KR20110134225A - Structure of heat radiation for light emitting base plate of led back light - Google Patents

Structure of heat radiation for light emitting base plate of led back light Download PDF

Info

Publication number
KR20110134225A
KR20110134225A KR1020100054090A KR20100054090A KR20110134225A KR 20110134225 A KR20110134225 A KR 20110134225A KR 1020100054090 A KR1020100054090 A KR 1020100054090A KR 20100054090 A KR20100054090 A KR 20100054090A KR 20110134225 A KR20110134225 A KR 20110134225A
Authority
KR
South Korea
Prior art keywords
heat
light emitting
heat dissipation
led
unit
Prior art date
Application number
KR1020100054090A
Other languages
Korean (ko)
Inventor
강신욱
Original Assignee
주식회사 럭스월드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 럭스월드 filed Critical 주식회사 럭스월드
Priority to KR1020100054090A priority Critical patent/KR20110134225A/en
Publication of KR20110134225A publication Critical patent/KR20110134225A/en

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Planar Illumination Modules (AREA)

Abstract

PURPOSE: A luminescent substrate structure of an LED backlight unit is provided to prevent the deterioration of a component including a high luminescent LED device of an LED backlight and to irradiate heat which is generated from an LED panel of a backlight unit for increasing the brightness of an LED panel. CONSTITUTION: A heat absorption base of each light emitting substrate or a circuit unit(112) is respectively connected to a heat conduction pipe. The heat conduction pipe is fixed to a radiating unit(20). An LED light substrate is arranged to be laminated on the rear side of an LED panel. The heat conduction pipe is fixed to the radiating unit. A light radiating plate(21) radiates heat to the outside through the heat exchange action with air.

Description

ＬＥＤ 백라이트 유닛의 발광기판 방열구조{Structure of heat radiation for light emitting base plate of LED back light}Structure of heat radiation for light emitting base plate of LED back light}

본 발명은 LED 백라이트 유닛의 발광기판 방열구조에 관한 것으로, 더욱 상세하게는 발광을 통해 액정패널의 휘도를 향상시키는 백라이트 유닛의 발광기판에서 생성된 열기를, 외부로 유도하여 신속히 발산시키는 LED 백라이트 유닛의 발광기판 방열구조에 관한 것이다.The present invention relates to a heat dissipation structure of a light emitting substrate of an LED backlight unit, and more particularly, to an LED backlight unit which quickly dissipates heat generated from a light emitting substrate of a backlight unit that improves the brightness of a liquid crystal panel through light emission to the outside. A light emitting substrate heat dissipation structure.

주지하는 바와 같이 액정(Liquid Crystal:LC)을 이용하여 영상을 디스플레이하는 액정 패널장치는, 액정패널(Liquid Crystal Display panel)과 상기 액정패널의 배면에 빛을 발산하는 백라이트 유닛(Backlight Unit)을 포함하여 구성된다.As is well known, a liquid crystal panel device for displaying an image using a liquid crystal (LC) includes a liquid crystal panel and a backlight unit emitting light to the rear surface of the liquid crystal panel. It is configured by.

상기 액정패널은, 박막의 트랜지스터 기판(Thin Film Transistor substrate)과, 컬러필터 기판(Color Filter substrate), 및 이들 트랜지스터 기판과 컬러필터 기판 사이에 개재되어 전기적인 신호의 인가 여부에 따라 광 투과율을 변경하는 액정을 포함하여 구성된다.The liquid crystal panel is interposed between a thin film transistor substrate, a color filter substrate, and the transistor substrate and the color filter substrate to change light transmittance according to whether an electrical signal is applied. It is comprised including the liquid crystal.

그리고, 상기 백라이트 유닛은 빛을 발산하는 광원(Light Source), 및 상기 광원의 전류 공급을 도모하는 인버터(inverter)를 포함하여 구성되는데, 근래에는 상기 백라이트 유닛의 광원으로 형광램프가 주로 사용되었으나 최근에 들어서는 저 전류를 소모하면서도 고휘도의 빛을 발산하는 LED를 광원으로 변모하고 있는 실정이다.The backlight unit includes a light source for emitting light and an inverter for supplying current to the light source. Recently, a fluorescent lamp is mainly used as a light source of the backlight unit. For example, LEDs that consume low current and emit high luminance light are being converted into light sources.

한편, 밝은 대낮이나 옥외에서 액정표시장치를 사용하기 위해서는 고휘도를 확보하여야 하며, 이러한 고휘도를 확보하기 위해서는 백라이트 유닛에 많은 수의 고휘도 LED소자들을 배치하여야 한다.On the other hand, in order to use the liquid crystal display in bright daylight or outdoors, high brightness must be secured, and in order to secure such high brightness, a large number of high brightness LED devices must be disposed in the backlight unit.

그런데, 이러한 경우 고휘도 LED 소자에서 다량의 열이 발생되고, 이 열은 고휘도 LED소자 뿐만 아니라, 액정패널 및 부품에 열화시켜, 장치 전체의 안정성 및 내구성을 저하시키는 문제점을 유발시키게 되므로, 종래에는 1000CD 이상의 밝기를 갖는 액정 패널장치의 구현이 사실상 어려웠다.However, in this case, a large amount of heat is generated in the high-brightness LED device, and this heat deteriorates not only the high-brightness LED device but also the liquid crystal panel and the components, thereby causing a problem of deteriorating the stability and durability of the entire device. It was practically difficult to implement a liquid crystal panel device having the above brightness.

상기한 문제점을 해소하기 위해 안출된 본 발명의 목적은, 발광을 통해 액정패널의 휘도를 향상시키는 백라이트 유닛의 발광기판에 설치되어, 이 발광기판에서 생성된 열을 외부로 유도하여 신속히 발산시켜서, 발광기판의 고휘도 LED 소자나 액정패널을 포함하는 각종 부품의 열화를 예방하는 LED 백라이트 유닛의 발광기판 방열구조를 제공함에 있다. An object of the present invention devised to solve the above problems is provided in the light emitting substrate of the backlight unit for improving the brightness of the liquid crystal panel through light emission, to quickly dissipate heat generated in the light emitting substrate to the outside, The present invention provides a light emitting substrate heat dissipation structure of an LED backlight unit which prevents deterioration of various components including a high brightness LED device and a liquid crystal panel of a light emitting substrate.

상기한 목적은, 본 발명에서 제공되는 하기 구성에 의해 달성된다.The above object is achieved by the following configuration provided in the present invention.

본 발명에 따른 LED 백라이트 유닛의 발광기판 방열구조는, The light emitting substrate heat dissipation structure of the LED backlight unit according to the present invention,

복수의 고휘도 LED 소자들이 배치된 LED 백라이트 유닛의 발광기판에 설치되어, 상기 LED 발광기판에서 생성된 열기를 외부로 발산하는 것으로,It is installed on the light emitting substrate of the LED backlight unit in which a plurality of high-brightness LED elements are disposed, to dissipate heat generated in the LED light emitting substrate to the outside,

상기 LED 발광기판은 액정패널의 배면에 적층하여 복수 배치되고, 이들 각 발광기판의 흡열 베이스, 또는 회로부에는 하나 이상의 열전도관이 각각 연결되는 한편, 이 열전도관은 복수의 방열판들이 등간격으로 배치된 방열부를 관통한 상태로 고정되어, 고휘도 LED 소자들의 발광작용에 의해 흡열 베이스로 전도된 열기는 열전도관을 따라 방열부로 유도하여 전도되어서. 방열판을 통한 공기와의 열교환 작용을 통해 신속히 외부로 발산되도록 구성한 것을 특징으로 한다.The LED light emitting boards are stacked on the rear surface of the liquid crystal panel, and a plurality of heat conducting tubes are connected to the endothermic base or circuit portion of each of the light emitting substrates, respectively. It is fixed while penetrating the heat dissipation unit, and the heat conducted to the heat absorbing base by the light emitting action of the high-brightness LED elements is conducted by conducting the heat dissipation unit along the heat conduction tube. Characterized in that configured to be quickly dissipated to the outside through the heat exchange action with the air through the heat sink.

바람직하게는, 상기 방열부에는 열전도관이 관통된 방열판 사이에 공기를 강제 순환시켜 발열판과 공기와의 신속한 열교환을 구현하는 냉각팬이 설치된다.Preferably, the heat dissipation unit is provided with a cooling fan for circulating the air between the heat dissipation plate through which the heat conduction tube is forced to implement a rapid heat exchange between the heat dissipation plate and the air.

보다 바람직하게는, 상기 방열부에는 서로 다른 발광기판의 흡열 베이스와 연결된 복수의 열전도관이 관통되어, 하나의 방열부를 통해 복수의 발광기판이 방열되도록 구성되며, 상기 방열부는 상호 적층된 액정패널과 발광기판의 측부에 형성되어 방열부에 의해 두께가 두꺼워지는 것이 예방되도록 구성한다.More preferably, the heat dissipation portion is configured to penetrate a plurality of heat conduction tubes connected to the endothermic bases of different light emitting substrates, so that the plurality of light emitting substrates dissipate through one heat dissipation portion, and the heat dissipation portions are stacked with each other. It is formed on the side of the light emitting substrate is configured to prevent the thickness is thickened by the heat radiating portion.

전술한 바와 같이 본 발명에 따른 방열구조는, 고휘도 LED 소자가 배설된 백라이트 유닛의 발광기판에서 생성되는 열기를 외부로 신속히 발산하는 방열구조를 제안하고 있다.As described above, the heat dissipation structure according to the present invention proposes a heat dissipation structure that quickly dissipates heat generated from the light emitting substrate of the backlight unit in which the high brightness LED element is disposed to the outside.

이러한 방열구조를 통해 발광기판의 방열이 도모되면, 발광기판에 배설된 고휘도 LED 소자나 액정패널을 포함하는 각종 부품의 열화가 예방될 수 있어, 결과적으로 향상된 내구성 및 안정성을 겸비한다.When the heat dissipation of the light emitting substrate is achieved through the heat dissipation structure, deterioration of various components including the high-brightness LED element or the liquid crystal panel disposed on the light emitting substrate can be prevented, resulting in improved durability and stability.

특히, 상기 방열구조는 방열기판에 방열부를 적층시킨 것이 아니라, 방열기판에서 생성된 열기가 열전도관을 통해 발광기판의 측부에 배치된 방열부로 전도하여 방열되도록 구성하고, 또 이들 사이를 연결하는 열전도관을 판상으로 구성하고 있다.Particularly, the heat dissipation structure is not laminated with a heat dissipation part on a heat dissipation board, but heat is generated from the heat dissipation board so that the heat dissipates through the heat conduction pipe to the heat dissipation part disposed on the side of the light emitting substrate, and the heat conduction connects them. The tube is composed of plates.

따라서, 본 발명에 따른 방열구조는 방열부, 및 열전도관에 의해 액정 패널장치가 전체적으로 두꺼워지는 현상이 예방될 수 있어, 결과적으로 슬림화가 가능하다.Therefore, the heat dissipation structure according to the present invention can prevent the overall thickening of the liquid crystal panel device by the heat dissipation portion and the heat conduction tube, resulting in slimness.

또한, 본 발명에서는 하나의 방열부에 열전도관을 통해 복수의 방열기판과 연결하여 하나의 방열부를 통해 복수의 방열기판의 방열이 도모되도록 구성함으로써, 구조의 간소화 및 부피의 축소를 이룩하고 있다.In addition, in the present invention, by connecting the plurality of heat dissipation substrates through a heat conduction tube to one heat dissipation unit, the heat dissipation of the plurality of heat dissipation substrates is achieved through one heat dissipation unit, thereby simplifying the structure and reducing the volume.

이와 더불어, 본 발명에서와 같이 방열기판과 방열부 및 열전도관을 단일 모듈형태로 구성하면, 방열기판과 방열판 및 열전도관이 액정패널과의 조립과정에 모듈형태로 탑재되므로 조립과 유지 보수에 따른 편리성이 도모될 수 있다.In addition, when the heat dissipation board, the heat dissipation unit, and the heat conduction tube are configured in a single module form as in the present invention, the heat dissipation board, the heat dissipation plate, and the heat conduction tube are mounted in a module form during the assembling process with the liquid crystal panel. Convenience can be achieved.

도 1은 본 발명에서 바람직한 실시예로 제안하고 있는 방열구조를 마련한 백라이트 유닛 및 액정패널의 조립상태를 보여주는 것이고,
도 2는 본 발명에서 바람직한 실시예로 제안하고 있는 방열구조를 백라이트 유닛의 발광기판의 방열상태를 보여주는 작용상태도이며,
도 3은 본 발명에서 바람직한 실시예로 제안하고 있는 방열구조를 구성하는 방열기판 모듈의 전체 구성을 보여주는 것이다.1 illustrates an assembly state of a backlight unit and a liquid crystal panel having a heat dissipation structure proposed as a preferred embodiment of the present invention.
2 is a functional state diagram showing a heat dissipation state of the light emitting substrate of the backlight unit with a heat dissipation structure proposed as a preferred embodiment in the present invention,
Figure 3 shows the overall configuration of the heat radiation board module constituting the heat radiation structure proposed as a preferred embodiment in the present invention.

이하, 첨부된 도면을 참조하여 본 발명에서 바람직한 실시예로 제안하고 있는 LED 백라이트 유닛의 발광기판 방열구조를 상세히 설명하기로 한다.Hereinafter, a light emitting substrate heat dissipation structure of the LED backlight unit proposed as a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명에서 바람직한 실시예로 제안하고 있는 방열구조를 마련한 LED 백라이트 유닛과 액정패널의 조립상태를 보여주는 것이고, 도 2는 본 발명에서 바람직한 실시예로 제안하고 있는 방열구조를 LED 백라이트 유닛의 발광기판의 방열상태를 보여주는 작용상태도이며, 도 3은 본 발명에서 바람직한 실시예로 제안하고 있는 방열구조를 구성하는 방열기판 모듈의 전체 구성을 보여주는 것이다.1 shows an assembled state of an LED backlight unit and a liquid crystal panel provided with a heat dissipation structure proposed as a preferred embodiment of the present invention, Figure 2 is a heat dissipation structure proposed as a preferred embodiment of the present invention of the LED backlight unit 3 is an operational state diagram showing a heat dissipation state of the light emitting substrate, and FIG. 3 shows the entire structure of the heat dissipation substrate module constituting the heat dissipation structure proposed in the preferred embodiment of the present invention.

본 발명에서 바람직한 실시예로 제안하고 있는 LED 백라이트 유닛의 발광기판 방열구조는, 도 1 내지 도 2에서 보는 바와 같이 고휘도의 빛을 조사하여 액정패널(12)의 휘도를 향상시키는 백라이트 유닛의 발광기판(110)과 연결되어, 발광기판(110)의 발광과정에 생성된 열기를 외부로 신속히 발산하도록 고안된 것이다.The light emitting substrate heat dissipation structure of the LED backlight unit proposed as a preferred embodiment of the present invention, the light emitting substrate of the backlight unit to improve the brightness of the liquid crystal panel 12 by irradiating high brightness light as shown in FIGS. Connected to 110, it is designed to quickly dissipate heat generated during the light emitting process of the light emitting substrate 110 to the outside.

상기 LED 백라이트 유닛은, 발광기판(110)과, 이 발광기판(110) 각각에 전류를 공급하는 인버터(미도시)를 포함하여 구성되며, 상기 발광기판(110)은 흡열 베이스(111)의 일면에 절연층이 형성된 회로부(112)가 형성되고, 이 회로부(112)에 복수의 고휘도 LED 소자(113)들이 접점을 형성하여 배치된 형태로 구성되어, 고휘도 LED 소자(113)의 점등과정에 생성된 열기는 흡열 베이스(111)로 전도된다.The LED backlight unit includes a light emitting substrate 110 and an inverter (not shown) for supplying current to each of the light emitting substrates 110, and the light emitting substrate 110 has one surface of the heat absorbing base 111. A circuit portion 112 having an insulating layer formed thereon is formed, and a plurality of high-brightness LED elements 113 are formed by forming a contact in the circuit portion 112, which is generated during the lighting process of the high-brightness LED element 113. The heated heat is conducted to the endothermic base 111.

본 실시예에서는 발광기판(110)의 흡열 베이스(111)와 회로부(112)는, 내열성과 열전도성이 우수한 알루미늄, 동, 스텐 등으로 제작하여, 고휘도 LED 소자(113)에서 생성된 열기가 회로부(112) 및 흡열 베이스(113)에 신속히 전도되도록 하고 있다.In the present embodiment, the heat absorbing base 111 and the circuit portion 112 of the light emitting substrate 110 are made of aluminum, copper, stainless steel, etc., which are excellent in heat resistance and thermal conductivity, and thus the heat generation circuit portion generated in the high-brightness LED element 113 is formed. Reference numeral 112 and the heat absorbing base 113 are quickly conducted.

그리고, 이들 발광기판(110)들은 액정패널(120)의 배면에는 적층된 상태로 복수 배치되어, 고휘도 LED 소자(113)에서 생성된 고휘도의 빛을 액정패널(120)에 조사함으로써, 액정패널(120)이 향상된 휘도를 확보하여 안정된 가독성을 갖도록 한다.In addition, the light emitting substrates 110 are disposed on the rear surface of the liquid crystal panel 120 in a stacked state, and the liquid crystal panel 120 is radiated by irradiating the liquid crystal panel 120 with high luminance light generated by the high brightness LED element 113. 120) to ensure the improved brightness to have a stable readability.

한편, 본 발명에 따른 방열구조는, 상기 발광기판(110)에 설치되어 고휘도 LED 소자(113)에서 생성되어 발광기판(110)으로 전도되어진 열기를 외부로 유도하여 신속히 발산함으로써, 고휘도 LED 소자(113)와 액정패널(120)을 포함하는 각종 전자기기의 열화를 예방하는 것이다.On the other hand, the heat dissipation structure according to the present invention, is installed on the light emitting substrate 110, the high brightness LED device (by generating a high brightness LED device 113 and conducted to the light emitting substrate 110 by conducting heat to the outside to quickly discharge, 113 and the liquid crystal panel 120 to prevent deterioration of various electronic devices.

이를 상술하자면, 각 발광기판(110)의 흡열 베이스(111), 또는 회로부(112)에 하나 이상의 열전도관(10)을 각각 연결하고, 이 열전도관(10)을 복수의 방열판(21)들이 등간격으로 배치된 방열부(20)에 관통된 상태로 고정하고 있다.In detail, one or more heat conductive tubes 10 are connected to the heat absorbing base 111 or the circuit unit 112 of each light emitting substrate 110, and the heat conductive tubes 10 are connected to a plurality of heat sinks 21. It is fixed in the state penetrated by the heat radiating part 20 arrange | positioned at intervals.

따라서, 상기 고휘도 LED 소자(113)들의 발광작용에 의해 회로부(111), 및 흡열 베이스(111)로 전도된 열기는 열전도관(10)을 따라 방열부(20)로 유도하여 전도되어, 방열판(21)을 통한 공기와의 열교환 작용을 통해 외부로 신속히 발산된다.Therefore, the heat conducted to the circuit part 111 and the heat absorbing base 111 by the light emitting action of the high brightness LED elements 113 is conducted by conducting the heat radiating part 20 along the heat conducting pipe 10 to the heat sink. It is quickly released to the outside through heat exchange action with air through 21).

이때, 상기 열전도관(10)과 방열부(20)의 방열판(21)은 내열성과 열전도성이 우수한 알루미늄, 동, 또는 스텐 등으로 제작되며, 상기 열전도관(20)과 흡열 베이스(111), 또는 회로부(112)는 용접 등을 통해 연결된다.At this time, the heat conduction plate 10 and the heat dissipation plate 21 of the heat dissipation unit 20 are made of aluminum, copper, or stainless steel having excellent heat resistance and heat conductivity, and the heat conduction tube 20 and the heat absorbing base 111, Alternatively, the circuit part 112 is connected by welding or the like.

그리고, 본 실시예에서는 상기 열전도관(10)을 가압을 통해 편판형으로 구성하는 한편, 상기 열전도관(10)을 통해 발광기판(110)과 연결된 방열부(20)를 상호 적층된 액정패널(120)과 발광기판(110)의 가장자리에 배치하여, 발열부(20)의 두께에 의해 액정 패널장치 전체의 두께가 두꺼워지는 것을 예방하고 있다.In the present embodiment, the heat conduction tube 10 is formed in a plate shape by pressurization, and the heat dissipation unit 20 connected to the light emitting substrate 110 through the heat conduction tube 10 is laminated to each other. The thickness of the entire liquid crystal panel device is prevented by the thickness of the heat generating part 20 by disposing at the edge of the 120 and the light emitting substrate 110.

*** 도면상의 미설명 부호, 130은 케이스이고, 131은 방열구임.****** Unexplained symbols in the drawing, 130 is a case, 131 is a heat sink. ***

또한 상기 방열부(110)에는, 서로 다른 발광기판(110)의 흡열 베이스(111)와 연결된 복수의 열전도관(20)이 관통되어, 하나의 방열부(110)를 통해 둘 이상의 발광기판(111)의 방열이 동시에 구현되도록 하고 있다.In addition, a plurality of heat conduction tubes 20 connected to endothermic bases 111 of different light emitting substrates 110 pass through the heat dissipating unit 110, and thus, at least two light emitting substrates 111 through one heat dissipating unit 110. ) Heat dissipation at the same time.

도면을 보면 본 실시예에서는, 액정패널(120)의 배면에 일렬로 적층되게 배치된 복수의 발광기판(110) 양편에 각각 방열부(20)를 배치하고, 이들 각 발광기판(110)의 흡열 베이스(111), 또는 회로부(112)에 방열부(20)를 관통한 복수의 열전도관(111)을 연결하여, 복수의 방열기판(10)과 한 쌍의 방열부 및 이들을 연결하는 복수의 열전도관(10)이 단일 몸체를 이룬 방열기판 모듈(100)을 형성하고 있다.Referring to the drawings, in the present embodiment, the heat dissipation portions 20 are disposed on both sides of the plurality of light emitting substrates 110 arranged in a row on the rear surface of the liquid crystal panel 120, and the heat absorbing portion of the light emitting substrates 110 is absorbed. A plurality of heat conduction pipes 111 penetrating the heat dissipation part 20 to the base 111 or the circuit part 112 to connect the plurality of heat dissipation substrates 10, a pair of heat dissipation parts, and a plurality of heat conduction connecting them. The tube 10 forms a heat dissipation substrate module 100 that forms a single body.

이와 같이 방열기판(110)과 방열부(20) 및 열전도관(30)을 단일 모듈형태로 구성하면, 방열기판과 방열판 및 열전도관이 액정패널과의 조립과정에 모듈형태로 탑재되므로, 조립과 유지 보수에 따른 편리성이 도모될 수 있다.When the heat dissipation board 110, the heat dissipation unit 20, and the heat conduction tube 30 are configured in a single module form, the heat dissipation board 110, the heat dissipation plate, and the heat conduction tube are mounted in a module form during the assembly process with the liquid crystal panel. Convenience according to maintenance can be aimed at.

이와 더불어 본 실시예에서는, 각 방열부(20)에는 방열판(21) 사이로 공기를 강제 순환시키는 냉각팬(30)을 설치하여, 방열판(21)과 공기와의 신속한 열교환이 구현되도록 하고 있다.In addition, in this embodiment, each of the heat dissipation portion 20 is provided with a cooling fan 30 for forcibly circulating air between the heat dissipation plate 21, so that the heat exchange between the heat dissipation plate 21 and the air is realized.

이와 같이 구성된 방열구조에 의해, 상기 고휘도 LED 소자(113)들의 발광과정에 생성되어 흡열 베이스(111)로 전도되어진 열기는, 열전도관(10)을 따라 발열부(20)로 전도된다. By the heat dissipation structure configured as described above, the heat generated during the light emission process of the high brightness LED elements 113 and conducted to the endothermic base 111 is conducted to the heat generating unit 20 along the heat conduction tube 10.

이후, 방열부(20)는 냉각팬(30)을 통해 강제 순환되는 공기와 방열판(21)과의 신속한 열교환을 통한 고휘도 LED 소자(113)에서 생성되어 전도되어진 열기를 강제 배출함으로써, 고휘도 LED 소자(113)에서 생성된 열기에 의해 고휘도 LED 소자(113)와 액정패널(120)을 포함하는 각 구성요소의 열화를 예방할 수 있다.Thereafter, the heat radiating unit 20 forcibly discharges hot air generated and conducted in the high brightness LED element 113 through rapid heat exchange between air forcedly circulated through the cooling fan 30 and the heat dissipation plate 21. The heat generated at 113 may prevent deterioration of each component including the high brightness LED element 113 and the liquid crystal panel 120.

10. 열전도관 20. 방열부
21. 방열판 30. 냉각팬
100. 발광기판 모듈
110. 발광기판
111. 흡열 베이스 112. 회로부
113. 고휘도 LED 120. 액정패널
130. 케이스 131. 방열구10. Heat conduction pipe 20. Heat dissipation part
21. Heat sink 30. Cooling fan
100. Light Emitting Board Module
110. Light emitting substrate
111. Endothermic base 112. Circuit part
113. High brightness LED 120. Liquid crystal panel
130.Case 131. Heat Sink

Claims (2)

복수의 고휘도 LED 소자들이 배치된 LED 백라이트 유닛의 발광기판에 설치되어, 상기 LED 발광기판에서 생성된 열기를 외부로 발산하는 것으로,
상기 LED 발광기판은 액정패널의 배면에 적층하여 복수 배치되고, 이들 각 발광기판의 흡열 베이스, 또는 회로부에는 하나 이상의 열전도관이 각각 연결되는 한편, 이 열전도관은 복수의 방열판들이 등간격으로 배치된 방열부를 관통한 상태로 고정되어, 고휘도 LED 소자들의 발광작용에 의해 흡열 베이스로 전도된 열기는 열전도관을 따라 방열부로 유도하여 전도되어서. 방열판을 통한 공기와의 열교환 작용을 통해 신속히 외부로 발산되도록 구성한 것을 특징으로 하는 LED 백라이트 유닛의 발광기판 방열구조.It is installed on the light emitting substrate of the LED backlight unit in which a plurality of high-brightness LED elements are disposed, to dissipate heat generated in the LED light emitting substrate to the outside,
The LED light emitting boards are stacked on the rear surface of the liquid crystal panel, and a plurality of heat conducting tubes are connected to the endothermic base or circuit portion of each of the light emitting substrates, respectively. It is fixed while penetrating the heat dissipation unit, and the heat conducted to the heat absorbing base by the light emitting action of the high-brightness LED elements is conducted by conducting the heat dissipation unit along the heat conduction tube. Light emitting board heat dissipation structure of the LED backlight unit, characterized in that configured to be quickly dissipated to the outside through heat exchange action with the air through the heat sink. 제 1항에 있어서, 상기 방열부에는 열전도관이 관통된 방열판 사이에 공기를 강제 순환시켜 발열판과 공기와의 신속한 열교환을 구현하는 냉각팬이 설치된 것을 특징으로 하는 LED 백라이트 유닛의 발광기판 방열구조.The heat dissipation structure of the LED backlight unit of claim 1, wherein a cooling fan is installed in the heat dissipation unit to circulate air through the heat dissipation plate through which the heat conduction tube passes, thereby enabling rapid heat exchange between the heat dissipation plate and the air.
KR1020100054090A 2010-06-08 2010-06-08 Structure of heat radiation for light emitting base plate of led back light KR20110134225A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100054090A KR20110134225A (en) 2010-06-08 2010-06-08 Structure of heat radiation for light emitting base plate of led back light

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100054090A KR20110134225A (en) 2010-06-08 2010-06-08 Structure of heat radiation for light emitting base plate of led back light

Publications (1)

Publication Number Publication Date
KR20110134225A true KR20110134225A (en) 2011-12-14

Family

ID=45501668

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100054090A KR20110134225A (en) 2010-06-08 2010-06-08 Structure of heat radiation for light emitting base plate of led back light

Country Status (1)

Country Link
KR (1) KR20110134225A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022198711A1 (en) * 2021-03-24 2022-09-29 惠州市华星光电技术有限公司 Backlight module and display device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022198711A1 (en) * 2021-03-24 2022-09-29 惠州市华星光电技术有限公司 Backlight module and display device

Similar Documents

Publication Publication Date Title
KR100982706B1 (en) Display device, light-emitting device, and solid-state light-emitting element substrate
JP5097127B2 (en) Light emitting device, display device, and solid light emitting element substrate
JP2007101766A (en) Display device
KR20070076879A (en) Liquid crystal display device module
US7237923B2 (en) Backlight unit having a cooling member
KR20070113068A (en) Heat-dissipating backlighting module for use in a flat panel display
TW201133086A (en) Liquid crystal display device
TWI324669B (en) Light modules
JP2008041638A (en) Heat dissipation device for backlight light source for flat panel display
CN103697378A (en) Backlight module and display device
US8363179B2 (en) Liquid crystal display device
JP4842390B1 (en) Illumination device and image display device including the same
KR20110016292A (en) Cooling system of lcd device
JP2009224486A (en) Led module
CN111983849A (en) LED backlight module
CN101975376B (en) Luminous source heat-dissipation structure of backlight module
JP2009152146A (en) Surface light source device and display device
KR20110134225A (en) Structure of heat radiation for light emitting base plate of led back light
KR100706756B1 (en) structure of A LCD using a peltier element
JP2011146225A (en) Light source device and backlight device equipped therewith
JP3184583U (en) Flood light equipment
KR20080029332A (en) Back light assembly and display device having the same
KR20090119405A (en) Back light unit
US9823412B2 (en) Edge type backlight module and liquid crystal display device
KR101252851B1 (en) Backlight assembly and liquid crystal display device having the same

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application