JPS6415983A - Thin film transistor - Google Patents

Thin film transistor

Info

Publication number
JPS6415983A
JPS6415983A JP17269287A JP17269287A JPS6415983A JP S6415983 A JPS6415983 A JP S6415983A JP 17269287 A JP17269287 A JP 17269287A JP 17269287 A JP17269287 A JP 17269287A JP S6415983 A JPS6415983 A JP S6415983A
Authority
JP
Japan
Prior art keywords
active layer
layer
forming
insulator
tft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17269287A
Other languages
Japanese (ja)
Inventor
Koji Mori
Hirobumi Watanabe
Shuya Abe
Reiko Nabeshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Research Institute of General Electronics Co Ltd
Ricoh Co Ltd
Original Assignee
Ricoh Research Institute of General Electronics Co Ltd
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Research Institute of General Electronics Co Ltd, Ricoh Co Ltd filed Critical Ricoh Research Institute of General Electronics Co Ltd
Priority to JP17269287A priority Critical patent/JPS6415983A/en
Publication of JPS6415983A publication Critical patent/JPS6415983A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thin Film Transistor (AREA)

Abstract

PURPOSE:To obtain a TFT wherein effective and uniform H2 treatment of an active layer is enabled without necessitating other process, and high mobility and high speed driving are possible, by a method wherein the active layer on an insulating layer is formed by diffusing hydrogen in the insulating layer by heating at the time of forming a transistor. CONSTITUTION:On a substrate 1, the following are laminated in order; an insulating layer 2 containing H, an active layer 3, a gate oxide film 4 and a gate electrode 5. Then an interlayer insulating film 6 is stacked, and a metal wiring 7 is arranged to constitute a TFT. For the insulator layer 2 containing H, Si system insulator such as Si:N:H, SiC:H, SiN:H Si:O:H, etc., is used. Besides the above one, Al2O3 or B2O3 system insulator containing H or H atom as OH radical is preferably used. At the time of high temperature heating in the process of, e.g., forming the active layer 3, forming the gate oxide film 4, forming the gate electrode 5, etc., H in the insulator layer 2 containing H diffuses into the active layer 3, and passivate the active layer.
JP17269287A 1987-07-09 1987-07-09 Thin film transistor Pending JPS6415983A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17269287A JPS6415983A (en) 1987-07-09 1987-07-09 Thin film transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17269287A JPS6415983A (en) 1987-07-09 1987-07-09 Thin film transistor

Publications (1)

Publication Number Publication Date
JPS6415983A true JPS6415983A (en) 1989-01-19

Family

ID=15946585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17269287A Pending JPS6415983A (en) 1987-07-09 1987-07-09 Thin film transistor

Country Status (1)

Country Link
JP (1) JPS6415983A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0395938A (en) * 1989-09-07 1991-04-22 Canon Inc Manufacture of semiconductor device
US5403760A (en) * 1990-10-16 1995-04-04 Texas Instruments Incorporated Method of making a HgCdTe thin film transistor
US6884698B1 (en) 1994-02-23 2005-04-26 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device with crystallization of amorphous silicon
JP2011124596A (en) * 2011-02-01 2011-06-23 Mitsubishi Electric Corp Method of manufacturing semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0395938A (en) * 1989-09-07 1991-04-22 Canon Inc Manufacture of semiconductor device
US5403760A (en) * 1990-10-16 1995-04-04 Texas Instruments Incorporated Method of making a HgCdTe thin film transistor
US6884698B1 (en) 1994-02-23 2005-04-26 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device with crystallization of amorphous silicon
JP2011124596A (en) * 2011-02-01 2011-06-23 Mitsubishi Electric Corp Method of manufacturing semiconductor device

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