JPS6413727U - - Google Patents
Info
- Publication number
- JPS6413727U JPS6413727U JP1987110156U JP11015687U JPS6413727U JP S6413727 U JPS6413727 U JP S6413727U JP 1987110156 U JP1987110156 U JP 1987110156U JP 11015687 U JP11015687 U JP 11015687U JP S6413727 U JPS6413727 U JP S6413727U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- transparent substrate
- display
- substrate
- connection electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987110156U JPS6413727U (US20050065096A1-20050324-C00034.png) | 1987-07-17 | 1987-07-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987110156U JPS6413727U (US20050065096A1-20050324-C00034.png) | 1987-07-17 | 1987-07-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6413727U true JPS6413727U (US20050065096A1-20050324-C00034.png) | 1989-01-24 |
Family
ID=31347054
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987110156U Pending JPS6413727U (US20050065096A1-20050324-C00034.png) | 1987-07-17 | 1987-07-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6413727U (US20050065096A1-20050324-C00034.png) |
-
1987
- 1987-07-17 JP JP1987110156U patent/JPS6413727U/ja active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6413727U (US20050065096A1-20050324-C00034.png) | ||
JPS6430535U (US20050065096A1-20050324-C00034.png) | ||
JPS6429830U (US20050065096A1-20050324-C00034.png) | ||
JPS5853159U (ja) | 非晶質半導体装置 | |
JPS5889956U (ja) | 発光ダイオ−ド素子 | |
JPS6046024U (ja) | 光電式エンコ−ダ用受光素子 | |
JPH01146559U (US20050065096A1-20050324-C00034.png) | ||
JPS6071151U (ja) | 太陽電池 | |
JPS5899850U (ja) | フオトダイオ−ド | |
JPS5931253U (ja) | フオトカプラ− | |
JPS63125826U (US20050065096A1-20050324-C00034.png) | ||
JPS5944059U (ja) | 発光ダイオ−ド表示器 | |
JPS6122373U (ja) | 光電変換装置 | |
JPS6016568U (ja) | 光起電力装置 | |
JPS61179589U (US20050065096A1-20050324-C00034.png) | ||
JPS5853160U (ja) | 非晶質半導体装置 | |
JPS6155354U (US20050065096A1-20050324-C00034.png) | ||
JPS5935984U (ja) | 薄膜elデイスプレイ | |
JPS61182585U (US20050065096A1-20050324-C00034.png) | ||
JPS6138958U (ja) | 光起電力素子 | |
JPS58195456U (ja) | 配線接続構造 | |
JPS6169828U (US20050065096A1-20050324-C00034.png) | ||
JPS58124965U (ja) | 多素子型光電変換装置 | |
JPS6180597U (US20050065096A1-20050324-C00034.png) | ||
JPS60135632U (ja) | 受光装置 |