can satisfy continuous production down the plummer heat accumulation and require the demand that the refrigerating output promoted.
Description
Technical Field
The utility model relates to a show technical field, especially relate to a solidification equipment.
Background
The OLED (Organic Light-Emitting diode) Display technology has the advantages of no need of a backlight source, power saving, thinness, curling, pure black, infinite contrast, wide viewing angle, fast response speed, low power consumption and the like compared with the LCD, is generally regarded as a next generation mainstream Display technology for replacing the LCD, is widely applied to various aspects such as smart phones, VRs, wearable devices, televisions, smart homes, smart cars, medical treatment and the like, is currently receiving more attention and favored by the market, and rapidly enters the industrialization stage. However, the mass production technology of the OLED still has the problems of few material types, low and unstable device efficiency, low product yield, and the like. Among them, it is one of the major issues in OLED display panel fabrication to effectively encapsulate the OLED and separate each functional layer of the device from components such as water vapor and oxygen in the atmosphere.
In the OLED packaging engineering, the adhesive is usually cured by UV curing and then made into a planarization layer or a Cell gap filling layer in the packaging structure. The uniformity of the curing rate of the glue material has a great influence on the optical property (mainly manifested as mura defect) and the reliability (for example, DS defect caused by outgas, and WVTR failure caused by poor stability of the packaging structure) of the product.
For the UV curing equipment of heat-sensitive glue materials and Metal Halide Lamp models, the requirement that the temperature uniformity of a large substrate is less than or equal to +/-1 ℃ in the UV curing process is provided in order to realize the uniformity of the curing rate of the glue materials. This specification is difficult to achieve with conventional co firing patch type UV curing equipment.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a curing device to realize that traditional decoration type UV curing equipment can not satisfy the technical problem of the demand that is less than or equal to 1 ℃ in curing process base plate big board temperature homogeneity.
In order to achieve the above object, the present invention provides a curing device, which comprises:
a curing chamber;
the bearing table is arranged in the curing chamber and comprises a first surface for bearing a substrate and a second surface opposite to the first surface;
the curing light source is arranged in the curing chamber and is positioned on one side of the substrate, which is far away from the first surface;
the semiconductor refrigeration piece array comprises a plurality of semiconductor refrigeration pieces, each semiconductor refrigeration piece comprises a cold end and a hot end, and the cold ends are thermally connected with the second surfaces.
In some embodiments of the present invention, the solidifying apparatus further comprises a temperature control device for controlling the working current of the semiconductor cooling fins.
In some embodiments of the present invention, the curing light source includes a plurality of linear light sources extending along a first direction, and the linear light sources are disposed along a second direction, and the first direction intersects with the second direction.
In some embodiments of the present invention, the curing device further comprises a temperature sensing device for sensing the curing temperature of the first surface of each region of the carrier; the temperature control device is used for controlling the working currents of the semiconductor chilling plates according to the solidification temperature of the first surface of each area.
In some embodiments of the present invention, the temperature sensing device is further configured to determine the difference between the curing temperatures of the first surface and the respective regions according to the curing temperatures of the first surface and the respective regions, and the difference is greater than a threshold value to trigger the temperature control device to operate, so that the curing temperature is higher in the region, the working current of the semiconductor refrigeration sheet is lower than the curing temperature in the region, and the working current of the semiconductor refrigeration sheet is larger than the working current of the semiconductor refrigeration sheet.
The utility model discloses an in some embodiments, semiconductor refrigeration piece includes N type semiconductor, P type semiconductor and power, cold junction electric connection in the one end of N type semiconductor and P type semiconductor, hot junction electric connection in the other end of N type semiconductor and P type semiconductor, power electric connection in the cold junction with the hot junction, temperature control device is used for control the power is in order to control the operating current of semiconductor refrigeration piece.
In some embodiments of the present invention, the curing light source comprises a line light source extending along a first direction, the line light source movably disposed along a second direction within the curing chamber, the first direction intersecting the second direction.
In some embodiments of the present invention, the temperature control device is used for controlling the working current of the semiconductor refrigeration piece in contact with the second surface of each region of the carrier according to the moving speed of the linear light source.
In some embodiments of the present invention, the curing device further comprises a heat dissipation chamber, and the hot end is located in the heat dissipation chamber.
In some embodiments of the present invention, the semiconductor chilling plate array includes a plurality of semiconductor chilling plate arrays spaced along the second direction; each semiconductor refrigerating chip matrix comprises a main matrix and an auxiliary matrix; the main matrix and the auxiliary matrix comprise a plurality of semiconductor refrigeration pieces which are distributed at intervals along a first direction; the heat dissipation power of the main matrix is larger than that of the auxiliary matrix.
Due to the adoption of the technical scheme, the utility model discloses following technological effect has been gained:
the utility model discloses an among the solidification equipment, through changing equipment design, the semiconductor refrigeration piece array that the semiconductor refrigeration piece that utilizes to include cold junction and hot junction formed carries out the accuse temperature of UV curing equipment plummer, realizes plummer and base plate big board temperature homogeneity and is less than or equal to the demand of 1 ℃.
Drawings
Fig. 1 is a schematic cross-sectional structural view of a curing device provided in an embodiment of the present invention;
fig. 2 is a schematic view of a semiconductor cooling plate array provided by an embodiment of the present invention;
fig. 3 is an equipment diagram of a curing light source fixing mode of the curing device provided by the embodiment of the present invention;
fig. 4 is a schematic cross-sectional structure diagram of a fixing manner of a curing light source of the curing device according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a curing light source scanning mode of a curing apparatus according to an embodiment of the present invention;
fig. 6 is a schematic cross-sectional structure diagram of a curing light source scanning mode of a curing device provided by an embodiment of the present invention;
fig. 7 is a circuit structure diagram of a semiconductor cooling plate of a curing device according to an embodiment of the present invention;
fig. 8 is a view showing how the current of the cooling fins varies with time in a curing light source scanning manner of the curing device according to the embodiment of the present invention.
Detailed Description
The technology of the present invention will be described in detail below with reference to specific embodiments. It should be understood that the following detailed description is only for the purpose of assisting those skilled in the art in understanding the present application, and is not intended to limit the present invention. The following description and/or drawings are only some of the embodiments and/or drawings of the present invention. It will be clear to a person skilled in the art that other embodiments or figures can also be derived from the following description and/or the figures without inventive effort.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
An embodiment of the present invention provides a curing device, please refer to fig. 1, fig. 2 and fig. 7, in which fig. 1 is a schematic cross-sectional structure diagram of a curing device provided in an embodiment of the present invention, fig. 2 is a schematic diagram of a semiconductor refrigeration sheet array provided in an embodiment of the present invention, and fig. 7 is a circuit structure diagram of a semiconductor refrigeration sheet of a curing device provided in an embodiment of the present invention; as shown in fig. 1, 2 and 7, the curing apparatus includes:
a curing chamber 10;
a susceptor 11 disposed in the curing chamber 10 and including a first surface for supporting a substrate and a second surface opposite to the first surface;
a curing light source 12 arranged in the curing chamber 10 and located at one side of the substrate far away from the first surface;
the semiconductor refrigeration piece array 13 comprises a plurality of semiconductor refrigeration pieces 131, each semiconductor refrigeration piece 131 comprises a cold end 22 and a hot end 23, and the cold end 22 is thermally connected with the second surface.
In addition, the curing device further comprises an exhaust fan 14, a cold air or natural air inlet 16 and a porous flow equalizing plate 15.
It should be noted that, in the embodiment of the present invention, the curing light source 12 is an ultraviolet light tube.
Specifically, in the embodiment of the utility model provides an in, utilize semiconductor refrigeration piece 131 to replace traditional cool batch (cooling line) to refrigerate the accuse temperature, design a plurality of semiconductor refrigeration pieces 131 for semiconductor refrigeration piece array 13's mode, can be according to plummer 11's size, curing light source 12's arrangement and curing light source 12's luminous power, change single or whole row semiconductor refrigeration piece 131's refrigerating output, with the specification that realizes that 11 upper surface temperature homogeneity of plummer is less than or equal to 1 ℃, and semiconductor refrigeration piece array's mode, do not fear the restriction of 11 sizes of plummer.
It should be noted that the semiconductor cooling plate uses Peltier effect (Peltier effect): when current passes through a loop consisting of conductors made of different materials, heat absorption and heat release phenomena can occur at the connection part of the conductors, the absorbed and released heat is Peltier heat, one end of the loop absorbs heat, and the other end of the loop releases heat; semiconductor refrigeration is the successful application of the Peltier effect on semiconductor materials.
It can be understood that the embodiment of the utility model discloses through changing the equipment design, utilize the semiconductor refrigeration piece array that the semiconductor refrigeration piece that includes cold junction and hot junction formed to carry out the temperature control of UV curing equipment plummer, realize plummer and base plate big board temperature homogeneity be less than or equal to the demand of +/-1 ℃; the design does not need to use refrigerants such as Freon and the like, is relatively environment-friendly, is based on the semiconductor technology, does not have rotating devices, does not have noise, vibration and other pollution, and is convenient to use and maintain; the semiconductor refrigeration piece is based on current control, can realize high-precision temperature control, and can easily realize a high-precision temperature measurement and control system by adding a proper temperature measurement unit and a proper control chip; the semiconductor refrigerating sheet has very small thermal inertia, the refrigerating and heating time is fast, and the refrigerating sheet can reach the maximum temperature difference when the power is on for less than one minute under the condition that the heat dissipation of the hot end is good and the cold end is idle; the temperature range can be realized from +90 ℃ to-130 ℃, and the cold end and the hot end can realize conversion by changing the current direction.
In one embodiment, the curing device further comprises a temperature control device (not shown in the figure) for controlling the operating current of the plurality of semiconductor chilling plates 131.
Further, the curing device further includes a temperature sensing device (not shown in the figure) for sensing the curing temperature of the first surface of each region of the carrier 11; the temperature control device is used for controlling the working current of the plurality of semiconductor chilling plates 131 according to the solidification temperature of the first surface of each area.
In addition, the temperature sensing device is further configured to determine a difference between the curing temperatures of the first surfaces of the regions according to the curing temperatures of the first surfaces of the regions, and trigger the temperature control device to operate when the difference is greater than a threshold value, so that the operating current of the semiconductor chilling plates in the region with a higher curing temperature is greater than the operating current of the semiconductor chilling plates in the region with a lower curing temperature.
Specifically, in the embodiment of the utility model provides an in, temperature-sensing device includes infrared analysis appearance or thermal imaging system, acquires in the ultraviolet curing equipment through infrared analysis appearance or thermal imaging system each region of plummer the solidification temperature distribution situation of first surface confirms each region the difference of the solidification temperature of first surface, and the temperature difference is greater than the threshold value and is started the temperature control device work, and then adjusts the main refrigeration matrix and assist the electric current size of each semiconductor refrigeration piece in the refrigeration matrix, the variable refrigeration volume, adjusts the plummer each region the solidification temperature distribution of first surface finally realizes the temperature homogeneity requirement.
It should be noted that the embodiment of the present invention is to realize the requirement that the temperature uniformity of the carrier and the substrate is less than or equal to ± 1 ℃, and therefore, the threshold of the difference value of the curing temperature is 1 ℃.
In one embodiment, referring to fig. 3 and 4, the curing light source 12 includes a plurality of linear light sources extending along a first direction, the plurality of linear light sources are disposed along a second direction, and the first direction and the second direction intersect; it should be noted that, in the embodiment of the present invention, the curing light source 12 is in a fixed manner, that is, the curing light source does not move during operation; specifically, as shown in fig. 3, the Y direction is the first direction, the X direction is the second direction, and the curing light sources 12 are uniformly arranged; the current of each semiconductor refrigeration piece 131 in the main refrigeration matrix 1# and the auxiliary refrigeration matrix-1 # can be adjusted, the refrigeration capacity is adjusted, the temperature distribution of the bearing table 11 is further adjusted, and the requirement of temperature uniformity is finally met.
In another embodiment, referring to fig. 5 and 6, the curing light source 12 includes a linear light source extending along a first direction, the linear light source is movably disposed in the curing chamber along a second direction, and the first direction intersects the second direction; it should be noted that, in the embodiment of the present invention, the curing light source 12 is in a scanning manner, that is, during operation, the curing light source 12 moves linearly at a constant speed along a certain direction; specifically, as shown in fig. 5, the Y direction is the first direction, the X direction is the second direction, and the curing light source moves along the X direction.
Further, the temperature control device is used for controlling the working current of the semiconductor chilling plates 131 contacting with the second surface of each area of the bearing table according to the moving speed of the linear light source; specifically, the current of each refrigerating sheet in a row of refrigerating matrixes can be adjusted according to the illumination distribution of the curing light source 12, and the previous row of refrigerating matrixes can be closed and the next row of refrigerating matrixes can be opened according to the scanning speed of the curing light source 12.
It should be noted that, in the embodiment of the present invention, as shown in fig. 8, fig. 8 is a time-varying situation of the current of the semiconductor refrigeration sheet of the curing light source scanning mode of the curing device provided in the embodiment of the present invention, wherein the horizontal axis represents time, the vertical axis represents the current of the semiconductor refrigeration sheet, 1# represents the working current curve of the semiconductor refrigeration sheet main matrix 1# in fig. 5, and 2# represents the working current curve of the semiconductor refrigeration sheet main matrix 2# in fig. 5; as can be seen from the figure, the current magnitude of the semiconductor refrigerating sheet can be in a curve shape, so that the refrigerating capacity can be reduced according to the reduction change of the heat source.
In an embodiment, referring to fig. 7, the semiconductor chilling plate 131 includes an N-type semiconductor, a P-type semiconductor and a power supply 21, the cold end 22 is electrically connected to one end of the N-type semiconductor and the P-type semiconductor, the hot end 23 is electrically connected to the other end of the N-type semiconductor and the P-type semiconductor, the power supply 21 is electrically connected to the cold end 22 and the hot end 23, and the temperature control device is configured to control the power supply 21 to control the working current of the semiconductor chilling plate 131.
It can be understood that the semiconductor is divided into an N-type semiconductor and a P-type semiconductor, the N-type semiconductor contains redundant electrons and thus contains a negative temperature difference potential, the P-type semiconductor contains insufficient electrons and redundant holes and thus contains a positive temperature difference potential, an N-type semiconductor element and a P-type semiconductor element are connected to form a thermocouple, as shown in fig. 7, to form a P-N junction 20, and when a direct current passes through the P-N junction 20, energy transfer occurs due to the temperature difference potential, that is, energy exchange with the external environment is performed at the junction; therefore, the cold end and the hot end can be switched by changing the current direction.
In one embodiment, as shown in fig. 1, the curing device further comprises a heat dissipation chamber 17, and the hot end is located in the heat dissipation chamber 17; it can be understood that when the curing device is continuously produced, under the continuous irradiation of the curing light source, the bearing table stores heat, the demand for the refrigerating capacity of the refrigerating sheet is increased, in order to avoid that the temperature of the hot end of the semiconductor refrigerating sheet is too high to influence the refrigeration of the cold end of the semiconductor refrigerating sheet, a heat dissipation chamber 17 is designed at the lower part of the bearing table 11, and the hot end of the semiconductor refrigerating sheet is cooled by natural wind or processed cold wind; in addition, exhaust fans 14 are installed on the side walls of both sides of the heat dissipation chamber 17 for removing heat in the chamber, and the exhaust amount can be automatically adjusted according to temperature changes.
In one embodiment, as shown in fig. 3 or 5, the semiconductor chilling plate array 13 includes a plurality of semiconductor chilling plate matrixes spaced along the second direction X; each semiconductor refrigerating chip matrix comprises a main matrix 1# and an auxiliary matrix-1 #; the main matrix 1# and the auxiliary matrix-1 # comprise a plurality of semiconductor chilling plates 131 which are distributed at intervals along a first direction Y; the heat dissipation power of the primary matrix 1# is greater than the heat dissipation power of the secondary matrix-1 #.
It should be noted that the auxiliary matrix chilling plates are additional semiconductor chilling plate matrices, and when the temperature uniformity of the plummer does not meet the requirement, the auxiliary matrices in the semiconductor chilling plate matrices can be simultaneously started to assist the refrigeration of the main matrix, so that the requirement of the temperature uniformity of the surface of the plummer is met.
To sum up, the utility model provides a curing device, it includes solidification cavity, plummer, solidification light source and semiconductor refrigeration piece array, wherein, the plummer sets up in the solidification intracavity, including the first surface that is used for bearing the weight of the base plate and with the second surface relative of first surface, the solidification light source sets up in the solidification intracavity, is located the base plate and keeps away from one side of first surface, semiconductor refrigeration piece array includes a plurality of semiconductor refrigeration pieces, semiconductor refrigeration piece includes cold junction and hot junction, the cold junction with second surface thermal connection; the embodiment of the utility model provides a through changing equipment design, utilize the semiconductor refrigeration piece array that the semiconductor refrigeration piece that includes cold junction and hot junction formed to carry out the accuse temperature of UV curing equipment plummer, realize plummer and base plate big board temperature homogeneity and be less than or equal to the demand of 1 ℃, and the plummer size of fearless, but also can satisfy continuous production down the plummer heat accumulation and require the demand that the refrigerating output promoted.
Although the disclosure has been shown and described with respect to one or more implementations, equivalent alterations and modifications will occur to others skilled in the art based upon a reading and understanding of this specification and the annexed drawings. The present disclosure includes all such modifications and alterations, and is limited only by the scope of the appended claims. In addition, while a particular feature of the disclosure may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for a given or particular application. Furthermore, to the extent that the terms "includes," has, "" contains, "or variants thereof are used in either the detailed description or the claims, such terms are intended to be inclusive in a manner similar to the term" comprising.
In summary, although the present invention has been disclosed in the above embodiments, the serial numbers before the embodiments, such as "first" and "second", are only used for convenience of description, and do not limit the sequence of the embodiments of the present invention. Furthermore, the above-mentioned embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the protection scope of the present invention is subject to the scope defined by the claims.
Claims (10)
1. A curing apparatus, comprising:
a curing chamber;
the bearing table is arranged in the curing chamber and comprises a first surface for bearing a substrate and a second surface opposite to the first surface;
the curing light source is arranged in the curing cavity and is positioned on one side of the substrate far away from the first surface;
the semiconductor refrigeration piece array comprises a plurality of semiconductor refrigeration pieces, each semiconductor refrigeration piece comprises a cold end and a hot end, and the cold ends are thermally connected with the second surfaces.
2. The curing apparatus of claim 1, further comprising a temperature control device for controlling the operating current of said plurality of semiconductor chilling plates.
3. The curing device of claim 2, wherein said curing light source comprises a plurality of linear light sources extending in a first direction, a plurality of said linear light sources being disposed in a second direction, said first direction and said second direction intersecting.
4. The curing apparatus of claim 3, further comprising a temperature sensing device for sensing a curing temperature of the first surface of each region of the carrier; the temperature control device is used for controlling the working currents of the semiconductor chilling plates according to the solidification temperature of the first surface of each area.
5. The curing device according to claim 4, wherein the temperature sensing device is further configured to determine a difference between the curing temperatures of the first surfaces of the regions according to the curing temperatures of the first surfaces of the regions, and trigger the temperature control device to operate when the difference is greater than a threshold value, so that the operating current of the semiconductor chilling plates in the region with a higher curing temperature is greater than the operating current of the semiconductor chilling plates in the region with a lower curing temperature.
6. The curing device of claim 2, wherein said semiconductor chilling plate comprises an N-type semiconductor, a P-type semiconductor and a power source, said cold side is electrically connected to one end of said N-type semiconductor and said P-type semiconductor, said hot side is electrically connected to the other end of said N-type semiconductor and said P-type semiconductor, said power source is electrically connected to said cold side and said hot side, and said temperature control device is configured to control said power source to control the operating current of said semiconductor chilling plate.
7. The curing apparatus of claim 2, wherein the curing light source comprises a linear light source extending in a first direction, the linear light source being movably disposed within the curing chamber in a second direction, the first direction and the second direction intersecting.
8. The curing apparatus as claimed in claim 7, wherein the temperature control device is configured to control the operating current of the semiconductor chilling plates contacting the second surface of each region of the carrier according to the moving speed of the linear light source.
9. The curing apparatus of claim 1, further comprising a heat dissipation chamber, said hot end being located within said heat dissipation chamber.
10. The curing apparatus of any one of claims 1 to 9, wherein the array of semiconductor chilling plates comprises a plurality of arrays of semiconductor chilling plates spaced apart along the second direction; each semiconductor chilling plate matrix comprises a main matrix and an auxiliary matrix; the main matrix and the auxiliary matrix comprise a plurality of semiconductor refrigeration pieces which are distributed at intervals along a first direction; the heat dissipation power of the main matrix is larger than that of the auxiliary matrix.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221734001.5U CN218735827U (en) | 2022-07-05 | 2022-07-05 | Curing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221734001.5U CN218735827U (en) | 2022-07-05 | 2022-07-05 | Curing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218735827U true CN218735827U (en) | 2023-03-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221734001.5U Active CN218735827U (en) | 2022-07-05 | 2022-07-05 | Curing device |
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|---|---|
| CN (1) | CN218735827U (en) |
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2022
- 2022-07-05 CN CN202221734001.5U patent/CN218735827U/en active Active
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