JPS6413130U - - Google Patents
Info
- Publication number
- JPS6413130U JPS6413130U JP10771187U JP10771187U JPS6413130U JP S6413130 U JPS6413130 U JP S6413130U JP 10771187 U JP10771187 U JP 10771187U JP 10771187 U JP10771187 U JP 10771187U JP S6413130 U JPS6413130 U JP S6413130U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- alignment mark
- view
- semiconductor substrate
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
Description
第１図ａは本考案を用いた一導電型半導体基板
の平面図、第１図ｂはスクライブラインの断面図
、第１図ｃはアライメントマーク周辺の拡大図、
第２図ａは従来の基板の平面図、第２図ｂは従来
のスクライブラインの断面図、第３図は長尺読み
取り可能な半導体装置の斜視図である。
１……一導電型半導体基板、２……半導体装置
、３……スクライブライン、４……アライメント
マーク。
FIG. 1a is a plan view of a semiconductor substrate of one conductivity type using the present invention, FIG. 1b is a cross-sectional view of a scribe line, and FIG. 1c is an enlarged view of the vicinity of an alignment mark.
FIG. 2a is a plan view of a conventional substrate, FIG. 2b is a sectional view of a conventional scribe line, and FIG. 3 is a perspective view of a long-length readable semiconductor device. 1... Semiconductor substrate of one conductivity type, 2... Semiconductor device, 3... Scribe line, 4... Alignment mark.
Claims (1)
断する目印として前記半導体装置を製造するため
に用いた薄膜で形成したアライメントマークを有
する半導体基板。 A semiconductor substrate having an alignment mark formed on a surface portion of a thin film used for manufacturing the semiconductor device as a mark for cutting the semiconductor device with high precision.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10771187U JPS6413130U (en) | 1987-07-14 | 1987-07-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10771187U JPS6413130U (en) | 1987-07-14 | 1987-07-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6413130U true JPS6413130U (en) | 1989-01-24 |
Family
ID=31342368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10771187U Pending JPS6413130U (en) | 1987-07-14 | 1987-07-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6413130U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5610944A (en) * | 1979-07-06 | 1981-02-03 | Mitsubishi Electric Corp | Division of semiconductor device |
| JPS6151845A (en) * | 1984-08-21 | 1986-03-14 | Matsushita Electronics Corp | Dicing of semiconductor device |
-
1987
- 1987-07-14 JP JP10771187U patent/JPS6413130U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5610944A (en) * | 1979-07-06 | 1981-02-03 | Mitsubishi Electric Corp | Division of semiconductor device |
| JPS6151845A (en) * | 1984-08-21 | 1986-03-14 | Matsushita Electronics Corp | Dicing of semiconductor device |