CN219065942U - Backlight module and display device - Google Patents

Abstract

The utility model relates to the technical field of display and discloses a backlight module and a display device. The backlight module comprises a back plate, a lamp strip, a light guide plate and a heat radiation structure sleeved on the lamp strip, wherein the heat radiation structure comprises a heat radiation substrate and a plurality of heat radiation bridges uniformly distributed on the heat radiation substrate, openings are formed in positions, corresponding to the LED lamps, of the heat radiation substrate, the heat radiation bridges are arranged between two adjacent openings, two ends, close to the lamp strip, of each heat radiation bridge are respectively connected with two adjacent LED lamps, each heat radiation bridge is provided with a first heat radiation cavity, and heat radiation liquid is arranged in each first heat radiation cavity. According to the LED lamp heat dissipation device, the heat dissipation area is increased by arranging the heat dissipation bridge connected with the LED lamp, the heat dissipation efficiency of the LED lamp is improved, and meanwhile, heat generated by the LED lamp can be absorbed more quickly through conversion of heat dissipation liquid between liquid state and gas state, so that the heat dissipation efficiency is further improved.

Description

Backlight module and display device

Technical Field

The utility model relates to the technical field of display, in particular to a backlight module and a display device.

Background

With the development of technology, the volume requirement of the display is becoming thinner, and the conventional Cathode Ray Tube (CRT) has advantages of large volume and power consumption, so that the flat panel displays such as the liquid crystal display, the plasma display and the electroluminescent display are becoming mainstream, wherein the liquid crystal display has advantages of low operation voltage, no radiation, light weight and small volume, and has become a mainstream product of the market. The liquid crystal display panel in the liquid crystal display structure does not emit light, and the liquid crystal display panel is positioned above the backlight module and needs to provide a light source by using the backlight module.

The backlight module is divided into a direct type backlight module and a side-in type backlight module according to the position of the light source. The direct type backlight module consists of a back plate which is arranged in parallel with the liquid crystal display panel and hundreds of LED lamp beads which are even more uniformly distributed on the back plate, so that backlight can be uniformly transmitted to the whole display panel, the direct type backlight module has a better display effect, and the direct type backlight module is widely applied to the field of display terminals such as mobile phones and tablet computers. In the prior art, LEDs are distributed on a lamp panel at certain intervals, and the LEDs are separated by a rubber frame cup. Along with the improvement of the brightness and resolution of the liquid crystal display module, the number and the power consumption of the LEDs are synchronously improved, so that the LEDs generate more heat, and the service life, the brightness, the chromaticity, the electrical parameters, the reliability and the like of the LEDs are influenced. The existing solution generally adopts an aluminum back plate or a cast aluminum back plate to improve the heat dissipation efficiency of the backlight module, and the heat dissipation efficiency is constant because of the fixed heat conductivity coefficient of the metal material, so that when the power consumption of the LED is increased, the LED still can be damaged due to overheating caused by low heat dissipation efficiency, and the service life of the product is further influenced.

Therefore, in order to solve the above-mentioned problems, a backlight module and a display device are needed to improve the heat dissipation efficiency of the direct type backlight module.

Disclosure of Invention

The utility model aims to provide a backlight module and a display device, so as to improve the heat dissipation efficiency of a direct type backlight module.

In order to achieve the above objective, an embodiment of the present utility model provides a backlight module, including a back plate, a light bar, and a light guide plate, where the back plate includes a bottom plate and a plurality of side plates surrounding the bottom plate, the bottom plate and the plurality of side plates form an accommodating space, the light guide plate and the light bar are located in the accommodating space, the light bar is located between the light guide plate and the bottom plate, and the light bar includes a light plate parallel to the bottom plate and a plurality of LED lamps uniformly distributed on the light plate; the backlight module is characterized by further comprising a heat radiation structure sleeved on the lamp strip, wherein the heat radiation structure comprises a heat radiation substrate and a plurality of heat radiation bridges evenly distributed on the heat radiation substrate, openings are formed in positions, corresponding to the LED lamps, of the heat radiation substrate, the heat radiation bridges are arranged between two adjacent openings, two ends, close to the lamp panel, of each heat radiation bridge are respectively connected with two adjacent LED lamps, each heat radiation bridge is provided with a first heat radiation cavity, and heat radiation liquid is arranged in the first heat radiation cavity.

Further, each LED lamp is welded with the lamp panel through two first welding legs respectively.

Further, two ends of the heat dissipation bridge, which are close to the lamp panel, are respectively provided with a second welding leg, and the second welding legs are respectively and correspondingly connected with the first welding legs between the two adjacent LED lamps.

Further, a plurality of heat conducting rods are further arranged at two ends, close to the lamp panel, of the heat radiating bridge, and the heat conducting rods are connected with the heat radiating liquid and the second welding legs.

Further, two opposite ends of the heat dissipation substrate are respectively provided with a limiting structure, the limiting structure is provided with a second heat dissipation cavity, and heat dissipation liquid is arranged in the second heat dissipation cavity; the limiting structure is clamped on the side plate provided with the limiting hole.

Further, a reflective coating is disposed on a surface of the heat dissipation substrate facing the light guide plate.

Further, a heat conducting layer is arranged between the lamp panel and the bottom plate.

Further, the backlight module further comprises an optical film, and the optical film is arranged on one side, far away from the bottom plate, of the light guide plate.

Further, the optical film includes a diffusion sheet, a prism sheet, and a brightness enhancing film.

The embodiment of the utility model also provides a display device which comprises a display panel and the backlight module.

The utility model has the beneficial effects that the backlight module and the display device comprise a back plate, a lamp strip, a light guide plate and a heat radiation structure sleeved on the lamp strip, wherein the heat radiation structure comprises a heat radiation substrate and a plurality of heat radiation bridges uniformly distributed on the heat radiation substrate, openings are arranged at positions of the heat radiation substrate corresponding to the LED lamps, the heat radiation bridges are arranged between two adjacent openings, two ends of the heat radiation bridges, which are close to the lamp plate, are respectively connected with the two adjacent LED lamps, each heat radiation bridge is provided with a first heat radiation cavity, and heat radiation liquid is arranged in the first heat radiation cavity. According to the LED lamp heat dissipation device, the heat dissipation area is increased by arranging the heat dissipation bridge connected with the LED lamp, the heat dissipation efficiency of the LED lamp is improved, and meanwhile, heat generated by the LED lamp can be absorbed more quickly through conversion of heat dissipation liquid between liquid state and gas state, so that the heat dissipation efficiency is further improved.

Drawings

FIG. 1 is a schematic cross-sectional view of a backlight module according to an embodiment of the utility model;

FIG. 2 is a top view of a heat dissipation structure according to an embodiment of the present utility model sleeved on a light bar;

FIG. 3 is a top view of a heat dissipating structure according to an embodiment of the present utility model;

fig. 4 is a schematic partial cross-sectional structure of a heat dissipation structure sleeved on a light bar according to an embodiment of the utility model.

Detailed Description

In the description of the present utility model, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more. In addition, the term "include" and any variations thereof are intended to cover a non-exclusive inclusion.

Directional terms, such as "upper", "lower", "inner", "outer", etc., are merely referring to the directions of the attached drawings. Accordingly, directional terminology is used to describe and understand the utility model and is not limiting of the utility model. In the drawings, like elements are designated by like reference numerals.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In order to facilitate understanding of the technical scheme of the present utility model, the technical scheme of the present utility model will be described in detail with reference to the accompanying drawings and specific embodiments.

Fig. 1 is a schematic cross-sectional structure of a backlight module according to an embodiment of the utility model, fig. 2 is a top view of a heat dissipation structure provided by an embodiment of the utility model sleeved on a light bar, and fig. 3 is a top view of a heat dissipation structure provided by an embodiment of the utility model, as shown in fig. 1-3, the embodiment of the utility model provides a backlight module, which includes a back plate 10, a light bar 20 and a light guide plate 50, wherein the back plate 10 includes a bottom plate 11 and a plurality of side plates 12 surrounding the bottom plate 11, the bottom plate 11 and the plurality of side plates 12 form an accommodating space, the light guide plate 50 and the light bar 20 are located in the accommodating space, wherein the light bar 20 is located between the light guide plate 50 and the bottom plate 11, and the light bar 20 includes a light plate 21 parallel to the bottom plate 11 and a plurality of LED lamps 22 uniformly distributed on the light plate 21. By providing a plurality of LED lamps 22, the brightness of the display device can be ensured. The plurality of LED lamps 22 are electrically connected with the lamp panel 21, and the lamp panel 21 may be, but not limited to, an FPC (Flexible Printed Circuit, flexible circuit board) having advantages of high wiring density, light weight, thin thickness, good flexibility, etc. Preferably, the backlight module further includes a heat dissipation structure 30 sleeved on the light bar 20, and the heat dissipation structure 30 includes a heat dissipation substrate 33 and a plurality of heat dissipation bridges 31 uniformly distributed on the heat dissipation substrate 33. In order to make the heat dissipation structure 30 cover the light bar 20 without interfering with the LED lamps 22, an opening 34 is provided at a position of the heat dissipation substrate 33 corresponding to the LED lamps 22, a heat dissipation bridge 31 is provided between two adjacent openings 34, two ends of the heat dissipation bridge 31 near the light bar 21 are respectively connected with two adjacent LED lamps 22, a first heat dissipation cavity 311 is provided in each heat dissipation bridge 31, and a heat dissipation liquid 312 is provided in the first heat dissipation cavity 311. The heat generated by the LED lamp 22 is absorbed by the conversion of the heat dissipation liquid 312 between the liquid state and the gas state, thereby improving the heat dissipation efficiency.

According to the LED lamp heat dissipation device, the heat dissipation area is increased by arranging the heat dissipation bridge connected with the LED lamp, the heat dissipation efficiency of the LED lamp is improved, and meanwhile, heat generated by the LED lamp can be absorbed more quickly through conversion of heat dissipation liquid between liquid state and gas state, so that the heat dissipation efficiency is further improved.

The working process of the heat dissipation liquid 312 is as follows: after the backlight module is started, the LED lamp 22 starts to emit light and generate a large amount of heat, and the heat dissipation structure 30 is sleeved on the lamp strip 20, the heat dissipation structure 30 comprises a heat dissipation substrate 33 provided with an opening at a position corresponding to the LED lamp 22, and a heat dissipation bridge 31 disposed between two adjacent openings 34, and two ends of the heat dissipation bridge 31, which are close to the lamp panel 21, are respectively connected with two adjacent LED lamps 22, wherein a first heat dissipation cavity 311 is disposed in the heat dissipation bridge 31, and a heat dissipation liquid 312 is disposed in the first heat dissipation cavity 311. At this time, the heat dissipating liquid 312 in the first heat dissipating cavity 311 is connected to the two adjacent LED lamps 22 through the two ends of the heat dissipating bridge 31 near the lamp panel 21 to absorb the heat generated by the LED lamps 22, and the volatile liquid is vaporized and absorbs the heat when heated due to the extremely easy vaporization of the heat dissipating liquid 312, and the gas is condensed at the position with lower temperature to recover the liquid state, so as to be recycled. Through the heat dissipation liquid 312 continuously conducts heat in the cyclic conversion process of the liquid gas and the liquid, the outward heat conduction of the LED lamp 22 is greatly promoted, the temperature of the LED lamp 22 is prevented from being higher, and the overall heat dissipation effect of the backlight module is promoted.

Specifically, the first heat dissipation cavity 311 stores heat dissipation liquid 312 vaporized by heating, and the liquid stored in the first heat dissipation cavity 311 adopts a solvent with low boiling point and high volatility.

Further, fig. 4 is a schematic diagram of a partial cross-sectional structure of a heat dissipation structure sleeved on a light bar according to an embodiment of the utility model. As shown in fig. 1-4, each LED lamp 22 is welded to the lamp panel 21 by two first fillets 23. Two ends of the heat-dissipating bridge 31, which are close to the lamp panel 21, are respectively provided with a second soldering leg 35, and the second soldering legs 35 are respectively correspondingly connected with the first soldering legs 23 between two adjacent LED lamps 22. That is, the heat dissipation bridge 31 in the present embodiment communicates with the first fillets of the LED lamps 22 located at both sides of the heat dissipation bridge 31 through the second fillets 35 provided at both ends to conduct out the heat generated by the LED lamps 22.

In some preferred embodiments, in order to further conduct heat away from the first fillets 23 and improve heat dissipation efficiency, a plurality of heat conducting rods 36 are further disposed at two ends of the heat dissipating bridge 31 near the lamp panel 21, and the plurality of heat conducting rods 36 connect the heat dissipating liquid 312 with the second fillets 35. To direct heat generated by the LED lamp 22 into the low boiling point heat dissipating liquid 312. The low boiling point heat dissipating liquid 312 absorbs heat to be vaporized into steam, so that the steam fills the first heat dissipating cavity 311 quickly, and the heat transfer can be absorbed more quickly.

Further, with continued reference to fig. 1, two opposite ends of the heat dissipation substrate 33 are respectively provided with a limiting structure 32, the limiting structure 32 is provided with a second heat dissipation cavity 321, and the second heat dissipation cavity 321 is also provided with a heat dissipation liquid 312. The limiting structure 32 is engaged with the side plate 12 provided with the limiting hole 121. In this embodiment, the limiting structures 32 engaged with the side plates 12 are disposed at opposite ends of the heat dissipation substrate 33, and the heat dissipation liquid 312 is filled in the limiting structures, so that the heat generated by the LED lamp 22 can be conducted to the external environment through the heat dissipation substrate 33 and the limiting structures 32. The heat dissipation liquid 312 in the second heat dissipation cavity 321 is heated and vaporized to become steam, heat is quickly transferred to the external environment through the circulation of the steam in the second heat dissipation cavity 321, and the steam is condensed to become liquid at a position with lower temperature, so that the circulation and the transfer of the heat are completed in the second heat dissipation cavity 321 repeatedly, and the whole system is a sustainable heat dissipation structure which truly realizes the circulation. Because the vaporization and condensation process of the liquid can absorb and release a large amount of heat, the heat dissipation efficiency is extremely high, the heat generated by the LED lamp 22 is uniformly transferred to the side plate of the back plate through the limiting structure 33, the heat dissipation liquid 312 and the heat dissipation substrate and finally dissipated into the air, so that the whole temperature of the backlight module is relatively low, and the experience of heating for a user is not generated.

Further, a heat conducting layer 40 is disposed between the lamp panel 21 and the bottom plate 11, and the heat conducting layer 40 is made of a thermal interface material, wherein the thermal interface material is a bonding and curing heat conducting glue, a phase change material or a heat conducting elastomer material, preferably a heat conducting gel or a silica gel. By adopting the thermal interface materials such as the thermal conductive gel or the silica gel to form the thermal conductive layer 40, the lamp strip 20 is fixed on the bottom plate 11 of the back plate 10, so that the heat generated by the LED lamp 22 can be effectively transferred to the bottom plate 11 through the thermal conductive layer 40, and the heat can be quickly transferred to the external environment and finally emitted into the air.

In some preferred embodiments, in order to improve the light utilization efficiency, a reflective coating 37 is disposed on the surfaces of the heat dissipation substrate 33 and the heat dissipation bridge 31 facing the light guide plate 50. The reflective coating 37 is a white insulating coating and can be used to replace the reflective cup of the prior art.

Further, the backlight module provided by the embodiment of the utility model further comprises an optical film 60. The linear light source emitted from the LED lamp 22 forms a surface light source through the mesh points provided in the light guide plate 50, and forms a uniform surface light source for picture display by diffusion of the optical film 60 provided at a side of the light guide plate 30 remote from the bottom plate 11. The optical film 60 may be designed with different functions according to specific requirements, for example, the optical film 60 in this embodiment includes a diffusion sheet, a prism sheet, a brightness enhancing film, etc., and the optical film 60 is mainly used to fully diffuse or polymerize light emitted from the light guide plate or increase the utilization rate, and the number of layers of the diffusion sheet, the prism sheet, the brightness enhancing film, etc. may be designed into multiple layers according to specific requirements, which is not limited herein.

The embodiment of the utility model also provides a display device which comprises a display panel and the backlight module provided by the embodiment. The display device provided in this embodiment has the same beneficial effects as the backlight module, and can improve the heat dissipation efficiency of the direct type backlight module, which is not described herein.

In specific implementation, the display device provided by the embodiment of the utility model can be any product or component with a display function, such as a mobile phone, a tablet personal computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.

The above examples and drawings are not intended to limit the form or form of the present utility model, and any suitable variations or modifications thereof by those skilled in the art should be construed as not departing from the scope of the present utility model.

Claims (10)

1. The backlight module comprises a back plate, a light bar and a light guide plate, wherein the back plate comprises a bottom plate and a plurality of side plates which are arranged on the bottom plate in a surrounding mode, the bottom plate and the side plates form an accommodating space, the light guide plate and the light bar are positioned in the accommodating space, and the light bar is positioned between the light guide plate and the bottom plate; the backlight module is characterized by further comprising a heat radiation structure sleeved on the lamp strip, wherein the heat radiation structure comprises a heat radiation substrate and a plurality of heat radiation bridges evenly distributed on the heat radiation substrate, openings are formed in positions, corresponding to the LED lamps, of the heat radiation substrate, the heat radiation bridges are arranged between two adjacent openings, two ends, close to the lamp panel, of each heat radiation bridge are respectively connected with two adjacent LED lamps, each heat radiation bridge is provided with a first heat radiation cavity, and heat radiation liquid is arranged in the first heat radiation cavity.

2. A backlight module according to claim 1, wherein each LED lamp is welded to the lamp panel by two first fillets.

3. The backlight module according to claim 2, wherein two ends of the heat dissipation bridge, which are close to the lamp panel, are respectively provided with a second soldering leg, and the second soldering legs are respectively connected with the first soldering legs between two adjacent LED lamps correspondingly.

4. A backlight module according to claim 3, wherein a plurality of heat conducting bars are further arranged at two ends of the heat dissipating bridge, which are close to the lamp panel, and the heat conducting bars connect the heat dissipating liquid with the second soldering leg.

5. The backlight module according to claim 1, wherein two opposite ends of the heat dissipation substrate are respectively provided with a limit structure, the limit structure is provided with a second heat dissipation cavity, and heat dissipation liquid is arranged in the second heat dissipation cavity; the limiting structure is clamped on the side plate provided with the limiting hole.

6. The backlight module according to claim 1, wherein the heat dissipation substrate and the heat dissipation bridge are provided with a reflective coating on a surface facing the light guide plate.

7. A backlight module according to claim 1, wherein a heat conducting layer is arranged between the lamp panel and the bottom plate.

8. The backlight module according to claim 1, further comprising an optical film disposed on a side of the light guide plate away from the bottom plate.

9. The backlight module according to claim 8, wherein the optical film comprises a diffusion sheet, a prism sheet and a brightness enhancement film.

10. A display device comprising a display panel and a backlight module according to any one of claims 1-9.

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