JPS6416642U - - Google Patents
Info
- Publication number
- JPS6416642U JPS6416642U JP11045187U JP11045187U JPS6416642U JP S6416642 U JPS6416642 U JP S6416642U JP 11045187 U JP11045187 U JP 11045187U JP 11045187 U JP11045187 U JP 11045187U JP S6416642 U JPS6416642 U JP S6416642U
- Authority
- JP
- Japan
- Prior art keywords
- spring
- heat dissipation
- semiconductor
- leaf spring
- fixing part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 230000017525 heat dissipation Effects 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11045187U JPH0617309Y2 (ja) | 1987-07-17 | 1987-07-17 | 半導体の放熱装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11045187U JPH0617309Y2 (ja) | 1987-07-17 | 1987-07-17 | 半導体の放熱装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6416642U true JPS6416642U (US20090163788A1-20090625-C00002.png) | 1989-01-27 |
JPH0617309Y2 JPH0617309Y2 (ja) | 1994-05-02 |
Family
ID=31347623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11045187U Expired - Lifetime JPH0617309Y2 (ja) | 1987-07-17 | 1987-07-17 | 半導体の放熱装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0617309Y2 (US20090163788A1-20090625-C00002.png) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010079337A (ko) * | 2001-07-07 | 2001-08-22 | 유동수 | 전력용 반도체소자를 히트씽크에 고정시키는 고정구 |
JP2002343910A (ja) * | 2001-05-17 | 2002-11-29 | Tetsuji Kataoka | ヒートシンク並びにその製造方法 |
CN104853566A (zh) * | 2014-02-13 | 2015-08-19 | 欧姆龙汽车电子株式会社 | 电子部件的固定结构和固定电子部件的方法 |
-
1987
- 1987-07-17 JP JP11045187U patent/JPH0617309Y2/ja not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002343910A (ja) * | 2001-05-17 | 2002-11-29 | Tetsuji Kataoka | ヒートシンク並びにその製造方法 |
KR20010079337A (ko) * | 2001-07-07 | 2001-08-22 | 유동수 | 전력용 반도체소자를 히트씽크에 고정시키는 고정구 |
CN104853566A (zh) * | 2014-02-13 | 2015-08-19 | 欧姆龙汽车电子株式会社 | 电子部件的固定结构和固定电子部件的方法 |
JP2015153888A (ja) * | 2014-02-13 | 2015-08-24 | オムロンオートモーティブエレクトロニクス株式会社 | 電子部品の固定構造および固定方法 |
CN104853566B (zh) * | 2014-02-13 | 2018-03-27 | 欧姆龙汽车电子株式会社 | 电子部件的固定结构和固定电子部件的方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0617309Y2 (ja) | 1994-05-02 |