CN218936302U - LED heat dissipation device - Google Patents
LED heat dissipation device Download PDFInfo
- Publication number
- CN218936302U CN218936302U CN202223495907.9U CN202223495907U CN218936302U CN 218936302 U CN218936302 U CN 218936302U CN 202223495907 U CN202223495907 U CN 202223495907U CN 218936302 U CN218936302 U CN 218936302U
- Authority
- CN
- China
- Prior art keywords
- light source
- bottom plate
- led
- heat sink
- source switching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title description 39
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 44
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- 239000010949 copper Substances 0.000 claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052742 iron Inorganic materials 0.000 claims abstract description 22
- 230000001681 protective effect Effects 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 3
- 230000006641 stabilisation Effects 0.000 abstract description 4
- 238000011105 stabilization Methods 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
In order to overcome the problems of long preheating time and high temperature after stabilization of the traditional high-power LED, the utility model provides an LED heat radiating device, which comprises a light source switching bottom plate, wherein a heat conducting bottom plate is fixedly arranged at the back of the light source, a plurality of copper heat conducting fins are arranged above the heat conducting bottom plate, 4 structural support columns are respectively and fixedly arranged at four corners of the back of the light source, the copper heat conducting fins and the heat conducting bottom plate are both positioned at the inner side of the structural support columns, a heat radiating fan is fixedly connected at the inner side of the structural support columns, a light source heat radiating bottom plate is fixedly arranged above the structural support columns, a light source switching bottom plate is arranged above the light source heat radiating bottom plate, and a protection iron net is fixedly arranged above the light source switching bottom plate; according to the utility model, the copper radiating fins are adopted, the radiating fan is added, the temperature of the copper radiating module after being stabilized is reduced to 30 ℃, the long-time working temperature is lowered, the preheating time is shortened, and the service life of the high-power LED chip is prolonged.
Description
Technical Field
The utility model relates to the technical field of optical detection, in particular to an LED heat dissipation device.
Background
At present, high-power LEDs which can be purchased in the market adopt an aluminum heat dissipation module, the specific heat capacity of the aluminum heat dissipation module is large, a passive heat dissipation mode is adopted, and the temperature of a stable bottom plate is 50 ℃. However, this heat dissipation solution has a great problem in that the preheating time is extremely long, approximately 1 hour is required to reach a stable level, and such long preheating time is intolerable for a device requiring a detection speed; therefore, how to overcome the above-mentioned technical problems and drawbacks becomes an important problem to be solved.
Disclosure of Invention
Aiming at the problems of long preheating time and high temperature after stabilization of the existing high-power LED, the utility model provides an LED heat dissipation device.
The technical scheme adopted by the utility model for solving the technical problems is as follows:
the utility model provides an LED heat dissipation device which comprises a structural support column, copper heat conduction sheets, a heat conduction bottom plate, a heat dissipation fan and a light source, wherein the back of the light source is connected with the heat conduction bottom plate, one surface of the heat conduction bottom plate, which is away from the light source, is provided with a plurality of copper heat conduction sheets, the structural support column is provided with a plurality of heat conduction sheets, the structural support columns are respectively connected to the back of the light source, the copper heat conduction sheets and the heat conduction bottom plate are both positioned on the inner sides of the structural support columns, and the inner sides of the structural support columns are fixedly connected with the heat dissipation fan.
Optionally, the light source heat dissipation device further comprises a light source switching bottom plate and a light source heat dissipation bottom plate, wherein the light source switching bottom plate is arranged above the structural support column, and the light source switching bottom plate is arranged above the light source heat dissipation bottom plate.
Optionally, the light source radiating bottom plate and the light source switching bottom plate are rectangular, and round holes are dug in the center of the light source radiating bottom plate and the light source switching bottom plate.
Optionally, the LED lamp further comprises a protective iron net, wherein the protective iron net is arranged above the light source switching bottom plate.
Optionally, the protection iron net is circular, and its area is greater than the round hole, the peripheral symmetry of protection iron net is provided with 4 mounts, protection iron net passes through mount fixed mounting is in the light source switching bottom plate the top of round hole.
Optionally, the heat dissipation fan is fixedly installed on the lower surface of the light source heat dissipation bottom plate.
Optionally, four corners of the light source radiating bottom plate and the light source switching bottom plate are fixedly connected with the upper parts of 4 structural support columns through bolts.
Optionally, the heat conducting bottom plate is connected with the back of the light source through a set screw.
Optionally, a heat conductive silicone grease is coated between the heat conductive bottom plate and the back of the light source.
Optionally, a mounting hole is arranged above the light source switching base plate and is used for connecting the optical-mechanical system.
According to the LED heat dissipation device provided by the utility model, the copper heat dissipation fins are adopted, the copper heat melting is small, the heat dissipation is fast, and compared with the aluminum heat dissipation module, the temperature of the copper heat dissipation module after stabilization is reduced to 30 ℃, so that the preheating time is reduced, the long-time working temperature is also reduced, the service life of a high-power LED chip is prolonged, meanwhile, the preheating time for reaching a stable value of power can be greatly shortened by adding the heat dissipation fan, and the fluctuation value of the power after preheating is obviously reduced.
Drawings
Fig. 1 is an exploded view of an LED heat sink according to an embodiment of the present utility model;
fig. 2 is a schematic structural diagram of an LED heat dissipating device according to an embodiment of the present utility model;
reference numerals in the drawings of the specification are as follows:
1-a light source switching base plate; 2-a light source heat dissipation base plate; 3-structural support columns; 4-copper heat conductive sheet; 5-a heat conducting bottom plate; 6-a heat radiation fan; 7-protecting an iron net; 8-light source.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects solved by the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "side", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the utility model. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present utility model, it should be noted that, unless explicitly stated and limited otherwise, the term "connected" should be interpreted broadly, and for example, it may be a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1, in an embodiment, the application provides an LED heat dissipation device, including structure support column 3, copper conducting strip 4, heat conduction bottom plate 5, radiator fan 6 and light source 8, the back of light source 8 is connected heat conduction bottom plate 5, heat conduction bottom plate 5 deviates from a plurality of copper conducting strip 4 are installed to the one side of light source 8, structure support column 3 is provided with a plurality of structure support column 3 is connected respectively at light source 8 back, copper conducting strip 4 with heat conduction bottom plate 5 all is located a plurality of structure support column 3's inboard, a plurality of structure support column 3's inboard fixedly connected with radiator fan 6.
The structure support column 3 is provided with 4, and fixed mounting respectively is in four angles at the back of the light source 8, copper conducting strip 4 with heat conduction bottom plate 5 all is located the inboard of structure support column 3, the inboard fixedly connected with of structure support column 3 radiator fan 6.
In this application, the backplate of light source 8 is the rectangular plate, and its shape is the rectangle, and its four corners all is provided with the engaging lug, the engaging lug be used for with 4 the bottom fixed connection of structure support column 3 plays the supporting role simultaneously, and can guarantee radiator fan 6 rotates the in-process stability.
The copper heat conducting fin 4 is made of copper, the copper is small in specific heat melting and fast in heat dissipation, compared with an aluminum heat dissipation module, the temperature of the copper heat dissipation module after stabilization is reduced to 30 ℃, meanwhile, the preheating time is reduced, the long-time working temperature is reduced, and the service life of the high-power led chip is prolonged.
By adding the cooling fan 6, the preheating time for the power to reach a stable value can be greatly shortened, and the fluctuation value of the power after preheating is obviously reduced. Meanwhile, the cooling fan 6 adopted in the application has lower noise in the running process while guaranteeing the air quantity.
As shown in fig. 1, in an embodiment, the light source heat dissipation device further includes a light source transfer base plate 1 and a light source heat dissipation base plate 2, wherein the light source transfer base plate 1 is disposed above the structural support columns 3, and the light source transfer base plate 2 is installed above the light source heat dissipation base plate 1.
In this application, the fixed top of structure support column 3 is provided with light source heat dissipation bottom plate 2, install light source switching bottom plate 1 in the top of light source heat dissipation bottom plate 2.
As shown in fig. 1, in an embodiment, the light source heat dissipation base plate 2 and the light source switching base plate 1 are both rectangular, and circular holes are all dug in the center positions.
In this application, the cooling fan 6 works, so that heat generated by the copper heat conducting fin 4 is timely exchanged with air, and heat is dissipated through the round hole, so that preheating time is reduced, and long-time working temperature is reduced.
As shown in fig. 1, in an embodiment, the light source switching base plate 1 further comprises a protective iron net 7, and the protective iron net 7 is arranged above the light source switching base plate 1.
In this application, protection iron net 7 fixed mounting is in light source switching bottom plate 1 the top of round hole has avoided the people carelessly with hand or other article pass through the round hole with radiator fan 6 contact causes the injured problem of personnel, has improved the security performance of equipment.
As shown in fig. 1, in an embodiment, the protection iron net 7 is circular, the area of the protection iron net is larger than that of the circular hole, 4 fixing frames are symmetrically arranged on the periphery of the protection iron net 7, and the protection iron net 7 is fixedly installed above the circular hole of the light source switching base plate 1 through the fixing frames.
In this application, protection iron net 7 fixed mounting is in light source switching bottom plate 1 the top of round hole, mount fixed mounting is in light source switching bottom plate 1 around the round hole, protection iron net 7's setting has avoided the people carelessly with hand or other article pass through the round hole with radiator fan 6 contacts, causes the injured problem of personnel, has improved the security performance of equipment.
As shown in fig. 1, in an embodiment, the heat dissipation fan 6 is fixedly mounted on the lower surface of the light source heat dissipation base plate 2.
In this application, radiator fan 6's upper surface is fixed the lower surface of light source heat dissipation bottom plate 2, simultaneously, radiator fan 6's four corners is fixed respectively the inboard of structure support column 3 to guarantee the stability in the fan rotation in-process, also guaranteed radiator fan 6 in-service shake can not influence optical system's stability.
As shown in fig. 1, in an embodiment, four corners of the light source heat dissipation base plate 2 and the light source switching base plate 1 are fixedly connected with the upper sides of 4 structural support columns 3 through bolts.
In this application, the light source heat dissipation bottom plate 2 with the four corners of light source switching bottom plate 1 with 4 the top of structure support column 3 is through bolt fixed connection, thereby will light source heat dissipation bottom plate 2 light source switching bottom plate 1 with structure support column 3 connects as a whole, thereby guarantees the stability of fan rotation in-process, has also guaranteed the shake in the radiator fan 6 operation can not influence optical system's stability.
In one embodiment, as shown in fig. 1, the back of the heat conducting base plate 5 and the back of the light source 8 are connected by a set screw.
In this application, will through the holding screw heat conduction bottom plate 5 with the back of light source 8 makes its laminating nature better, thereby is favorable to heat conduction bottom plate 5 will the heat transfer that light source 8 produced comes out.
As shown in fig. 1, in one embodiment, a thermally conductive silicone is coated between the thermally conductive base plate 5 and the back of the light source 8.
In this application, the heat conduction silicone grease is coated between the heat conduction bottom plate 5 and the back of the light source 8, so that the heat generated by the light source 8 can be conducted out faster by the heat conduction bottom plate 5.
As shown in fig. 1, in an embodiment, a mounting hole is disposed above the light source adapting base plate 1, and is used for connecting with the optical-mechanical system.
The operation process of the device is that the cooling fan switch is firstly turned on, wind blows on the copper heat conducting fin and the heat conducting bottom plate, and then the switch of the light source is turned on, so that the device can be operated. In the use process, the scheme can transfer heat generated on the led chip to the air well, and has the advantages of high speed and high stability.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.
Claims (10)
1. An LED heat sink, characterized in that: including structure support column, copper conducting strip, heat conduction bottom plate, radiator fan and light source, the back connection of light source the heat conduction bottom plate, the heat conduction bottom plate deviates from the one side of light source is installed a plurality of copper conducting strip, the structure support column is provided with a plurality ofly, and is a plurality of the structure support column is connected respectively the light source back, copper conducting strip with the heat conduction bottom plate all is located a plurality of the inboard of structure support column, a plurality of the inboard fixedly connected with of structure support column radiator fan.
2. The LED heat sink of claim 1, wherein: the LED lamp further comprises a light source switching bottom plate and a light source radiating bottom plate, wherein the light source switching bottom plate is arranged above the structural support column, and the light source switching bottom plate is arranged above the light source radiating bottom plate.
3. The LED heat sink of claim 2, wherein: the light source radiating bottom plate and the light source switching bottom plate are rectangular, and round holes are dug in the center of the light source radiating bottom plate and the light source switching bottom plate.
4. A LED heat sink as set forth in claim 3, wherein: the LED lamp further comprises a protective iron net, wherein the protective iron net is arranged above the light source switching base plate.
5. The LED heatsink of claim 4, wherein: the protection iron net is circular, the area of the protection iron net is larger than that of the circular hole, 4 fixing frames are symmetrically arranged on the periphery of the protection iron net, and the protection iron net is fixedly installed above the circular hole of the light source switching bottom plate through the fixing frames.
6. The LED heat sink of claim 2, wherein: the lower surface of the light source radiating bottom plate is fixedly provided with the radiating fan.
7. The LED heat sink of claim 2, wherein: the four corners of the light source radiating bottom plate and the light source switching bottom plate are fixedly connected with the upper sides of the structural support columns through bolts.
8. The LED heat sink of claim 1, wherein: the heat conduction bottom plate is connected with the back of the light source through a set screw.
9. The LED heat sink of claim 1, wherein: and heat conduction silicone grease is coated between the heat conduction bottom plate and the back of the light source.
10. The LED heat sink of claim 2, wherein: and a mounting hole is formed above the light source switching base plate and used for connecting an optical-mechanical system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223495907.9U CN218936302U (en) | 2022-12-27 | 2022-12-27 | LED heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223495907.9U CN218936302U (en) | 2022-12-27 | 2022-12-27 | LED heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218936302U true CN218936302U (en) | 2023-04-28 |
Family
ID=86083089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223495907.9U Active CN218936302U (en) | 2022-12-27 | 2022-12-27 | LED heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218936302U (en) |
-
2022
- 2022-12-27 CN CN202223495907.9U patent/CN218936302U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7674011B2 (en) | LED lamp having a vapor chamber for dissipating heat generated by LEDS of the LED lamp | |
| US7810950B2 (en) | LED lamp having a vapor chamber for dissipating heat generated by LEDS of the LED lamp | |
| CN215813709U (en) | Projector heat dissipation structure and projector | |
| CN218936302U (en) | LED heat dissipation device | |
| JP4438526B2 (en) | Power component cooling system | |
| KR20110065864A (en) | Led cooler | |
| CN209993862U (en) | Heat abstractor and fiber laser | |
| CN204554425U (en) | A kind of efficiency heat-radiating LED lamp | |
| CN113376939A (en) | Light valve heat abstractor and totally enclosed LCD projection machine | |
| CN213362389U (en) | Special high-power lamps and lanterns of sports lighting | |
| CN111120975A (en) | Heat dissipation device based on combination of PCM fin heat pipe integrated plate and semiconductor refrigeration piece and implementation method thereof | |
| CN220140048U (en) | PGU heat abstractor for HUD | |
| CN212204418U (en) | Outdoor lamp shell capable of dissipating heat quickly | |
| CN213936174U (en) | High-efficiency heat-dissipation rectifier diode | |
| CN113242677B (en) | DC/DC power module overheat protection device | |
| CN212809780U (en) | Memory convenient to heat dissipation | |
| CN218995870U (en) | Radiating structure of projector | |
| CN211040525U (en) | Paster L ED double-color adjusting lamp bead | |
| CN210745828U (en) | Heat dissipation device for electronic component | |
| CN218770826U (en) | Cooling system for internal ring temperature of power supply equipment | |
| CN219352231U (en) | External subassembly of quick-witted case heat dissipation | |
| CN213513375U (en) | Integrated honeycomb type LED lamp device of high-power zinc oxide light-emitting diode | |
| CN217790150U (en) | Radiating assembly structure with high heat dissipation performance | |
| CN221203102U (en) | Power MOS module heat radiation structure of oil cooling controller | |
| CN212544245U (en) | Good heat dissipation's miniature module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: 518000, 1st Floor, Building B5, Taohuayuan Science and Technology Innovation Ecological Park, Tiegang Community, Xixiang Street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Yibi Technology Co.,Ltd. Address before: Room 425, Block C, Bao'an New Generation Information Technology Industrial Park, No. 3, North Second Lane, Chuangye Second Road, 28 Dalang Community, Xin'an Street, Bao'an District, Shenzhen, Guangdong 518000 Patentee before: Shenzhen Yibi Technology Co.,Ltd. |
|
| CP02 | Change in the address of a patent holder |