WO2022198711A1

WO2022198711A1 - Backlight module and display device

Info

Publication number: WO2022198711A1
Application number: PCT/CN2021/084671
Authority: WO
Inventors: 杨余华
Original assignee: 惠州市华星光电技术有限公司
Priority date: 2021-03-24
Filing date: 2021-03-31
Publication date: 2022-09-29
Also published as: CN113075818A

Abstract

The present application provides a backlight module and a display device, the backlight module comprising a base substrate, a plurality of light sources which are disposed at intervals on the base substrate, and a heat dissipation layer which is disposed on a side of the base substrate distant from the light sources, wherein the heat dissipation layer comprises at least one heat dissipation cavity and heat dissipation liquid which is filled inside of the heat dissipation cavities.

Description

Backlight module and display device

technical field

The present application relates to the field of display technology, and in particular, to a backlight module and a display device.

Background technique

Backlight technology has a wide range of applications in the field of liquid crystal display, which can increase the brightness of the liquid crystal display by relying on a backlight source. Most traditional backlights use cold cathode tubes, but with the continuous development of LED technology, LEDs will gradually replace traditional backlights due to their low power consumption, low calorific value, high brightness and long life.

When the LED backlight works, because the LED is a photoelectric element, 15%-25% of the electrical energy can be converted into light energy during its operation, and most of the remaining electrical energy is almost converted into heat energy, which increases the temperature of the LED element. The entire backlight system is in a relatively sealed space. If the heat continues to accumulate, when the temperature of the LED element rises to exceed its maximum allowable temperature, the LED element will be damaged due to overheating, further affecting the service life of the product.

technical problem

The present application provides a backlight module and a display device, which solve the technical problem of the poor heat dissipation capability of the backlight module in the prior art, thereby affecting the service life of the product.

technical solutions

In order to solve the above-mentioned technical problems, the embodiments of the present application provide a backlight module, including:

substrate substrate;

a plurality of light sources, arranged on the base substrate at intervals;

The heat dissipation layer is disposed on the side of the base substrate away from the light source, wherein the heat dissipation layer includes at least one heat dissipation cavity and a heat dissipation liquid filled in the heat dissipation cavity.

According to the backlight module provided by the embodiment of the present application, the heat dissipation layer includes a heat dissipation substrate, the heat dissipation substrate is provided with at least one recess on a side facing the base substrate, and the heat dissipation substrate is far away from the base substrate. One side of the light source is attached, so that the heat dissipation cavity is formed between the concave portion and the base substrate.

According to the backlight module provided by the embodiment of the present application, the bonding method of the heat dissipation substrate and the base substrate includes welding or bonding.

According to the backlight module provided by the embodiment of the present application, the orthographic projection of the light source on the base substrate and the orthographic projection of the heat dissipation cavity on the base substrate at least partially overlap.

According to the backlight module provided by the embodiment of the present application, the boiling point of the heat dissipation liquid is 50-70°C.

According to the backlight module provided by the embodiment of the present application, a plurality of first sub-convex portions are formed on a surface of the heat dissipation cavity corresponding to the side of the base substrate and the heat dissipation substrate that are bonded.

According to the backlight module provided by the embodiment of the present application, a plurality of second sub-convex portions are formed on the surface of the heat dissipation substrate on the side away from the base substrate.

According to the backlight module provided by the embodiment of the present application, the material of the heat dissipation substrate includes glass, ceramic or metal.

According to the backlight module provided by the embodiment of the present application, the light source is a mini LED lamp bead.

According to the backlight module provided by the embodiment of the present application, the backlight module further includes a thermally conductive layer disposed between the base substrate and the heat dissipation layer, and the material of the thermally conductive layer includes a thermal interface material.

According to the above purpose of the present application, a display device is provided, the display device includes a backlight module, and the backlight module includes:

substrate substrate;

a plurality of light sources, arranged on the base substrate at intervals;

According to the display device provided by the embodiment of the present application, the heat dissipation layer includes a heat dissipation substrate, the heat dissipation substrate is provided with at least one recess on a side facing the base substrate, and the heat dissipation substrate and the base substrate are far away from the base substrate. One side of the light source is attached so that the heat dissipation cavity is formed between the concave portion and the base substrate.

According to the display device provided by the embodiment of the present application, the bonding method of the heat dissipation substrate and the base substrate includes welding or bonding.

According to the display device provided by the embodiment of the present application, the orthographic projection of the light source on the base substrate at least partially overlaps with the orthographic projection of the heat dissipation cavity on the base substrate.

According to the display device provided by the embodiment of the present application, the boiling point of the heat dissipation liquid is 50-70°C.

According to the display device provided by the embodiment of the present application, a plurality of first sub-protrusions are formed on a surface of the heat dissipation cavity corresponding to the side of the base substrate and the heat dissipation substrate that are bonded.

According to the display device provided by the embodiment of the present application, a plurality of second sub-convex portions are formed on the surface of the heat dissipation substrate on the side away from the base substrate.

According to the display device provided by the embodiment of the present application, the material of the heat dissipation substrate includes glass, ceramic or metal.

According to the display device provided by the embodiment of the present application, the light source is a mini LED lamp bead.

According to the display device provided by the embodiment of the present application, the backlight module further includes a thermally conductive layer disposed between the base substrate and the heat dissipation layer, and a material of the thermally conductive layer includes a thermal interface material.

beneficial effect

Compared with the prior art, the present application provides a backlight module and a display device, including a base substrate, a plurality of light sources arranged on the base substrate at intervals, and a heat dissipation layer disposed on the side of the base substrate away from the light source. , wherein the heat dissipation layer includes at least one heat dissipation cavity and a heat dissipation liquid filled in the heat dissipation cavity, which absorbs the heat generated by the light source through the conversion of the heat dissipation liquid between the liquid state and the gaseous state to improve the heat dissipation efficiency. A plurality of first sub-convex portions formed on the surface of the heat dissipation cavity corresponding to the side where the substrate is attached, and a plurality of second sub-convex portions formed on the surface of the heat dissipation substrate away from the base substrate, can increase the heat dissipation area and further Improve cooling effect.

Description of drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the embodiments. The drawings in the following description are only part of the embodiments of the present application, and for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without creative effort.

1 is a schematic structural diagram of a backlight module provided by an embodiment of the present application;

FIG. 2 is a schematic top-view structure diagram of a heat dissipation layer provided by an embodiment of the present application;

FIG. 3 is a schematic structural diagram of a heat dissipation substrate provided by an embodiment of the present application;

FIG. 4 is a partial enlarged structural schematic diagram of the heat dissipation substrate in FIG. 3;

FIG. 5 is a schematic top-view structural diagram of a backlight module provided by an embodiment of the present application.

Embodiments of the present invention

Specific structural and functional details disclosed herein are merely representative and for purposes of describing example embodiments of the present application. The application may, however, be embodied in many alternative forms and should not be construed as limited only to the embodiments set forth herein.

In the description of this application, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first" or "second" may expressly or implicitly include one or more of that feature. In the description of this application, unless stated otherwise, "plurality" means two or more. Additionally, the term "comprising" and any variations thereof are intended to cover non-exclusive inclusion.

Directional terms mentioned in this application, such as [upper], [lower], [inner], [outer], etc., only refer to the directions of the attached drawings. Therefore, the directional terms used are used to describe and understand the present application, rather than to limit the present application. In the figures, structurally similar elements are denoted by the same reference numerals.

In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; it can be mechanical connection, electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction of two elements relation. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

In order to facilitate the understanding of the technical solutions of the present application, the technical solutions of the present application will be described in detail below with reference to the accompanying drawings and specific embodiments.

As shown in FIG. 1 , an embodiment of the present application provides a backlight module 1 , which includes a base substrate 10 , a plurality of light sources 20 disposed on the base substrate 10 at intervals, and a plurality of light sources 20 disposed on the base substrate 10 away from The heat dissipation layer 30 on one side of the light source 20, wherein the heat dissipation layer 30 includes at least one heat dissipation cavity, and a heat dissipation liquid 34 filled in the heat dissipation cavity, and the heat dissipation liquid 34 passes through the liquid state and the gaseous state. The conversion absorbs the heat generated by the light source 20 to improve the heat dissipation efficiency.

The working process of the cooling liquid 34 is as follows: when the backlight module is activated, the light source 20 starts to emit light and generates a large amount of heat, and the heat generated by the light source 20 is conducted to the base substrate 10. The heat dissipation layer 30 is disposed on the side of the base substrate 10 away from the light source 20 , wherein the heat dissipation layer 30 includes at least one of the heat dissipation cavity and the heat dissipation liquid 34 filled in the heat dissipation cavity, The heat dissipation liquid 34 and the base substrate 10 can be in contact with the base substrate 10 completely; at this time, the heat dissipation liquid 34 in the heat dissipation cavity absorbs the heat generated by the light source 20, and the heat dissipation liquid 34 is extremely heated when heated. Easy to vaporize, the volatile liquid vaporizes and absorbs heat when heated, and transfers the heat to the side of the heat dissipation layer 30 away from the base substrate 10, the gas condenses at a lower temperature position, restores the liquid state, and can be recycled. The heat dissipation liquid 34 continuously conducts heat during the liquid-gas-liquid cyclic conversion process, which greatly improves the heat conduction of the light source 20 to the outside, prevents the temperature of the light source 20 from being high, and increases the temperature of the light source 20. The overall heat dissipation effect of the backlight module is described.

Specifically, the heat dissipation liquid 34 vaporized by heat is stored in the heat dissipation cavity, and the liquid stored in the heat dissipation cavity adopts a low boiling point, high volatility solvent. Further, a heat conduction layer is disposed on the side of the base substrate 10 away from the light source 20 , that is, the heat conduction layer (not shown in the figure) is disposed between the heat dissipation layer 30 and the base substrate 10 . The thermally conductive layer is made of a thermal interface material, wherein the thermal interface material is a bonding and curing thermally conductive adhesive, a phase change material or a thermally conductive elastomer material, preferably thermally conductive gel or silica gel. By using thermal interface materials such as thermally conductive gel or silica gel to form the thermally conductive layer, it can ensure that the heat generated by the light source 20 is effectively transferred to the The heat dissipation liquid 34 in the heat dissipation cavity. The heat generated by the light source 20 is conducted to the heat dissipation cavity through the thermal interface material, and the heat dissipation liquid 34 in the heat dissipation cavity is heated and vaporized into steam. The heat is quickly transferred to the side of the heat dissipation layer 30 away from the base substrate 10, and the steam condenses into a liquid at a lower temperature position, so as to complete the cycle and transfer of heat in the heat dissipation cavity over and over again. The whole system It is a sustainable cooling device that truly realizes circulation. Since the vaporization and condensation process of the liquid can absorb and release a large amount of heat, the heat dissipation efficiency is extremely high. One side is finally emitted into the air, thus ensuring that the overall temperature of the backlight module is relatively low, and the user will not experience heat during use.

On the other hand, the above solution effectively reduces the overall temperature of the backlight module, while also reducing the temperature distribution gradient in the backlight module, effectively preventing the optical components in the backlight module from being affected by temperature The thermal expansion and contraction caused by the difference in gradient change reduce the occurrence of internal stress problems of various components. In addition, the heat dissipation layer 30 disposed on the side of the base substrate 10 away from the light source 20 enables the heat generated by the light source 20 on the base substrate 10 to be effectively conducted, so that the light source 20 can be controlled The temperature of the chip can also be effectively reduced, prolonging the life of the light source 20, and due to the improvement of the heat dissipation effect, the backlight module can also use a light source with a higher power.

In a specific embodiment, in the backlight module provided by the present application, the heat dissipation layer 30 includes a heat dissipation substrate 36, and the heat dissipation substrate 36 is provided with at least one recess 362 facing the side of the base substrate 10. The substrate 36 is attached to the side of the base substrate 10 away from the light source 20 , so that the heat dissipation cavity is formed between the concave portion 362 and the base substrate 10 .

In this embodiment, the heat dissipation layer 30 is disposed on the side of the base substrate 10 away from the light source 20 , and the heat dissipation layer 30 includes a heat dissipation substrate 36 disposed in contact with the base substrate 10 . Specifically, The heat-dissipating substrate 36 and the base substrate 10 are attached and disposed, and the heat-dissipating substrate 36 is provided with at least one concave portion 362 facing the base substrate 10. Correspondingly, the heat-dissipating substrate 36 further includes The convex portion 364 on the side of the base substrate 10 adjacent to the concave portion 362 is attached to the side of the base substrate 10 away from the light source 20, so that the concave portion 362 and the substrate A sealed accommodation space, that is, the heat dissipation cavity, is formed between the substrates 10 . The surface of the heat dissipation substrate 36 on the side away from the base substrate 10 is exposed at the bottom of the backlight module, and can quickly exchange heat with the air circulating outside through the backplane of the display device. Heat can be quickly dissipated to the outside through the heat dissipation substrate 36 . Compared with the prior art, the heat dissipation performance of the backlight module in this embodiment is improved, which is beneficial to improve the working stability of the light source 20 and prolong its service life.

On the other hand, the heat-dissipating substrate 36 supports the internal structural components of the backlight module. Therefore, the heat-dissipating substrate 36 provided in this embodiment not only forms the heat-dissipating substrate 36 with the base substrate 10 The heat dissipation cavity can make the heat generated by the light source 20 uniform, prevent the local temperature from being too high, and can also be used as a supporting part of the backlight module to further improve the process performance of the product.

In a specific embodiment, in the backlight module provided by the present application, the bonding method of the heat dissipation substrate 36 and the base substrate 10 includes welding or bonding.

Specifically, the heat dissipation substrate 36 and the base substrate 10 are attached and disposed, and at least one recess 362 is provided on the side of the heat dissipation substrate 36 facing the base substrate 10 . Correspondingly, the heat dissipation substrate 36 further includes Facing the convex portion 364 adjacent to the concave portion 362 on the side of the base substrate 10, the convex portion 364 of the heat dissipation substrate 36 is welded or bonded to the side of the base substrate 10 away from the light source 20, so that A sealed accommodating space, namely the heat dissipation cavity, is formed between the recess 362 and the base substrate 10 ; on the other hand, the heat dissipation base plate 36 can support the base substrate 10 and improve the product process performance.

Wherein, as shown in FIG. 1 , the convex portion 364 can be connected to the base substrate 10 through a thermally conductive adhesive layer 366 , so that the thermally conductive substrate 36 is attached to the base substrate 10 , and the thermally conductive adhesive layer 366 not only It can play the role of fixing the base substrate 10 , and in addition, the heat emitted by the light source 20 during operation can be quickly conducted to the heat dissipation cavity through the thermally conductive adhesive layer 366 .

Wherein, the heat dissipation substrate 36 and the base substrate 10 can also be connected and fixed by a detachable connection method such as locking screws, even if the heat dissipation substrate 36 or the heat dissipation liquid 34 needs to be replaced later, The heat dissipation substrate 36 or the heat dissipation liquid 34 can also be easily replaced by loosening the locking screw.

As shown in FIG. 1 , in the backlight module provided by the present application, the orthographic projection of the light source 20 on the base substrate 10 and the orthographic projection of the heat dissipation cavity on the base substrate 10 at least partially overlap, Specifically, the backlight module includes a base substrate 10 , a light source 20 and a heat dissipation layer 30 , the light source 20 is located on the base substrate 10 , and the heat dissipation layer 30 is disposed on the base substrate 10 away from the One side of the light source 20 , that is, the base substrate 10 is located between the light source 20 and the heat dissipation layer 30 as a heat conduction medium, and conducts the heat emitted by the light source 20 to the heat dissipation liquid 34 in the heat dissipation layer 30 , further, the orthographic projection of the light source 20 on the base substrate 10 and the orthographic projection of the heat dissipation cavity on the base substrate 10 are at least partially overlapped, so that the heat dissipated by the light source 20 It can be directly conducted to the range where the heat dissipation cavity is in contact with the base substrate 10 , which reduces the heat conduction path and further enhances the heat dissipation effect.

FIG. 2 is a schematic top-view structure diagram of a heat dissipation layer provided by an embodiment of the present application. In FIG. 2 , the light source 20 is a light source that provides direct backlight to the backlight module. The backlight module provides a light source of an edge-type backlight. As shown in FIG. 2 , the heat dissipation cavities are arranged in an array on the heat dissipation layer 30 , and the heat on the base substrate 10 can be dissipated through the heat dissipation cavities arranged in an array. The heat dissipation liquid 34 in the cavity conducts uniform heat dissipation to ensure the uniformity of the heat dissipation effect.

Optionally, the boiling point of the heat dissipation liquid 34 is 50-70°C. Specifically, the light source 20 is mounted on the base substrate 10 , and the heat dissipation layer 30 is mounted on the other surface of the base substrate 10 . The heat dissipation cavity of the heat dissipation solution at 70°C. When the backlight module is activated, the light source 20 starts to emit light and generates a large amount of heat. The heat generated by the light source 20 is conducted to the base substrate 10 , and the dissipated heat is dissipated by the other side of the base substrate 10 . The heat dissipation solution inside the cavity is absorbed, and when the absorbed heat makes the temperature of the heat dissipation solution reach its boiling point, the heat dissipation solution vaporizes and absorbs the heat, and transfers the heat to the heat dissipation layer 30 away from the base substrate On the 10th side, the gas condenses at a lower temperature position and restores the liquid state, so that it can be recycled. The heat generated by the light source 20 is continuously conducted by the heat dissipation liquid 34 during the liquid-gas-liquid cyclic conversion process, thereby greatly improving the heat conduction of the light source 20, preventing the temperature of the light source 20 from being high and increasing The cooling effect of the overall backlight module.

The heat dissipation liquid 34 has a very high thermal conductivity, which can quickly conduct the heat on the base substrate 10, so that the ambient temperature around the light source 20 can be stabilized during operation, thereby ensuring the service life of the device. .

In a specific embodiment, in the backlight module provided by the present application, as shown in FIG. 3 , the side where the base substrate 10 and the heat dissipation substrate 36 are attached corresponds to the surface of the heat dissipation cavity. Specifically, the heat emitted by the light source 20 is transferred from the base substrate 10 through the heat dissipation liquid 34 to the surface 361 of the heat dissipation substrate 36 on the side close to the heat dissipation cavity, According to the three heat transfer modes of conduction, convection and radiation, in this embodiment, the heat dissipation liquid 34 conducts heat continuously during the liquid-gas-liquid cyclic conversion process, so the heat dissipation liquid 34 transfers heat to the The heat transfer method of the surface 361 of the heat dissipation substrate 36 on the side close to the heat dissipation cavity is mainly convection, and the formula of the heat convection is: Q=H×A×ΔT; The heat taken away; H is the thermal convection coefficient value, A represents the effective contact area of thermal convection; ΔT represents the temperature difference between the solid surface and the regional fluid. As shown in FIG. 4 , a plurality of first sub-convex portions 368 are formed on the surface 361 of the heat-dissipating substrate 36 on the side close to the heat-dissipating cavity, and the heat-dissipating substrate 36 is increased by the first sub-convex portions 368 . The area of the surface 361 close to the side of the heat dissipation cavity increases the contact area between the heat dissipation substrate 36 and the heat dissipation liquid 34, which is equivalent to increasing the effective contact area of thermal convection, thereby increasing the amount of heat carried away by thermal convection. , thereby improving the heat dissipation efficiency of the heat dissipation substrate 36 .

Further, the heat emitted by the light source 20 is transferred from the base substrate 10 through the heat dissipation liquid 34 to the surface 361 of the heat dissipation substrate 36 on the side close to the heat dissipation cavity, and then transferred to the heat dissipation substrate 36 On the surface 363 on the side away from the base substrate 10 , as shown in FIG. 4 , a plurality of second sub-protrusions 369 are formed on the surface 363 of the heat dissipation substrate 36 on the side away from the base substrate 10 . The second sub-convex portion 369 increases the heat dissipation area of the heat dissipation substrate 36 and further enhances the heat dissipation effect of the backlight module.

In a specific embodiment, in the backlight module provided by the present application, the material of the heat dissipation substrate 36 includes glass, ceramic or metal.

Optionally, the heat-dissipating substrate 36 is made of graphite. As a brand-new heat-conducting and heat-dissipating material, graphite conducts heat evenly in two directions, and its thermal conductivity in the horizontal direction is much greater than that in the vertical direction. It is said that the thermal conductivity of graphite in the horizontal direction is between 150-1500W/(m.K), and the thermal conductivity in the vertical direction is 15-25W/(m.K). Therefore, graphite is a good material for uniform heat. Using graphite to prepare the heat dissipation substrate 36 can further improve the overall uniform heat dissipation effect of the backlight module.

Optionally, the heat dissipation substrate 36 is made of copper foil material. Since copper foil is an isotropic material, its electrical conductivity in all directions reaches 401W/(m.K), which is an excellent thermal conductive material and can The heat transferred from the light source 20 to the heat dissipation liquid 34 is effectively dissipated to improve heat dissipation efficiency.

On the other hand, common friction, movement of people, and contact/separation will generate static electricity. The heat dissipation substrate 36 is made of conductive metal material, which can conduct static electricity away, reduce the impact of static electricity on components, effectively reduce the risk of static electricity, and ensure the The use environment of the light source 20 . At the same time, because the heat dissipation liquid 34 has high thermal conductivity, and the heat dissipation substrate 36 is provided with a plurality of recesses 362 on the side close to the base substrate 10, it allows to design a thinner heat dissipation substrate to save metal materials and reduce the cost.

In a specific embodiment, in the backlight module provided by this application, the light source 20 is a mini LED lamp beads. Specifically, the mini LED lamp bead is a rectangular parallelepiped, its long side and wide side are 0.25mm-0.5mm, and its height is about 0.1mm, and it can emit light on five sides. Compared with the backlight module using traditional LED as the light source, the backlight module using mini LED can use a denser chip arrangement to reduce the light mixing distance, so that the backlight module can be ultra-thin. In addition, with local Dimming control, the display device using mini LED can get better contrast and display effect.

The current mini backlight display has become the mainstream solution for high-end products. Since the number of LEDs in a single product is as many as tens of thousands or even hundreds of thousands, which is dozens of times higher than the number of LEDs in conventional direct-lit backlights, the heat per unit area is concentrated, resulting in mini backlights. The product needs to use a fan or other means to dissipate heat, which increases the noise and the user's perceivable temperature rise, which affects the user experience. There are two types of mini backlights currently on the market, one is mini LED with aluminum substrate; the other is glass substrate mini LED, relatively speaking, the mini LED of the glass substrate can achieve a more refined solution, but due to the mini LED of the glass substrate The number of LEDs integrated is very large, resulting in high heat dissipation of the lamp board, and the overall temperature is uncontrollable. It is necessary to increase the heat dissipation scheme to achieve mass production benefits. In the backlight module provided by the embodiment of the present application, the heat generated by the light source 20 is uniformly transferred to the side of the heat dissipation layer 30 away from the base substrate 10 through the heat dissipation liquid 34, and finally dissipated into the air, Therefore, the overall temperature of the backlight module is guaranteed to be relatively low, the product can be controlled within a certain temperature rise range, and the mini Application of LEDs.

In a specific embodiment, in the backlight module provided by the present application, the backlight module includes a metal wiring 21 disposed on the side of the base substrate 10 close to the light source 20 . Specifically, as shown in FIG. 5 , FIG. 5 is a schematic top-view structural diagram of a backlight module provided by an embodiment of the present application. In FIG. 5 , the light source 20 is exemplarily used to provide a direct-type backlight for the backlight module. In other embodiments, the light source 20 of an edge-type backlight can be provided to the backlight module; the light source 20 is arranged on the base substrate 10 in an array, and passes through the base substrate The metal traces 21 on the 10 realize the electrical connection between the light sources 20 . Since the light source 20 emits light and other components work, the temperature of the base substrate 10 will be high, and the temperature difference between the LED area and the non-LED area is very large, so the base substrate 10 is far away from the The heat dissipation layer 30 is added to one side of the light source 20 , and the heat generated by the light source 20 is evenly transferred to the heat dissipation layer 30 through the heat dissipation liquid 34 to the side away from the base substrate 10 , and the heat dissipation liquid 34 passes through the heat dissipation layer 30 . Convert between liquid and gas, conduct the heat of the light source 20 to the heat dissipation substrate 36, and pass the heat dissipation cavity arranged in an array, so that the heat on the base substrate 10 can pass through all the heat dissipation cavities. The heat dissipation liquid 34 in the heat dissipation cavity performs uniform heat dissipation, which improves the uniformity of the heat dissipation effect.

Wherein, the base substrate 10 may be made of glass, the metal traces 21 are arranged on the base substrate 10, and the metal traces 21 are easily broken when pulled or squeezed, which affects the display effect. Therefore, the heat dissipation substrate 36 made of metal can provide a good fixing and supporting effect to the base substrate 10 made of glass, and prevent the base substrate 10 from being deformed too much and affecting the metal traces 21; In addition, structural members can be added to fix the base substrate 10 to further improve the process performance of the product.

The metal traces 21 are used to form the circuit structure of the light source 20. Optionally, in this embodiment, the metal traces 21 are made of copper foil material, which can satisfy the good conductive effect of the conductive layer, and the copper foil It is an isotropic material, and its electrical conductivity in all directions reaches 401W/(m.K), which is an excellent thermal conductive material, which can effectively conduct the heat generated by the light source 20 .

Optionally, the metal traces 21 may be provided on the base substrate 10 by an etching method, and then the light source 20 may be welded to the circuit structure composed of the metal traces 21 by a welding technique. The light source 20 is directly welded to the circuit structure without being fixed by a PCB board and thermally conductive adhesive, which further simplifies the process.

Embodiments of the present application further provide a display device, including the aforementioned backlight module and a display panel, wherein the display panel is disposed on a side close to the light-emitting surface of the backlight module.

In summary, the present application provides a backlight module and a display device, comprising a base substrate, a plurality of light sources arranged on the base substrate at intervals, and a heat dissipation layer disposed on the side of the base substrate away from the light source, wherein the heat dissipation layer It includes at least one heat-dissipating cavity and a heat-dissipating liquid filled in the heat-dissipating cavity, which absorbs the heat generated by the light source through the conversion of the heat-dissipating liquid between the liquid state and the gaseous state, improves the heat-dissipating efficiency, and is attached to the heat-dissipating substrate through the base substrate. The plurality of first sub-convex portions formed on the surface of one side corresponding to the heat dissipation cavity and the plurality of second sub-convex portions formed on the surface of the heat dissipation substrate away from the base substrate can increase the heat dissipation area and further improve the heat dissipation effect.

To sum up, although the present application has disclosed the above-mentioned preferred embodiments, the above-mentioned preferred embodiments are not intended to limit the present application. Those of ordinary skill in the art, without departing from the spirit and scope of this application, can Therefore, the scope of protection of the present application is subject to the scope defined by the claims.

Claims

A backlight module, comprising:

substrate substrate;

a plurality of light sources, arranged on the base substrate at intervals;

The heat dissipation layer is disposed on the side of the base substrate away from the light source, wherein the heat dissipation layer includes at least one heat dissipation cavity and a heat dissipation liquid filled in the heat dissipation cavity.
The backlight module of claim 1, wherein the heat dissipation layer comprises a heat dissipation substrate, the heat dissipation substrate is provided with at least one recess on a side facing the base substrate, and the heat dissipation substrate is far away from the base substrate One side of the light source is attached so that the heat dissipation cavity is formed between the concave portion and the base substrate.
The backlight module according to claim 2, wherein the bonding method of the heat dissipation substrate and the base substrate comprises welding or bonding.
The backlight module of claim 1, wherein the orthographic projection of the light source on the base substrate at least partially overlaps the orthographic projection of the heat dissipation cavity on the base substrate.
The backlight module of claim 1, wherein the boiling point of the heat dissipation liquid is 50-70°C.
The backlight module as claimed in claim 1, wherein a plurality of first sub-convex portions are formed on a surface of the heat dissipation cavity corresponding to a side of the base substrate and the heat dissipation substrate that are bonded.
The backlight module of claim 1, wherein a plurality of second sub-convex portions are formed on a surface of the heat dissipation substrate on a side away from the base substrate.
The backlight module of claim 1, wherein the material of the heat dissipation substrate comprises glass, ceramic or metal.
The backlight module of claim 1, wherein the light source is a mini LED lamp bead.
The backlight module of claim 1, wherein the backlight module further comprises a thermally conductive layer disposed between the base substrate and the heat dissipation layer, and a material of the thermally conductive layer comprises a thermal interface material.
A display device, the display device comprising a backlight module, the backlight module comprising:

substrate substrate;

a plurality of light sources, arranged on the base substrate at intervals;

The heat dissipation layer is disposed on the side of the base substrate away from the light source, wherein the heat dissipation layer includes at least one heat dissipation cavity and a heat dissipation liquid filled in the heat dissipation cavity.
The display device according to claim 11, wherein the heat dissipation layer comprises a heat dissipation substrate, the heat dissipation substrate is provided with at least one recess on a side facing the base substrate, and the heat dissipation substrate is far away from the base substrate. One side of the light source is attached, so that the heat dissipation cavity is formed between the concave portion and the base substrate.
The display device according to claim 12, wherein the bonding method of the heat dissipation substrate and the base substrate comprises welding or bonding.
The display device of claim 11, wherein the orthographic projection of the light source on the base substrate at least partially overlaps the orthographic projection of the heat dissipation cavity on the base substrate.
The display device of claim 11, wherein the boiling point of the heat dissipation liquid is 50-70°C.
The display device according to claim 11 , wherein a plurality of first sub-convex portions are formed on a surface of the heat dissipation cavity corresponding to a side of the base substrate and the heat dissipation substrate that are adhered.
The display device of claim 11, wherein a plurality of second sub-convex portions are formed on a surface of the heat dissipation substrate on a side away from the base substrate.
The display device of claim 11, wherein the material of the heat dissipation substrate comprises glass, ceramic or metal.
The display device of claim 11, wherein the light source is a mini LED lamp bead.
The display device of claim 11 , wherein the backlight module further comprises a thermally conductive layer disposed between the base substrate and the heat dissipation layer, and a material of the thermally conductive layer comprises a thermal interface material.