JPS6413746A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS6413746A
JPS6413746A JP17021587A JP17021587A JPS6413746A JP S6413746 A JPS6413746 A JP S6413746A JP 17021587 A JP17021587 A JP 17021587A JP 17021587 A JP17021587 A JP 17021587A JP S6413746 A JPS6413746 A JP S6413746A
Authority
JP
Japan
Prior art keywords
layer
contact hole
metal
barrier metal
electrode pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17021587A
Other languages
Japanese (ja)
Inventor
Shuji Watanabe
Kazuya Kubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP17021587A priority Critical patent/JPS6413746A/en
Publication of JPS6413746A publication Critical patent/JPS6413746A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To improve the element yield free from shortcircuiting by forming an aluminum-silicon layer and an inserted metal over the entire surface of a chip in this order to make it an electrode pattern, and forming a hole pattern for metal bump, wherein the inserted metal layer is exposed to the electrode pattern. CONSTITUTION:An Al-Si layer and a barrier metal (inserted metal) layer are successively deposited in this order over the entire surface of a semiconductor chip 1, and an electrode pattern is formed thereon by means of dry etching, etc. Then, an insulating film 10 is formed onto the barrier metal layer 9 by depositing SiO2 using the CVD method, and a contact hole 10a for bump and a contact hole 10b for bonding wire are formed, whereby the barrier metal layer 9 is exposed to the contact holes 10a and 10b. Then, an metal bump 11 for In is formed onto the contact hole 10a by the lift-off method and a bonding wire 7 is formed on the part of the barrier metal layer 9 exposed due to the contact hole 10b.
JP17021587A 1987-07-07 1987-07-07 Manufacture of semiconductor device Pending JPS6413746A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17021587A JPS6413746A (en) 1987-07-07 1987-07-07 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17021587A JPS6413746A (en) 1987-07-07 1987-07-07 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS6413746A true JPS6413746A (en) 1989-01-18

Family

ID=15900804

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17021587A Pending JPS6413746A (en) 1987-07-07 1987-07-07 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6413746A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05299702A (en) * 1992-04-17 1993-11-12 Stanley Electric Co Ltd Led array

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4869471A (en) * 1971-12-22 1973-09-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4869471A (en) * 1971-12-22 1973-09-20

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05299702A (en) * 1992-04-17 1993-11-12 Stanley Electric Co Ltd Led array

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