JPS6416642U - - Google Patents

Info

Publication number
JPS6416642U
JPS6416642U JP11045187U JP11045187U JPS6416642U JP S6416642 U JPS6416642 U JP S6416642U JP 11045187 U JP11045187 U JP 11045187U JP 11045187 U JP11045187 U JP 11045187U JP S6416642 U JPS6416642 U JP S6416642U
Authority
JP
Japan
Prior art keywords
spring
heat dissipation
semiconductor
leaf spring
fixing part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11045187U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0617309Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11045187U priority Critical patent/JPH0617309Y2/ja
Publication of JPS6416642U publication Critical patent/JPS6416642U/ja
Application granted granted Critical
Publication of JPH0617309Y2 publication Critical patent/JPH0617309Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Mounting Components In General For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP11045187U 1987-07-17 1987-07-17 半導体の放熱装置 Expired - Lifetime JPH0617309Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11045187U JPH0617309Y2 (ja) 1987-07-17 1987-07-17 半導体の放熱装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11045187U JPH0617309Y2 (ja) 1987-07-17 1987-07-17 半導体の放熱装置

Publications (2)

Publication Number Publication Date
JPS6416642U true JPS6416642U (enrdf_load_html_response) 1989-01-27
JPH0617309Y2 JPH0617309Y2 (ja) 1994-05-02

Family

ID=31347623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11045187U Expired - Lifetime JPH0617309Y2 (ja) 1987-07-17 1987-07-17 半導体の放熱装置

Country Status (1)

Country Link
JP (1) JPH0617309Y2 (enrdf_load_html_response)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010079337A (ko) * 2001-07-07 2001-08-22 유동수 전력용 반도체소자를 히트씽크에 고정시키는 고정구
JP2002343910A (ja) * 2001-05-17 2002-11-29 Tetsuji Kataoka ヒートシンク並びにその製造方法
CN104853566A (zh) * 2014-02-13 2015-08-19 欧姆龙汽车电子株式会社 电子部件的固定结构和固定电子部件的方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002343910A (ja) * 2001-05-17 2002-11-29 Tetsuji Kataoka ヒートシンク並びにその製造方法
KR20010079337A (ko) * 2001-07-07 2001-08-22 유동수 전력용 반도체소자를 히트씽크에 고정시키는 고정구
CN104853566A (zh) * 2014-02-13 2015-08-19 欧姆龙汽车电子株式会社 电子部件的固定结构和固定电子部件的方法
JP2015153888A (ja) * 2014-02-13 2015-08-24 オムロンオートモーティブエレクトロニクス株式会社 電子部品の固定構造および固定方法
CN104853566B (zh) * 2014-02-13 2018-03-27 欧姆龙汽车电子株式会社 电子部件的固定结构和固定电子部件的方法

Also Published As

Publication number Publication date
JPH0617309Y2 (ja) 1994-05-02

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