JPS6418148U - - Google Patents
Info
- Publication number
- JPS6418148U JPS6418148U JP11326587U JP11326587U JPS6418148U JP S6418148 U JPS6418148 U JP S6418148U JP 11326587 U JP11326587 U JP 11326587U JP 11326587 U JP11326587 U JP 11326587U JP S6418148 U JPS6418148 U JP S6418148U
- Authority
- JP
- Japan
- Prior art keywords
- cylindrical
- targets
- vacuum chamber
- sputtering device
- sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005192 partition Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000010408 film Substances 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Description
第１図は、本考案の一実施例を示す図で、ａは
縦断面図、ｂは側面図、第２図は、従来のものを
示す図で、ａは縦断面図、ｂは平面図である。
尚、図中１０は真空チヤンバー、１１，１２は
ターゲツト、１３は仕切板、１４は基板ホルダー
、１５は回転導入部、１６は真空パイプである。
Fig. 1 is a diagram showing an embodiment of the present invention, in which a is a vertical sectional view, b is a side view, and Fig. 2 is a diagram showing a conventional one, in which a is a vertical sectional view and b is a plan view. It is. In the figure, 10 is a vacuum chamber, 11 and 12 are targets, 13 is a partition plate, 14 is a substrate holder, 15 is a rotating introduction part, and 16 is a vacuum pipe.
Claims (1)
において、真空チヤンバーを円筒形とし、その周
上に適宜の角度をおいて複数のターゲツトを仕切
板を隔てて配設すると共に前記円筒形真空チヤン
バーの中心部に円筒形の基板ホルダーを回転可能
に配設してなることを特徴とするスパツター装置
。 (2) 前記複数のターゲツトを１２０゜の角度で
配設してなることを特徴とする実用新案登録請求
の範囲第１項記載のスパツター装置。[Claims for Utility Model Registration] (1) In a multilayer film sputtering device used for thin film formation, the vacuum chamber is cylindrical, and a plurality of targets are arranged on the circumference at appropriate angles with a partition plate in between. A sputtering apparatus characterized in that a cylindrical substrate holder is rotatably disposed in the center of the cylindrical vacuum chamber. (2) The sputtering device according to claim 1, wherein the plurality of targets are arranged at an angle of 120°.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11326587U JPS6418148U (en) | 1987-07-23 | 1987-07-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11326587U JPS6418148U (en) | 1987-07-23 | 1987-07-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6418148U true JPS6418148U (en) | 1989-01-30 |
Family
ID=31352942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11326587U Pending JPS6418148U (en) | 1987-07-23 | 1987-07-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6418148U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS607191A (en) * | 1983-06-24 | 1985-01-14 | 三容真空工業株式会社 | Method of producing circuit board and device therefor |
-
1987
- 1987-07-23 JP JP11326587U patent/JPS6418148U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS607191A (en) * | 1983-06-24 | 1985-01-14 | 三容真空工業株式会社 | Method of producing circuit board and device therefor |