JPS62151749U - - Google Patents
Info
- Publication number
- JPS62151749U JPS62151749U JP3839986U JP3839986U JPS62151749U JP S62151749 U JPS62151749 U JP S62151749U JP 3839986 U JP3839986 U JP 3839986U JP 3839986 U JP3839986 U JP 3839986U JP S62151749 U JPS62151749 U JP S62151749U
- Authority
- JP
- Japan
- Prior art keywords
- snap groove
- ceramic wafer
- utility
- scope
- same position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
第1図はこの考案の実施例のセラミツクウエフ
アにおける表面を示し、第2図は同じく裏面の面
図を示し、第3図は同じく縦断面図である。
1……セラミツクウエフア、2……角穴、3…
…丸穴、4……表面スナツプ溝、5……裏面スナ
ツプ溝、6……セラミツク基板。
FIG. 1 shows the front surface of a ceramic wafer according to an embodiment of this invention, FIG. 2 shows a plan view of the back surface, and FIG. 3 shows a longitudinal sectional view. 1...ceramic wafer, 2...square hole, 3...
...Round hole, 4...Snap groove on the front surface, 5...Snap groove on the back surface, 6...Ceramic substrate.
Claims (1)
置には不連続のスナツプ溝を設けてなるセラミツ
クウエフア。 A ceramic wafer with a continuous snap groove on one side and a discontinuous snap groove on the other side at the same position.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986038399U JPH0517887Y2 (en) | 1986-03-18 | 1986-03-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986038399U JPH0517887Y2 (en) | 1986-03-18 | 1986-03-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62151749U true JPS62151749U (en) | 1987-09-26 |
JPH0517887Y2 JPH0517887Y2 (en) | 1993-05-13 |
Family
ID=30850605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986038399U Expired - Lifetime JPH0517887Y2 (en) | 1986-03-18 | 1986-03-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0517887Y2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02119246A (en) * | 1988-10-28 | 1990-05-07 | Shindengen Electric Mfg Co Ltd | Semiconductor device and manufacture thereof |
JP2000068414A (en) * | 1998-08-24 | 2000-03-03 | Ngk Spark Plug Co Ltd | Manufacture of lead-less package |
JP2008544549A (en) * | 2005-06-22 | 2008-12-04 | フリースケール セミコンダクター インコーポレイテッド | Chemical die unification technique |
JP2015023095A (en) * | 2013-07-17 | 2015-02-02 | コーア株式会社 | Manufacturing method of chip resistor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60183747A (en) * | 1984-03-01 | 1985-09-19 | Ngk Spark Plug Co Ltd | Manufacture of electrolytic chip carrier provided with beveling |
-
1986
- 1986-03-18 JP JP1986038399U patent/JPH0517887Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60183747A (en) * | 1984-03-01 | 1985-09-19 | Ngk Spark Plug Co Ltd | Manufacture of electrolytic chip carrier provided with beveling |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02119246A (en) * | 1988-10-28 | 1990-05-07 | Shindengen Electric Mfg Co Ltd | Semiconductor device and manufacture thereof |
JP2000068414A (en) * | 1998-08-24 | 2000-03-03 | Ngk Spark Plug Co Ltd | Manufacture of lead-less package |
JP2008544549A (en) * | 2005-06-22 | 2008-12-04 | フリースケール セミコンダクター インコーポレイテッド | Chemical die unification technique |
JP2015023095A (en) * | 2013-07-17 | 2015-02-02 | コーア株式会社 | Manufacturing method of chip resistor |
CN105393316A (en) * | 2013-07-17 | 2016-03-09 | 兴亚株式会社 | Chip-resistor manufacturing method |
Also Published As
Publication number | Publication date |
---|---|
JPH0517887Y2 (en) | 1993-05-13 |