JPS6411334A - Opener of semiconductor package - Google Patents

Opener of semiconductor package

Info

Publication number
JPS6411334A
JPS6411334A JP16671587A JP16671587A JPS6411334A JP S6411334 A JPS6411334 A JP S6411334A JP 16671587 A JP16671587 A JP 16671587A JP 16671587 A JP16671587 A JP 16671587A JP S6411334 A JPS6411334 A JP S6411334A
Authority
JP
Japan
Prior art keywords
liquid
semiconductor packages
packings
packages
acceptors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16671587A
Other languages
Japanese (ja)
Inventor
Mitsuharu Wakasugi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamato Scientific Co Ltd
Original Assignee
Yamato Scientific Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamato Scientific Co Ltd filed Critical Yamato Scientific Co Ltd
Priority to JP16671587A priority Critical patent/JPS6411334A/en
Publication of JPS6411334A publication Critical patent/JPS6411334A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To improve the efficiency of dissolution work of semiconductor packages by spraying liquid for dissolving the packages towards the semiconductor packages which are set to a plurality of fixtures with a plurality of spraying devices. CONSTITUTION:A plurality of semiconductor packages to be dissolved are set on packings 4 and once pumps 10 are driven to start the work after opening the opening of the packings 4, liquid 9 which is heated up to an adequate temperature at the inside of a tank 8 passes through a conduit 11 and is sprayed from respective nozzles 6 of liquid acceptors 5 to respective bases of a plurality of the semiconductor packages 2 through the openings 3 of the packings 4 located on the nozzles. Sprayed liquid falls in the liquid acceptors 5 and are returned from discharge ports 7 to the tank 8 through the conduit 12. And only specific packages are also dissolved by driving only specific pumps.
JP16671587A 1987-07-03 1987-07-03 Opener of semiconductor package Pending JPS6411334A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16671587A JPS6411334A (en) 1987-07-03 1987-07-03 Opener of semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16671587A JPS6411334A (en) 1987-07-03 1987-07-03 Opener of semiconductor package

Publications (1)

Publication Number Publication Date
JPS6411334A true JPS6411334A (en) 1989-01-13

Family

ID=15836416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16671587A Pending JPS6411334A (en) 1987-07-03 1987-07-03 Opener of semiconductor package

Country Status (1)

Country Link
JP (1) JPS6411334A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3453920A1 (en) 2017-08-28 2019-03-13 JTEKT Corporation Ball screw device, method of manufacturing ball screw device, and steering system including ball screw device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61237070A (en) * 1985-04-12 1986-10-22 Matsushita Electric Works Ltd Sample adjustor used for fault analysis of semiconductor or the like

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61237070A (en) * 1985-04-12 1986-10-22 Matsushita Electric Works Ltd Sample adjustor used for fault analysis of semiconductor or the like

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3453920A1 (en) 2017-08-28 2019-03-13 JTEKT Corporation Ball screw device, method of manufacturing ball screw device, and steering system including ball screw device

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