JPS6413129U - - Google Patents
Info
- Publication number
- JPS6413129U JPS6413129U JP1987107993U JP10799387U JPS6413129U JP S6413129 U JPS6413129 U JP S6413129U JP 1987107993 U JP1987107993 U JP 1987107993U JP 10799387 U JP10799387 U JP 10799387U JP S6413129 U JPS6413129 U JP S6413129U
- Authority
- JP
- Japan
- Prior art keywords
- lead conductor
- pattern
- conductor
- conductor pattern
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 2
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987107993U JPH0526746Y2 (US20100223739A1-20100909-C00025.png) | 1987-07-14 | 1987-07-14 | |
| EP88306454A EP0299768A3 (en) | 1987-07-14 | 1988-07-14 | Tape carrier for semiconductor chips |
| US07/219,218 US4949155A (en) | 1987-07-14 | 1988-07-14 | Tape carrier for semiconductor chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987107993U JPH0526746Y2 (US20100223739A1-20100909-C00025.png) | 1987-07-14 | 1987-07-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6413129U true JPS6413129U (US20100223739A1-20100909-C00025.png) | 1989-01-24 |
| JPH0526746Y2 JPH0526746Y2 (US20100223739A1-20100909-C00025.png) | 1993-07-07 |
Family
ID=14473261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987107993U Expired - Lifetime JPH0526746Y2 (US20100223739A1-20100909-C00025.png) | 1987-07-14 | 1987-07-14 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4949155A (US20100223739A1-20100909-C00025.png) |
| EP (1) | EP0299768A3 (US20100223739A1-20100909-C00025.png) |
| JP (1) | JPH0526746Y2 (US20100223739A1-20100909-C00025.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03129746A (ja) * | 1989-07-21 | 1991-06-03 | Toshiba Corp | 半導体装置 |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5237201A (en) * | 1989-07-21 | 1993-08-17 | Kabushiki Kaisha Toshiba | TAB type semiconductor device and method of manufacturing the same |
| JPH07123133B2 (ja) * | 1990-08-13 | 1995-12-25 | 株式会社東芝 | フィルムキャリア構造 |
| JP2665424B2 (ja) * | 1992-02-07 | 1997-10-22 | タバイエスペック株式会社 | パッケージ搬送装置及びパッケージテスト装置 |
| JP2812627B2 (ja) * | 1992-10-30 | 1998-10-22 | 三菱電機株式会社 | テープキャリア、半導体装置試験方法及び装置 |
| JP3387726B2 (ja) * | 1996-04-10 | 2003-03-17 | 松下電器産業株式会社 | 部品実装用基板とその製造方法およびモジュールの製造方法 |
| MY138743A (en) * | 1996-05-13 | 2009-07-31 | Mitsui Mining & Smelting Co | High tensile strength electrodeposited copper foil and the production process of the same |
| JP3482850B2 (ja) * | 1997-12-08 | 2004-01-06 | セイコーエプソン株式会社 | 半導体装置及びその製造方法、回路基板並びに電子機器 |
| US6372526B1 (en) * | 1998-04-06 | 2002-04-16 | Semiconductor Components Industries Llc | Method of manufacturing semiconductor components |
| JP3484365B2 (ja) * | 1999-01-19 | 2004-01-06 | シャープ株式会社 | 半導体装置用パッケージ、この半導体装置用パッケージのテスト時に使用するプローブカード、および、このプローブカードを用いたパッケージのテスト方法 |
| US6915566B2 (en) * | 1999-03-01 | 2005-07-12 | Texas Instruments Incorporated | Method of fabricating flexible circuits for integrated circuit interconnections |
| US6359233B1 (en) * | 1999-10-26 | 2002-03-19 | Intel Corporation | Printed circuit board multipack structure having internal gold fingers and multipack and printed circuit board formed therefrom, and methods of manufacture thereof |
| US6436517B1 (en) * | 2000-05-08 | 2002-08-20 | Irwin Zahn | Continuous molded electronic circuits |
| US20060081968A1 (en) * | 2004-10-15 | 2006-04-20 | Bai Shwang S | Semiconductor package |
| US7679003B2 (en) * | 2005-05-24 | 2010-03-16 | Nec Electronics Corporation | Carrier tape |
| US20080024917A1 (en) * | 2006-02-24 | 2008-01-31 | John Hynes | Holographic magnetic stripe demetalization security |
| AU2006338593B2 (en) * | 2006-02-24 | 2012-02-02 | Opsec Security Group Inc. | Method of reducing electro-static discharge (ESD) from conductors on insulators |
| EP1928024A1 (fr) * | 2006-12-01 | 2008-06-04 | Axalto SA | Film-support pour modules à puce électronique, lequel est adapté au contrôle automatique de câblage et procédé de fabrication de modules à puce électronique |
| DE102010047912A1 (de) | 2010-10-11 | 2012-04-12 | Polylc Gmbh & Co. Kg | Überspannungsschutz für elektrisch leitfähige Strukturen |
| CN103473593B (zh) * | 2012-06-05 | 2018-10-19 | 德昌电机(深圳)有限公司 | 智能卡、智能卡接触垫载板及其制造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6117737U (ja) * | 1984-07-06 | 1986-02-01 | 日本電気株式会社 | 半導体装置 |
| JPS6117752U (ja) * | 1984-07-05 | 1986-02-01 | シャープ株式会社 | テ−プキヤリア半導体装置 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3689991A (en) * | 1968-03-01 | 1972-09-12 | Gen Electric | A method of manufacturing a semiconductor device utilizing a flexible carrier |
| CH599025A5 (US20100223739A1-20100909-C00025.png) * | 1976-04-23 | 1978-05-12 | Grapha Holding Ag | |
| US4209355A (en) * | 1978-07-26 | 1980-06-24 | National Semiconductor Corporation | Manufacture of bumped composite tape for automatic gang bonding of semiconductor devices |
| DE3234745C2 (de) * | 1982-09-20 | 1986-03-06 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Handhabung von filmmontierten integrierten Schaltkreisen und Vorrichtung zu seiner Durchführung |
| JPS59103361A (ja) * | 1983-09-21 | 1984-06-14 | Hitachi Ltd | 樹脂封止型半導体装置用リ−ドフレ−ム |
| US4736236A (en) * | 1984-03-08 | 1988-04-05 | Olin Corporation | Tape bonding material and structure for electronic circuit fabrication |
| JPS60198850A (ja) * | 1984-03-23 | 1985-10-08 | Nec Corp | リ−ド・フレ−ム |
| DD238175A3 (de) * | 1984-05-02 | 1986-08-13 | Zeiss Jena Veb Carl | Einrichtung zur schwingungsdaempfung in vakuumsystemen |
| EP0213575B1 (en) * | 1985-08-23 | 1992-10-21 | Nec Corporation | Method of manufacturing a semiconductor device employing a film carrier tape |
| JPS62150728A (ja) * | 1985-12-25 | 1987-07-04 | Hitachi Ltd | テ−プキヤリアおよびそれを用いた半導体装置 |
| US4721993A (en) * | 1986-01-31 | 1988-01-26 | Olin Corporation | Interconnect tape for use in tape automated bonding |
| US4689875A (en) * | 1986-02-13 | 1987-09-01 | Vtc Incorporated | Integrated circuit packaging process |
| US4822989A (en) * | 1986-05-21 | 1989-04-18 | Hitachi, Ltd. | Semiconductor device and method of manufacturing thereof |
-
1987
- 1987-07-14 JP JP1987107993U patent/JPH0526746Y2/ja not_active Expired - Lifetime
-
1988
- 1988-07-14 EP EP88306454A patent/EP0299768A3/en not_active Ceased
- 1988-07-14 US US07/219,218 patent/US4949155A/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6117752U (ja) * | 1984-07-05 | 1986-02-01 | シャープ株式会社 | テ−プキヤリア半導体装置 |
| JPS6117737U (ja) * | 1984-07-06 | 1986-02-01 | 日本電気株式会社 | 半導体装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03129746A (ja) * | 1989-07-21 | 1991-06-03 | Toshiba Corp | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0299768A3 (en) | 1989-09-06 |
| JPH0526746Y2 (US20100223739A1-20100909-C00025.png) | 1993-07-07 |
| EP0299768A2 (en) | 1989-01-18 |
| US4949155A (en) | 1990-08-14 |
