JPS6416641U - - Google Patents

Info

Publication number
JPS6416641U
JPS6416641U JP1987111807U JP11180787U JPS6416641U JP S6416641 U JPS6416641 U JP S6416641U JP 1987111807 U JP1987111807 U JP 1987111807U JP 11180787 U JP11180787 U JP 11180787U JP S6416641 U JPS6416641 U JP S6416641U
Authority
JP
Japan
Prior art keywords
printed wiring
chip
wiring board
semiconductor chip
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987111807U
Other languages
English (en)
Japanese (ja)
Other versions
JPH041738Y2 (fi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987111807U priority Critical patent/JPH041738Y2/ja
Publication of JPS6416641U publication Critical patent/JPS6416641U/ja
Application granted granted Critical
Publication of JPH041738Y2 publication Critical patent/JPH041738Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
JP1987111807U 1987-07-20 1987-07-20 Expired JPH041738Y2 (fi)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987111807U JPH041738Y2 (fi) 1987-07-20 1987-07-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987111807U JPH041738Y2 (fi) 1987-07-20 1987-07-20

Publications (2)

Publication Number Publication Date
JPS6416641U true JPS6416641U (fi) 1989-01-27
JPH041738Y2 JPH041738Y2 (fi) 1992-01-21

Family

ID=31350183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987111807U Expired JPH041738Y2 (fi) 1987-07-20 1987-07-20

Country Status (1)

Country Link
JP (1) JPH041738Y2 (fi)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH075801U (ja) * 1993-06-22 1995-01-27 将一 林 自動車用ホイールのセンターロツク装置
JP2008047908A (ja) * 2006-08-14 2008-02-28 Chien-Chung Chen 発光モジュールおよびその製造プロセス

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH075801U (ja) * 1993-06-22 1995-01-27 将一 林 自動車用ホイールのセンターロツク装置
JP2008047908A (ja) * 2006-08-14 2008-02-28 Chien-Chung Chen 発光モジュールおよびその製造プロセス

Also Published As

Publication number Publication date
JPH041738Y2 (fi) 1992-01-21

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